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PDF STTH1R02 Data sheet ( Hoja de datos )
| Número de pieza | STTH1R02 | |
| Descripción | Ultrafast recovery diode | |
| Fabricantes | STMicroelectronics | |
| Logotipo |  |
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STTH1R02
Ultrafast recovery diode
Main product characteristics
IF(AV)
VRRM
Tj (max)
VF (typ)
trr (typ)
1.5 A
200 V
175° C
0.7 V
15 ns
Features and benefits
■ Very low conduction losses
■ Negligible switching losses
■ Low forward and reverse recovery times
■ High junction temperature
Description
The STTH1R02 uses ST's new 200 V planar Pt
doping technology, and it is specially suited for
switching mode base drive and transistor circuits.
Packaged in DO-41, DO-15, SMA, and SMB, this
device is intended for use in low voltage, high
frequency inverters, free wheeling and polarity
protection.
AK
A
K DO-41
STTH1R02
A
K DO-15
STTH1R02Q
AA
K
SMA
STTH1R02A
K
SMB
STTH1R02U
Order codes
Part Number
STTH1R02
STTH1R02RL
STTH1R02A
STTH1R02Q
STTH1R02QRL
STTH1R02U
Marking
STTH1R02
STTH1R02
R1A
STTH1R02Q
STTH1R02Q
1R2S
March 2007
Rev 3
www.st.com
1/10
1 page  
STTH1R02
Characteristics
Figure 11. Peak reverse recovery curent
versus dIF/dt (typical values)
IRM(A)
8
IF=1.5A
7 VR=160V
6
5
4
3
2
1
0
10
Tj=125°C
100
Tj=25°C
dIF/dt(A/µs)
1000
Figure 12. Dynamic parameters versus
junction temperature
QRR; IRM [Tj] / QRR; IRM [Tj=125°C]
1.4
IF=1.5A
1.2 VR=160V
1.0
0.8 IRM
0.6
QRR
0.4
0.2
0.0
25 50 75
100
Tj(°C)
125
150
Figure 13.
Thermal resistance, junction to
Figure 14.
ambient, versus copper surface
under each lead - SMA (Epoxy FR4,
copper thickness = 35 µm)
Thermal resistance, junction to
ambient, versus copper surface
under each lead - SMB (Epoxy FR4,
copper thickness = 35 µm)
Rth(j-a) (°C/W)
120
100
80
SMA
60
40
20
SCU(cm²)
0
012345
Rth(j-a)(°C/W)
110
100
90
80
70 SMB
60
50
40
30
20
10 SCU(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Figure 15.
Thermal resistance, junction to
ambient, versus copper surface
under each lead - DO 15 (Epoxy
FR4, copper thickness = 35 µm)
Rth(j-a) (°C/W)
100
90
80
70
DO-15
60
50
40
30
20
10 SCU(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Figure 16.
Thermal resistance, junction to
ambient, versus copper surface
under each lead - DO-41 (Epoxy
FR4, copper thickness = 35 µm)
Rth(j-a)(°C/W)
100
90
DO-41
80
70
60
50
40
30
20
10 S(cm²)
0
0 1 2 3 4 5 6 7 8 9 10
5/10
5 Page | ||
| Páginas | Total 10 Páginas | |
| PDF Descargar | [ Datasheet STTH1R02.PDF ] | |
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