Datasheet CPD93V Equivalent ( PDF )

N.º	Número de pieza	Descripción	Fabricantes	PDF
1	CPD93V	High Current Switching Diode Chip PROCESS CPD93V Switching Diode High Current Switching Diode Chip PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization EPITAXIAL PLANAR 12.8 x 12.8 MILS 7.1 MILS 5.1 x 5.1 MILS Al - 30,000Å Au-As - 10,000Å GEOMETRY GROSS DIE PER 4 IN	centralsemi

CPD Datasheet ( Hoja de datos ) - resultados coincidentes

Número de pieza	Descripción	Fabricantes	PDF
CPDU24V	SMD ESD Protection Diode SMD ESD Protection Diode SMD Diodes Specialist CPDU Series Features (16kV) IEC 61000-4-2 rating. Surface mount package. High component density. (RoHs Device) 0603(1608) 0.071(1.80) 0.063(1.60) Mechanical data Case: 0603 (1608) Standard package , molded pl	Comchip Technology
CPD-G520	TRINITRON COLOR COMPUTER DISPLAY SERVICE MANUAL SERVICE MANUAL CPD-G520 US Model Canadian Model N. Hemisphere Model S. Hemisphere Model Equator Model Chassis No. SCC-L33E-A CR1 CHASSIS CRT Viewable image size Resolution Maximum Recommended Input signal levels Standard image area SPECIFICATIONS 0.24 mm aperture grille pitc	Sony
CPD04	General Purpose Rectifier 500mA Glass Passivated Rectifier Chip PROCESS General Purpose Rectifier 500mA Glass Passivated Rectifier Chip CPD04 PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization GLASS PASSIVATED MESA 26 x 26 MILS 8.5 MILS 14 x 14 MILS Ni/Au	Central Semiconductor

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nuevas actualizaciones

Número de pieza	Descripción	Fabricantes	PDF
SPS122	Modern EU gaming Machines require increased +12V current to accommodate the latest gaming peripherals. DC Converters have been engineered with Sanken’s latest technology to efficiently convert redundant power from our lamp gaming PSU and provide additional +12V capacity at the point of use.	Sanken	PDF

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