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Datasheet CP734V Equivalent ( PDF ) |
N.º | Número de pieza | Descripción | Fabricantes | Category |
1 | CP734V | Small Signal Transistors NPN PROCESS
Small Signal Transistors
PNP - Chopper Transistor Chip
CP734V
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 5 INCH WAFER 16,986 PRINCIPAL DEVICE TYPES C | Central Semiconductor | transistor |
2 | CP734V | Small Signal Transistors PNP - Chopper Transistor Chip PROCESS
Small Signal Transistors
PNP - Chopper Transistor Chip
CP734V
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 5 INCH WAFER 16,986 PRINCIPAL DEVICE TYPES C | Central Semiconductor | transistor |
CP7 Datasheet ( Hoja de datos ) - resultados coincidentes |
N.º | Número de pieza | Descripción | Fabricantes | Catagory |
1 | CP704 | Small Signal Transistors NPN - Amp Switch Transistor Chip Small Signal Transistors
PROCESS
CP704
PNP - High Current Transistor Chip
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 23,450 PRINCIPAL DEVICE TY Central Semiconductor transistor | | |
2 | CP704 | Small Signal Transistors PNP - High Current Transistor Chip Small Signal Transistors
PROCESS
CP704
PNP - High Current Transistor Chip
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 23,450 PRINCIPAL DEVICE TY Central Semiconductor transistor | | |
3 | CP705 | Small Signal Transistor PNP - High Current Transistor Chip
PROCESS
Small Signal Transistor
PNP - High Current Transistor Chip
CP705
Central
TM
Semiconductor Corp.
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH Central Semiconductor transistor | | |
4 | CP707 | Small Signal Transistor PNP - Darlington Transistor Chip
PROCESS
Small Signal Transistor
PNP - Darlington Transistor Chip
CP707
Central
TM
Semiconductor Corp.
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WA Central Semiconductor transistor | | |
5 | CP709 | Power Transistor PNP - Low Saturation Transistor Chip
PROCESS
Power Transistor
CP709
Central
TM
PNP - Low Saturation Transistor Chip
Semiconductor Corp.
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFE Central Semiconductor transistor | | |
6 | CP710 | Small Signal Transistor PNP - High Voltage Transistor Chip
PROCESS
Small Signal Transistor
PNP - High Voltage Transistor Chip
CP710
Central
TM
Semiconductor Corp.
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH Central Semiconductor transistor | | |
7 | CP710V | Small Signal Transistor PNP - High Voltage Transistor Chip PROCESS
Small Signal Transistor
CP710V
PNP - High Voltage Transistor Chip
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 5 INCH WAFER 25,214 PRINCIPAL DEVICE TY Central Semiconductor transistor | |
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Número de pieza | Descripción | Fabricantes | |
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