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Datasheet CP201209 Equivalent ( PDF ) |
| N.º | Número de pieza | Descripción | Fabricantes | |
| 43 | CP201209 | Multilayer Chip Beads Multilayer Chip Beads / CP TYPE（Large Current）
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk. 2.Extremely high reliability due to entirely monolithic construction. 3.Low DC resistance structure of electrode to prevent wasteful electric pow |
 TaeJin |
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| 42 | CP201209T-050x | Multilayer Chip Beads Multilayer Chip Beads / CP TYPE（Large Current）
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk. 2.Extremely high reliability due to entirely monolithic construction. 3.Low DC resistance structure of electrode to prevent wasteful electric pow |
TaeJin |
|
| 41 | CP201209T-070x | Multilayer Chip Beads Multilayer Chip Beads / CP TYPE（Large Current）
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk. 2.Extremely high reliability due to entirely monolithic construction. 3.Low DC resistance structure of electrode to prevent wasteful electric pow |
TaeJin |
|
| 40 | CP201209T-101x | Multilayer Chip Beads Multilayer Chip Beads / CP TYPE（Large Current）
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk. 2.Extremely high reliability due to entirely monolithic construction. 3.Low DC resistance structure of electrode to prevent wasteful electric pow |
TaeJin |
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