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Datasheet CP710 Equivalent ( PDF ) |
| N.º | Número de pieza | Descripción | Fabricantes | |
| 2 | CP710 | Small Signal Transistor PNP - High Voltage Transistor Chip
PROCESS
Small Signal Transistor
PNP - High Voltage Transistor Chip
CP710
Central
TM
Semiconductor Corp.
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH |
 Central Semiconductor |
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| 1 | CP710V | Small Signal Transistor PNP - High Voltage Transistor Chip PROCESS
Small Signal Transistor
CP710V
PNP - High Voltage Transistor Chip
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 5 INCH WAFER 25,214 PRINCIPAL DEVICE TY |
Central Semiconductor |
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