CG7501AA データシート PDFこの部品の機能は「4-mbit (512 K X 8) Nvsram」です。 |
検索結果を表示する |
部品番号 |
CG7501AA 4-Mbit (512 K x 8) nvSRAM CG7501AA 4-Mbit (512 K × 8) nvSRAM 4-Mbit (512 K × 8/256 K × 16) nvSRAM Features ■ 45 ns access time ■ Internally organized as 512 K × 8 ■ Hands off automatic STORE on power-down with only Cypress |
文字列「 CG7501 」「 7501AA 」で始まる検索結果です。 |
部品説明 |
3D7501 MONOLITHIC MANCHESTER ENCODER 3D7501 MONOLITHIC MANCHESTER ENCODER (SERIES 3D7501) FEATURES • • • • • • All-silicon, low-power CMOS technology TTL/CMOS compatible inputs and outputs Vapor phase, IR and wave solderable Auto-insertable (DIP pkg.) Low ground bounce noise Maximum data rate: 50 MBaud ETC |
3D7501D MONOLITHIC MANCHESTER ENCODER 3D7501 MONOLITHIC MANCHESTER ENCODER (SERIES 3D7501) FEATURES • • • • • • All-silicon, low-power CMOS technology TTL/CMOS compatible inputs and outputs Vapor phase, IR and wave solderable Auto-insertable (DIP pkg.) Low ground bounce noise Maximum data rate: 50 MBaud ETC |
3D7501G MONOLITHIC MANCHESTER ENCODER 3D7501 MONOLITHIC MANCHESTER ENCODER (SERIES 3D7501) FEATURES • • • • • • All-silicon, low-power CMOS technology TTL/CMOS compatible inputs and outputs Vapor phase, IR and wave solderable Auto-insertable (DIP pkg.) Low ground bounce noise Maximum data rate: 50 MBaud ETC |
3D7501H MONOLITHIC MANCHESTER ENCODER 3D7501 MONOLITHIC MANCHESTER ENCODER (SERIES 3D7501) FEATURES • • • • • • All-silicon, low-power CMOS technology TTL/CMOS compatible inputs and outputs Vapor phase, IR and wave solderable Auto-insertable (DIP pkg.) Low ground bounce noise Maximum data rate: 50 MBaud ETC |
3D7501M MONOLITHIC MANCHESTER ENCODER 3D7501 MONOLITHIC MANCHESTER ENCODER (SERIES 3D7501) FEATURES • • • • • • All-silicon, low-power CMOS technology TTL/CMOS compatible inputs and outputs Vapor phase, IR and wave solderable Auto-insertable (DIP pkg.) Low ground bounce noise Maximum data rate: 50 MBaud ETC |
3D7501Z MONOLITHIC MANCHESTER ENCODER 3D7501 MONOLITHIC MANCHESTER ENCODER (SERIES 3D7501) FEATURES • • • • • • All-silicon, low-power CMOS technology TTL/CMOS compatible inputs and outputs Vapor phase, IR and wave solderable Auto-insertable (DIP pkg.) Low ground bounce noise Maximum data rate: 50 MBaud ETC |
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