IRL3303 データシート PDFこの部品の機能は「Hexfet Power Mosfet」です。 |
検索結果を表示する |
部品番号 |
IRL3303 HEXFET POWER MOSFET PD - 9.1322B IRL3303 HEXFET® Power MOSFET l l l l l l Logic-Level Gate Drive Advanced Process Technology Dynamic dv/dt Rating 175°C Operating Temperature Fast Switching Fully Avalanche Rated D V International Rectifier |
文字列「 IRL3303 」「 3303 」で始まる検索結果です。 |
部品説明 |
IRL3303L HEXFET Power MOSFET PD - 9.1323B IRL3303S/L l l l l l l l Logic-Level Gate Drive Advanced Process Technology Surface Mount (IRL3303S) Low-profile through-hole (IRL3303L) 175°C Operating Temperature Fast Switching Fully Avalanche Rated HEXFET® Power MOSFET D VDSS = 30V RDS(on) = 0.026Ω G ID International Rectifier |
IRL3303LPBF Power MOSFET ( Transistor ) Logic-Level Gate Drive Advanced Process Technology l Surface Mount (IRL3303S) l Low-profile through-hole (IRL3303L) l 175°C Operating Temperature l Fast Switching l Fully Avalanche Rated l Lead-Free Description l l HEXFET® Power MOSFET D IRL3303LPbF IRL33 International Rectifier |
IRL3303PBF Power MOSFET ( Transistor ) • Lead-Free PD - 94887 IRL3303PbF HEXFET Power MOSFET www.irf.com 1 12/11/03 IRL3303PbF 2 www.irf.com IRL3303PbF www.irf.com 3 IRL3303PbF 4 www.irf.com IRL3303PbF www.irf.com 5 IRL3303PbF 6 www.irf.com IRL3303PbF D.U.T + - RG Peak Diode Recovery dv/dt Test International Rectifier |
IRL3303S HEXFET Power MOSFET PD - 9.1323B IRL3303S/L l l l l l l l Logic-Level Gate Drive Advanced Process Technology Surface Mount (IRL3303S) Low-profile through-hole (IRL3303L) 175°C Operating Temperature Fast Switching Fully Avalanche Rated HEXFET® Power MOSFET D VDSS = 30V RDS(on) = 0.026Ω G ID International Rectifier |
IRL3303SPBF Power MOSFET ( Transistor ) Logic-Level Gate Drive Advanced Process Technology l Surface Mount (IRL3303S) l Low-profile through-hole (IRL3303L) l 175°C Operating Temperature l Fast Switching l Fully Avalanche Rated l Lead-Free Description l l HEXFET® Power MOSFET D IRL3303LPbF IRL33 International Rectifier |
228-1296-00-3303 DIP Sockets OEM ZIP DIP Sockets • BeCu contacts assure continuity with very short path to P.C. trace • Contact design prevents solder bridging and wicking • Zero insertion/extraction force achieved with simple cam rotation using a screwdriver • For use where package field replacement 3M Electronics |
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