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Datasheet CP704 Equivalent ( PDF ) |
| N.º | Número de pieza | Descripción | Fabricantes | |
| 2 | CP704 | Small Signal Transistors NPN - Amp Switch Transistor Chip Small Signal Transistors
PROCESS
CP704
PNP - High Current Transistor Chip
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 23,450 PRINCIPAL DEVICE TY |
 Central Semiconductor |
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| 1 | CP704 | Small Signal Transistors PNP - High Current Transistor Chip Small Signal Transistors
PROCESS
CP704
PNP - High Current Transistor Chip
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 23,450 PRINCIPAL DEVICE TY |
Central Semiconductor |
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