Datasheet CP588V Equivalent ( PDF )

N.º	Número de pieza	Descripción	Fabricantes	PDF
1	CP588V	PNP - Low Noise Amplifier Transistor Chip PROCESS Small Signal Transistor CP588V PNP - Low Noise Amplifier Transistor Chip PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 54,599 PRINCIPAL DEVICE TYPES 2N2605 2N3	centralsemi

CP5 Datasheet ( Hoja de datos ) - resultados coincidentes

Número de pieza	Descripción	Fabricantes	PDF
CP521SI	Communications Processor Manual SIMATIC S5 CP 521 SI Communications Processor Manual EWA 4NEB 812 6072-02b Edition 03 STEP ®, SIMATIC ® and SINEC ® are registered trademarks of Siemens AG. Subject to change without prior notice. The reproduction, transmission or use of this document or its contents is not	SIMATIC
CP592	Small Signal Transistor PROCESS Small Signal Transistor PNP - Amp/Switch Transistor Chip CP592 Central TM Semiconductor Corp. PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAF	Central Semiconductor Corporation
CP576	PNP Amp / Switch Transistor Chip Power Transistor PROCESS CP576 Central TM PNP - Amp/Switch Transistor Chip Semiconductor Corp. PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 240	Central Semiconductor

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Número de pieza	Descripción	Fabricantes	PDF
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