ERM7501FJ データシート PDFこの部品の機能は「Ingaas Planar Pin Photodiode / Hybrid Receiver Module」です。 |
検索結果を表示する |
部品番号 |
ERM7501FJ InGaAs Planar PIN Photodiode / Hybrid Receiver Module w w a D . w S a t e e h U 4 t m o .c w w .D w t a S a e h U 4 t e .c m o w w w .D a S a t e e h U 4 t m o .c Epitaxx |
文字列「 ERM7501 」「 7501FJ 」で始まる検索結果です。 |
部品説明 |
3D7501 MONOLITHIC MANCHESTER ENCODER 3D7501 MONOLITHIC MANCHESTER ENCODER (SERIES 3D7501) FEATURES • • • • • • All-silicon, low-power CMOS technology TTL/CMOS compatible inputs and outputs Vapor phase, IR and wave solderable Auto-insertable (DIP pkg.) Low ground bounce noise Maximum data rate: 50 MBaud ETC |
3D7501D MONOLITHIC MANCHESTER ENCODER 3D7501 MONOLITHIC MANCHESTER ENCODER (SERIES 3D7501) FEATURES • • • • • • All-silicon, low-power CMOS technology TTL/CMOS compatible inputs and outputs Vapor phase, IR and wave solderable Auto-insertable (DIP pkg.) Low ground bounce noise Maximum data rate: 50 MBaud ETC |
3D7501G MONOLITHIC MANCHESTER ENCODER 3D7501 MONOLITHIC MANCHESTER ENCODER (SERIES 3D7501) FEATURES • • • • • • All-silicon, low-power CMOS technology TTL/CMOS compatible inputs and outputs Vapor phase, IR and wave solderable Auto-insertable (DIP pkg.) Low ground bounce noise Maximum data rate: 50 MBaud ETC |
3D7501H MONOLITHIC MANCHESTER ENCODER 3D7501 MONOLITHIC MANCHESTER ENCODER (SERIES 3D7501) FEATURES • • • • • • All-silicon, low-power CMOS technology TTL/CMOS compatible inputs and outputs Vapor phase, IR and wave solderable Auto-insertable (DIP pkg.) Low ground bounce noise Maximum data rate: 50 MBaud ETC |
3D7501M MONOLITHIC MANCHESTER ENCODER 3D7501 MONOLITHIC MANCHESTER ENCODER (SERIES 3D7501) FEATURES • • • • • • All-silicon, low-power CMOS technology TTL/CMOS compatible inputs and outputs Vapor phase, IR and wave solderable Auto-insertable (DIP pkg.) Low ground bounce noise Maximum data rate: 50 MBaud ETC |
3D7501Z MONOLITHIC MANCHESTER ENCODER 3D7501 MONOLITHIC MANCHESTER ENCODER (SERIES 3D7501) FEATURES • • • • • • All-silicon, low-power CMOS technology TTL/CMOS compatible inputs and outputs Vapor phase, IR and wave solderable Auto-insertable (DIP pkg.) Low ground bounce noise Maximum data rate: 50 MBaud ETC |
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