Datasheet DPS128X32BV3 Equivalent ( PDF )

N.º	Número de pieza	Descripción	Fabricantes	PDF
1	DPS128X32BV3	128kx32 High Speed CMOS SRAM 4 Megabit High Speed CMOS SRAM DPS128X32CV3/DPS128X32BV3 DESCRIPTION: The DPS128X32CV3/DPS128X32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC) mounted on a co-fired ceramic substrat	Dense-Pac Microsystems

DPS128X32 Datasheet ( Hoja de datos ) - resultados coincidentes

Número de pieza	Descripción	Fabricantes	PDF
DPS128X32BV3	128kx32 High Speed CMOS SRAM 4 Megabit High Speed CMOS SRAM DPS128X32CV3/DPS128X32BV3 DESCRIPTION: The DPS128X32CV3/DPS128X32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC) mounted on a co-fi	Dense-Pac Microsystems
DPS128X32XP	4M CMOS SRAM 4 Megabit CMOS SRAM DPS128X32XP/XHP DESCRIPTION: The DPS128X32XP/XHP is a 68-pin surface mount module consisting of four 128K x 8 SRAM devices in plastic TSOP packages surface mounted on a FR-4 substrate. The module is available with either “J”-Leads or “Gull”-Leads. FEA	DPAC Technologies
DPS128X32CV3	128kx32 High Speed CMOS SRAM 4 Megabit High Speed CMOS SRAM DPS128X32CV3/DPS128X32BV3 DESCRIPTION: The DPS128X32CV3/DPS128X32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC) mounted on a co-fi	Dense-Pac Microsystems

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Número de pieza	Descripción	Fabricantes	PDF
SPS122	Modern EU gaming Machines require increased +12V current to accommodate the latest gaming peripherals. DC Converters have been engineered with Sanken’s latest technology to efficiently convert redundant power from our lamp gaming PSU and provide additional +12V capacity at the point of use.	Sanken	PDF

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