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PDF ISL6530 Data sheet ( Hoja de datos )

Número de pieza ISL6530
Descripción Dual 5V Synchronous Buck Pulse-Width Modulator (PWM) Controller for DDRAM Memory VDDQ and VTT Termination
Fabricantes Intersil Corporation 
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®
Data Sheet
July 2003
ISL6530
FN9052.1
Dual 5V Synchronous Buck Pulse-Width
Modulator (PWM) Controller for DDRAM
Memory VDDQ and VTT Termination
The ISL6530 provides complete control and protection for
dual DC-DC converters optimized for high-performance
DDRAM memory applications. It is designed to drive low
cost N-channel MOSFETs in synchronous-rectified buck
topology to efficiently generate 2.5V VDDQ for powering
DDRAM memory, VREF for DDRAM differential signalling,
and VTT for signal termination. The ISL6530 integrates all of
the control, output adjustment, monitoring and protection
functions into a single package.
The VDDQ output of the converter is maintained at 2.5V
through an integrated precision voltage reference. The VREF
output is precisely regulated to 1/2 the memory power
supply, with a maximum tolerance of ±1% over temperature
and line voltage variations. VTT accurately tracks VREF.
During V2_SD sleep mode, the VTT output is maintained by
a low power window regulator.
The ISL6530 provides simple, single feedback loop, voltage-
mode control with fast transient response. It includes two
phase-locked 300kHz triangle-wave oscillators which are
displaced 90o to minimize interference between the two
PWM regulators. The regulators feature error amplifiers with
a 15MHz gain-bandwidth product and 6V/µs slew rate which
enables high converter bandwidth for fast transient
performance. The resulting PWM duty ratio ranges from 0%
to 100%.
The ISL6530 protects against over-current conditions by
inhibiting PWM operation. The ISL6530 monitors the current
in the VDDQ regulator by using the rDS(ON) of the upper
MOSFET which eliminates the need for a current sensing
resistor.
Ordering Information
TEMP
PART NUMBER RANGE(oC)
PACKAGE
PKG.
DWG. #
ISL6530CB
0 to 70 24 Lead SOIC
M24.3
ISL6530CR
0 to 70 32 Lead 5x5 QFN L32.5x5
ISL6530/31EVAL1 Evaluation Board
Features
• Provides VDDQ, VREF, and VTT voltages for one- and
two-channel DDRAM memory systems
• Excellent voltage regulation
- VDDQ = 2.5V ±2% over full operating range
- VREF = (VDDQ÷2) ±1% over full operating range
- VTT = VREF ± 30mV
• Supports ‘S3’ sleep mode
- VTT is held at VDDQ÷2 via low power window regulator
to minimize wake-up time
• Fast transient response
- Full 0% to 100% duty ratio
• Operates from +5V input
• Overcurrent fault monitor on VDD
- Does not require extra current sensing element
- Uses MOSFET’s rDS(ON)
• Drives inexpensive N-Channel MOSFETs
• Small converter size
- 300kHz fixed frequency oscillator
• 24 Lead, SOIC or 32 Lead, 5mm×5mm QFN
Applications
• VDDQ, VTT, and VREF regulation for DDRAM memory
systems
- Main Memory in AMD® Athlon™ and K8™, Pentium®
III, Pentium IV, Transmeta, PowerPC™, AlphaPC™,
and UltraSparc® based computer systems
- Video memory in graphics systems
• High-power tracking DC-DC regulators
1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2003. All Rights Reserved.
All other trademarks mentioned are the property of their respective owners.

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ISL6530 pdf
ISL6530
Absolute Maximum Ratings
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7.0V
Boot Voltage, VBOOTn - VPHASEn. . . . . . . . . . . . . . . . . . . . . . +7.0V
Input, Output or I/O Voltage . . . . . . . . . . . . GND -0.3V to VCC +0.3V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 2
Operating Conditions
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5V ±10%
Ambient Temperature Range. . . . . . . . . . . . . . . . . . . . . 0oC to 70oC
Junction Temperature Range . . . . . . . . . . . . . . . . . . . 0oC to 125oC
Thermal Information
Thermal Resistance
θJA (oC/W) θJC (oC/W)
SOIC Package (Note 1) . . . . . . . . . . . .
65
N/A
QFN Package (Note 2). . . . . . . . . . . . .
33
4
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC
(SOIC - Lead tips only)
For Recommended soldering conditions see Tech Brief TB389.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
2. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. θJC, the
“case temp” is measured at the center of the exposed metal pad on the package underside. See Tech Brief TB379.
Electrical Specifications Recommended Operating Conditions with Vcc = 5V, Unless Otherwise Noted
PARAMETER
SYMBOL
TEST CONDITIONS
MIN TYP
VCC SUPPLY CURRENT
Nominal Supply
Shutdown Supply
ICC OCSET/SD = VCC;
UGATE1, UGATE2, LGATE1, and LGATE2
Open
OCSET/SD = 0V
-
-
5
3
POWER-ON RESET
Rising VCC Threshold
Falling VCC Threshold
OSCILLATOR
VOCSET/SD = 4.5V
VOCSET/SD = 4.5V
4.25 -
3.75 -
Free Running Frequency
REFERENCES
Reference Voltage
(V2 Error Amp Reference)
VCC = 5
VVREF SENSE1 = 2.5V
275 300
49.5 50
V1 Error Amp Reference Voltage
Tolerance
--
V1 Error Amp Reference
ERROR AMPLIFIERS
DC Gain
Gain-Bandwidth Product
Slew Rate
WINDOW REGULATOR
VREF VCC = 5
GBW
SR
COMP = 10pF
- 0.8
- 82
- 15
-6
Load Current
- ±10
Output Voltage Error
V2_SD = VCC; ±10mA load on V2
- ±7
GATE DRIVERS
Upper Gate Source (UGATE1 and 2)
Upper Gate Sink (UGATE1 and 2)
Lower Gate Source (LGATE1 and 2)
Lower Gate Sink (LGATE1 and 2)
PROTECTION
OCSET/SD Current Source
OCSET/SD Disable Voltage
IUGATE
IUGATE
ILGATE
ILGATE
VCC = 5V, VUGATE = 2.5V
VUGATE-PHASE = 2.5V
VCC = 5V, VLGATE = 2.5V
VLGATE = 2.5V
IOCSET
VRESET
VOCSET = 4.5VDC
- -1
-1
- -1
-2
34 40
- 0.8
MAX UNITS
- mA
- mA
4.5 V
4.0 V
325 kHz
50.5 %SENSE1
2%
-V
- dB
- MHz
- V/µs
- mA
%
-A
-A
-A
-A
46 µA
-V
5

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ISL6530 arduino
ISL6530
nodes. Use copper filled polygons on the top and bottom
circuit layers for the phase nodes. Use the remaining printed
circuit layers for small signal wiring. The wiring traces from
the GATE pins to the MOSFET gates should be kept short
and wide enough to easily handle the 1A of drive current.
ISL6530
+5V VIN
VCC
CBP
GND
D1
CIN
BOOT1
UGATE1
PHASE1
LGATE1
PGND1
COMP1
FB1
CBOOT1
Q1
PHASE1
LOUT1
VDDQ
Q2
COUT1
C2A
R2A
C1A
R1A
R4 C3A R3A
SENSE1
+5V VIN
BOOT2
UGATE2
PHASE2
LGATE2
PGND2
D2 VDDQ
CBOOT2
Q3
PHASE2
LOUT2
VTT
Q4
COUT2
COMP1
FB1
C2B
R2B
C1B
R1B
C3B R3B
SENSE2
KEY
ISLAND ON POWER PLANE LAYER
ISLAND ON CIRCUIT PLANE LAYER
VIA CONNECTION TO GROUND PLANE
FIGURE 7. PRINTED CIRCUIT BOARD POWER PLANES
AND ISLANDS
The switching components should be placed close to the
ISL6530 first. Minimize the length of the connections
between the input capacitors, CIN, and the power switches
by placing them nearby. Position both the ceramic and bulk
input capacitors as close to the upper MOSFET drain as
possible. Position the output inductor and output capacitors
between the upper MOSFET and lower diode and the load.
The critical small signal components include any bypass
capacitors, feedback components, and compensation
components. Position the bypass capacitor, CBP, close to
the VCC pin with a via directly to the ground plane. Place the
PWM converter compensation components close to the FB
and COMP pins. The feedback resistors for both regulators
should also be located as close as possible to the relevant
FB pin with vias tied straight to the ground plane as required.
Feedback Compensation
Figure 8 highlights the voltage-mode control loop for a
synchronous-rectified buck converter. The output voltage
(VOUT) is regulated to the Reference voltage level. The
error amplifier (Error Amp) output (VE/A) is compared with
the oscillator (OSC) triangular wave to provide a pulse-
width modulated (PWM) wave with an amplitude of VIN at
the PHASE node. The PWM wave is smoothed by the output
filter (LO and CO).
The modulator transfer function is the small-signal transfer
function of VOUT/VE/A. This function is dominated by a DC
Gain and the output filter (LO and CO), with a double pole
break frequency at FLC and a zero at FESR. The DC Gain of
the modulator is simply the input voltage (VIN) divided by the
peak-to-peak oscillator voltage VOSC
Modulator Break Frequency Equations
FLC=
--------------------1---------------------
2π x LO x CO
FESR=
---------------------1---------------------
2π x ESR x CO
The compensation network consists of the error amplifier
(internal to the ISL6530) and the impedance networks ZIN
and ZFB. The goal of the compensation network is to provide
a closed loop transfer function with the highest 0dB crossing
frequency (f0dB) and adequate phase margin. Phase margin
is the difference between the closed loop phase at f0dB and
180 degrees. The equations below relate the compensation
network’s poles, zeros and gain to the components (R1, R2,
R3, C1, C2, and C3) in Figure 7. Use these guidelines for
locating the poles and zeros of the compensation network:
1. Pick gain (R2/R1) for desired converter bandwidth.
2. Place first zero below filter’s double pole (~75% FLC).
3. Place second zero at filter’s double pole.
4. Place first pole at the ESR zero.
5. Place second pole at half the switching frequency.
6. Check gain against error amplifier’s open-loop gain.
7. Estimate phase margin - repeat if necessary.
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