ECX-206 データシート PDFこの部品の機能は「(ecx-205 / Ecx-206) Smd Tuning Fork Crystal」です。 |
検索結果を表示する |
部品番号 |
ECX-206 (ECX-205 / ECX-206) SMD TUNING FORK CRYSTAL www.Datasheet.jp ECX-205/206 SMD TUNING FORK CRYSTAL Housing for the ECX-205/206 crystal is made from the same thermoplastic that is industry standard for integrated circuits. This ruggedized mol ECS |
文字列「 ECX206 」「 ECX- 」で始まる検索結果です。 |
部品説明 |
ECX-205 (ECX-205 / ECX-206) SMD TUNING FORK CRYSTAL ECX-205/206 SMD TUNING FORK CRYSTAL Housing for the ECX-205/206 crystal is made from the same thermoplastic that is industry standard for integrated circuits. This ruggedized molded package is excellent for SMD applications. FEATURES • Low profile • Lon ECS |
ECX-306 SMD TUNING FORK CRYSTAL ECX-306/306I SMD TUNING FORK CRYSTAL Housing for the ECX-306/306I crystal is made from the same thermoplastic that is industry standard for integrated circuits. This ruggedized molded package is excellent for SMD applications. FEATURES • Low profile • L ECS |
ECX-306I SMD TUNING FORK CRYSTAL ECX-306/306I SMD TUNING FORK CRYSTAL Housing for the ECX-306/306I crystal is made from the same thermoplastic that is industry standard for integrated circuits. This ruggedized molded package is excellent for SMD applications. FEATURES • Low profile • L ECS |
ECX-32 SMD QUARTZ CRYSTAL Low profile 3.2 x 2.5 mm Footprint Extended Temp Range Option RoHS Compliant ECX-32 SMD QUARTZ CRYSTAL The sub miniature ECX-32 is a compact SMD Crystal. The 3.2 x 2.5 x 0.8 mm ceramic package is ideal for today's SMD manufacturing environment. OPERATING CONDITIONS / ELECTRICA ECS |
ECX-33Q SMD QUARTZ CRYSTAL Compact and low profile RoH Compliant (2011/65/EU) MSL 1 Lead Finish: Au AEC-Q200 Qualified ECX-33Q SMD QUARTZ CRYSTAL The ECX-33Q is a miniature SMD Crystal with a 3.2 x 2.5 mm footprint. AEC-Q200 Qualified. OPERATING CONDITIONS / ELECTRICAL CHARACTERISTICS PARAMETERS CONDIT ECS |
ECX-3S SMD QUARTZ CRYSTAL ECX-3S SMD QUARTZ CRYSTAL This wide frequency range SMD quartz crystal is an excellent choice for surface mount applications. The ruggedized molded package is made from the same thermoplastic that is industry standard for integrated circuits. FEATURES • L ECS |
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