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Datasheet CP591 Equivalent ( PDF ) |
| N.º | Número de pieza | Descripción | Fabricantes | |
| 3 | CP591 | Small Signal Transistor PNP - Amp/Switch Transistor Chip PROCESS
Small Signal Transistor
PNP - Amp/Switch Transistor Chip
CP591
Central
TM
Semiconductor Corp.
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAF |
 Central Semiconductor |
 |
| 2 | CP591V | Small Signal Transistor PNP - Amp/Switch Transistor Chip PROCESS
Small Signal Transistor
CP591V
PNP - Amp/Switch Transistor Chip
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 30,475 PRINCIPAL DEVICE TYPE |
Central Semiconductor |
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| 1 | CP591X | Small Signal Transistor PNP - Amp/Switch Transistor Chip PROCESS
Small Signal Transistor
CP591X
PNP - Amp/Switch Transistor Chip
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 5 INCH WAFER 45,900 PRINCIPAL DEVICE TYPE |
Central Semiconductor |
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