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MSB709-RT1 の電気的特性と機能

MSB709-RT1のメーカーはON Semiconductorです、この部品の機能は「Small Signal Plastic Pnp」です。


製品の詳細 ( Datasheet PDF )

部品番号 MSB709-RT1
部品説明 Small Signal Plastic Pnp
メーカ ON Semiconductor
ロゴ ON Semiconductor ロゴ 




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MSB709-RT1 Datasheet, MSB709-RT1 PDF,ピン配置, 機能
MSB709-RT1
Preferred Device
PNP General Purpose
Amplifier Transistor
Surface Mount
MAXIMUM RATINGS (TA = 25°C)
Rating
Collector–Base Voltage
Collector–Emitter Voltage
Emitter–Base Voltage
Collector Current – Continuous
Collector Current – Peak
THERMAL CHARACTERISTICS
Characteristic
Power Dissipation
Junction Temperature
Storage Temperature
Symbol
V(BR)CBO
V(BR)CEO
V(BR)EBO
IC
IC(P)
Value
–60
–45
–7.0
–100
–200
Symbol
PD
TJ
Tstg
Max
200
150
–55 ~ +150
Unit
Vdc
Vdc
Vdc
mAdc
mAdc
Unit
mW
°C
°C
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Characteristic
Symbol Min Max
Collector–Emitter Breakdown Voltage
(IC = –2.0 mAdc, IB = 0)
V(BR)CEO –45
Collector–Base Breakdown Voltage
(IC = –10 mAdc, IE = 0)
V(BR)CBO –60
Emitter–Base Breakdown Voltage
(IE = –10 mAdc, IE = 0)
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Collector–Base Cutoff Current
(VCB = –45 Vdc, IE = 0)
V(BR)EBO –7.0 –
ICBO
– –0.1
Collector–Emitter Cutoff Current
(VCE = –10 Vdc, IB = 0)
ICEO
– –100
DC Current Gain (Note 1)
(VCE = –10 Vdc, IC = –2.0 mAdc)
hFE1
210 340
Collector–Emitter Saturation Voltage
(IC = –100 mAdc, IB = –10 mAdc)
VCE(sat) – –0.5
1. Pulse Test: Pulse Width 300 ms, D.C. 2%.
Unit
Vdc
Vdc
Vdc
mAdc
nAdc
Vdc
http://onsemi.com
COLLECTOR
3
2
BASE
1
EMITTER
2
1
3
SC–59
SUFFIX
CASE 318D
MARKING DIAGRAM
AR M
AR = Specific Device Code
M = Date Code
Preferred devices are recommended choices for future use
and best overall value.
© Semiconductor Components Industries, LLC, 2002
May, 2002 – Rev. 5
1
Publication Order Number:
MSB709–RT1/D

1 Page





MSB709-RT1 pdf, ピン配列
MSB709–RT1
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
or stainless steel with a typical thickness of 0.008 inches.
The stencil opening size for the surface mounted package
should be the same as the pad size on the printed circuit
board, i.e., a 1:1 registration.
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of
control settings that will give the desired heat pattern. The
operator must set temperatures for several heating zones,
and a figure for belt speed. Taken together, these control
settings make up a heating “profile” for that particular
circuit board. On machines controlled by a computer, the
computer remembers these profiles from one operating
session to the next. Figure 1 shows a typical heating profile
for use when soldering a surface mount device to a printed
circuit board. This profile will vary among soldering
systems but it is a good starting point. Factors that can
affect the profile include the type of soldering system in
use, density and types of components on the board, type of
solder used, and the type of board or substrate material
being used. This profile shows temperature versus time.
The line on the graph shows the actual temperature that
might be experienced on the surface of a test board at or
near a central solder joint. The two profiles are based on a
high density and a low density board. The Vitronics
SMD310 convection/infrared reflow soldering system was
used to generate this profile. The type of solder used was
62/36/2 Tin Lead Silver with a melting point between
177–189°C. When this type of furnace is used for solder
reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.
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200°C
150°C
100°C
STEP 1
PREHEAT
ZONE 1
RAMP"
STEP 2
VENT
SOAK"
STEP 3
HEATING
ZONES 2 & 5
RAMP"
STEP 4
STEP 5
HEATING HEATING
ZONES 3 & 6 ZONES 4 & 7
SOAK"
SPIKE"
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
160°C
170°C
150°C
STEP 6 STEP 7
VENT COOLING
205° TO 219°C
PEAK AT
SOLDER JOINT
100°C
140°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
50°C
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 1. Typical Solder Heating Profile
http://onsemi.com
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共有リンク

Link :


部品番号部品説明メーカ
MSB709-RT1

PNP General Purpose Amplifier Transistor Surface Mount

LRC
LRC
MSB709-RT1

Small Signal Plastic Pnp

ON Semiconductor
ON Semiconductor
MSB709-RT1

Small Signal Plastic Pnp

Motorola Semiconductor Products
Motorola Semiconductor Products


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