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Datasheet HCS12 Equivalent ( PDF ) |
N.º | Número de pieza | Descripción | Fabricantes | |
10 | HCS12 | HCS12 Document Methodology Freescale Semiconductor, Inc.
7/9/2003 V0.2
HCS12 Document Methodology
Document Types
The HCS12 Family document set is designed to give the customer the most up-to-date, comprehensive information in an efficient manner. The device documentation is broken down into two types: • Device Guides — |
Motorola Inc |
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9 | HCS125 | Radiation Hardened Quad Buffer/ Three-State HCS125MS
September 1995
Radiation Hardened Quad Buffer, Three-State
Pinouts
14 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE (SBDIP) MIL-STD-1835 CDIP2-T14, LEAD FINISH C TOP VIEW
OE1 1 A1 2 Y1 3 OE2 4 A2 5 Y2 6 GND 7 14 VCC 13 OE4 12 A4 11 Y4 10 OE3 9 A3 8 Y3
Features
• • • • • • • |
Intersil Corporation |
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8 | HCS125D | Radiation Hardened Quad Buffer/ Three-State HCS125MS
September 1995
Radiation Hardened Quad Buffer, Three-State
Pinouts
14 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE (SBDIP) MIL-STD-1835 CDIP2-T14, LEAD FINISH C TOP VIEW
OE1 1 A1 2 Y1 3 OE2 4 A2 5 Y2 6 GND 7 14 VCC 13 OE4 12 A4 11 Y4 10 OE3 9 A3 8 Y3
Features
• • • • • • • |
Intersil Corporation |
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7 | HCS125DMSR | Radiation Hardened Quad Buffer/ Three-State HCS125MS
September 1995
Radiation Hardened Quad Buffer, Three-State
Pinouts
14 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE (SBDIP) MIL-STD-1835 CDIP2-T14, LEAD FINISH C TOP VIEW
OE1 1 A1 2 Y1 3 OE2 4 A2 5 Y2 6 GND 7 14 VCC 13 OE4 12 A4 11 Y4 10 OE3 9 A3 8 Y3
Features
• • • • • • • |
Intersil Corporation |
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Número de pieza | Descripción | Fabricantes | |
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