DPS12XXX データシート PDFこの部品の機能は「(dpsxxxx) Dc-dc Converters」です。 |
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部品番号 |
DPS12XXX (DPSxxxx) DC-DC Converters w w w .D at aS he et 4U .c om www.Datasheet.jp Delta Electronics |
文字列「 DPS12 」「 12XXX 」で始まる検索結果です。 |
部品説明 |
DPS128C32BV3 512kx8 High Speed CMOS SRAM 4 Megabit High Speed CMOS SRAM DPS128C32BV3 DESCRIPTION: The DPS128C32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC) mounted on a co-fired ceramic substrate. It Dense-Pac Microsystems |
DPS128M8 128kx8 High Speed CMOS SRAM 1 Megabit High Speed CMOS SRAM DPS128M8CnY/BnY, DPS128X8CA3/BA3 DESCRIPTION: The DPS128M8CnY/BnY, DPS128X8CA3/BA3 High Speed SRAM devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC). Available in straigh Dense-Pac Microsystems |
DPS128M8xxx 128kx8 High Speed CMOS SRAM 1 Megabit High Speed CMOS SRAM DPS128M8CnY/BnY, DPS128X8CA3/BA3 DESCRIPTION: The DPS128M8CnY/BnY, DPS128X8CA3/BA3 High Speed SRAM devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC). Available in straigh Dense-Pac Microsystems |
DPS128X32BV3 128kx32 High Speed CMOS SRAM 4 Megabit High Speed CMOS SRAM DPS128X32CV3/DPS128X32BV3 DESCRIPTION: The DPS128X32CV3/DPS128X32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC) mounted on a co-fi Dense-Pac Microsystems |
DPS128X32CV3 128kx32 High Speed CMOS SRAM 4 Megabit High Speed CMOS SRAM DPS128X32CV3/DPS128X32BV3 DESCRIPTION: The DPS128X32CV3/DPS128X32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC) mounted on a co-fi Dense-Pac Microsystems |
DPS128X32XP 4M CMOS SRAM 4 Megabit CMOS SRAM DPS128X32XP/XHP DESCRIPTION: The DPS128X32XP/XHP is a 68-pin surface mount module consisting of four 128K x 8 SRAM devices in plastic TSOP packages surface mounted on a FR-4 substrate. The module is available with either “J”-Leads or “Gull”-Leads. FEA DPAC Technologies |
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