CMS-S050-040 データシート PDFこの部品の機能は「Schottky Barrier Diode」です。 |
検索結果を表示する |
部品番号 |
CMS-S050-040 SCHOTTKY BARRIER DIODE CMS-S050-040 SCHOTTKY BARRIER DIODE Features : * Extremely low forward volts * Guard ring protection * Low reverse leakage current Chip size(A): 1.270 * 1.270 mm 2 Bond Pad size(B) : 1.143 *1.14 Champion |
文字列「 CMSS050040 」「 CMS- 」で始まる検索結果です。 |
部品説明 |
CMS-S032-020 SCHOTTKY BARRIER DIODE CMS-S032-020 SCHOTTKY BARRIER DIODE Features : * Extremely low forward volts * Guard ring protection * Low reverse leakage current Chip size(A): 0.814 * 0.814 mm 2 Bond Pad size(B)) : 0.686 * 0.686 mm 2 A Thickness : 300µm ± 20µm Metalization : A Champion Microelectronic |
CMS-S032-040 SCHOTTKY BARRIER DIODE CMS-S032-040 SCHOTTKY BARRIER DIODE Features : * Extremely low forward volts * Guard ring protection * Low reverse leakage current Chip size(A): 0.814 * 0.814 mm 2 Bond Pad size(B) : 0.686 * 0.686 mm 2 A Thickness : 300µm ± 20µm Metalization : An Champion Microelectronic |
CMS-S035-020 SCHOTTKY BARRIER DIODE CMS-S035-020 SCHOTTKY BARRIER DIODE Features : * Extremely low forward volts * Guard ring protection * Low reverse leakage current Chip size(A): 0.889 * 0.889 mm 2 Bond Pad size(B) : 0.762 * 0.762 mm 2 A Thickness : 300µm ± 20µm Metalization : An Champion Microelectronic |
CMS-S035-040 SCHOTTKY BARRIER DIODE CMS-S035-040 SCHOTTKY BARRIER DIODE Features : * Extremely low forward volts * Guard ring protection * Low reverse leakage current Chip size(A): 0.889 * 0.889 mm 2 Bond Pad size(B) : 0.762 * 0.762 mm 2 A Thickness : 300µm ± 20µm Metalization : An Champion Microelectronic |
CMS-S040-020 SCHOTTKY BARRIER DIODE CMS-S040-020 SCHOTTKY BARRIER DIODE Features : * Extremely low forward volts * Guard ring protection * Low reverse leakage current Chip size(A): 1.016 * 1.016 mm 2 Bond Pad size(B) : 0.889 * 0.889 mm 2 A Thickness : 300µm ± 20µm Metalization : An Champion Microelectronic |
CMS-S040-040 SCHOTTKY BARRIER DIODE CMS-S040-040 SCHOTTKY BARRIER DIODE Features : * Extremely low forward volts * Guard ring protection * Low reverse leakage current Chip size(A): 1.016 * 1.016 mm 2 Bond Pad size(B) : 0.889 * 0.889 mm 2 A Thickness : 300µm ± 20µm Metalization : Anode Ti/Ni/Ag B Meta Champion |
当社のサイトでは、半導体やセンサーからモーター、電源に至るまで、さまざまな製品のデータシートを簡単に検索してダウンロードできる集中型プラットフォームを提供しています。 |