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Datasheet LTC3528B-2 PDF ( 特性, スペック, ピン接続図 )

部品番号 LTC3528B-2
部品説明 2MHz Synchronous Step-Up DC/DC Converter
メーカ Linear
ロゴ Linear ロゴ 
プレビュー
Total 18 pages
		
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LTC3528B-2 Datasheet, LTC3528B-2 PDF,ピン配置, 機能
FEATURES
n Delivers 3.3V at 200mA from a Single Alkaline/
NiMH Cell or 3.3V at 400mA from Two Cells
n VIN Start-Up Voltage: 700mV
n 0.50V to 5.5V Input Range
n 1.6V to 5.25V VOUT Range
n Up to 94% Efficiency
n Output Disconnect
n 2MHz Fixed Frequency Operation
n VIN > VOUT Operation
n Integrated Soft-Start
n Current Mode Control with Internal Compensation
n Low Noise PWM Operation
n Internal Synchronous Rectifier
n Logic Controlled Shutdown: <1µA
n Anti-Ringing Control
n Low Profile (2mm × 3mm × 0.75mm) DFN Package
APPLICATIONS
n Medical Instruments
n Flash-Based MP3 Players
n Noise Canceling Headphones
n Wireless Mice
n Bluetooth Headsets
LTC3528B-2
1A, 2MHz Synchronous
Step-Up DC/DC Converter
in 2mm × 3mm DFN
DESCRIPTION
The LTC®3528B-2 is a synchronous, fixed frequency
step-up DC/DC converter with output disconnect. High
efficiency synchronous rectification, in addition to a 700mV
start-up voltage and operation down to 500mV once
started, provides longer run-time for single or multiple
cell battery-powered products.
A switching frequency of 2MHz minimizes solution
footprint by allowing the use of tiny, low profile induc-
tors and ceramic capacitors. The current mode PWM is
internally compensated, simplifying the design process.
The LTC3528B-2 features continuous switching at light
loads. Anti-ringing circuitry reduces EMI by damping the
inductor in discontinuous mode. Additional features include
a low shutdown current, open-drain power good output,
short-circuit protection and thermal overload protection.
The LTC3528B-2 is offered in an 8-lead 2mm × 3mm ×
0.75mm DFN package.
L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks and
ThinSOT is a trademark of Linear Technology Corporation. All other trademarks are the property
of their respective owners.
TYPICAL APPLICATION
2.2µH
VIN
1.8V TO 3.2V
4.7µF
OFF ON
SW
VIN VOUT
LTC3528B-2
PGOOD
SHDN
GND
FB
499k
287k
68pF
VOUT
3.3V
400mA
10µF
35282 TA01a
Efficiency and Power Loss
100
90
VOUT = 3.3V
VIN = 2.4V
80
1000
70
60 EFFICIENCY
100
50
40 POWER LOSS
30 10
20
10
01
0.1 1 10 100 1000
LOAD CURRENT (mA)
35282 TA01b
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LTC3528B-2 pdf, ピン配列
LTC3528B-2
E LECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the specified operating
junction temperature range, otherwise specifications are at TA = 25°C (Note 2). VIN = 1.2V, VOUT = 3.3V, unless otherwise noted.
PARAMETER
CONDITIONS
MIN TYP MAX UNITS
SHDN Input High Voltage
0.88 V
SHDN Input Low Voltage
0.25 V
SHDN Input Current
PGOOD Threshold Percentage
VSHDN = 1.2V
Referenced to Feedback Voltage Falling
0.3 1
–7 –10 –13
µA
%
PGOOD Low Voltage
PGOOD Leakage Current
IPGOOD = 1mA
VOUT = 1.6V, IPGOOD = 1mA
VPGOOD = 5.5V
0.05 0.1
0.05 0.2
0.01 1
V
V
µA
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTC3528B-2 is tested under pulsed load conditions such that
TJ ≈ TA. The LTC3528BE-2 is guaranteed to meet specifications from
0°C to 85°C junction temperature. Specifications over –40°C to
125°C operating junction temperature range are assured by design,
characterization and correlation with statistical process controls. Note that
the maximum ambient temperature consistent with these specifications
is determined by specific operating conditions in conjunction with board
layout, the rated package thermal impedance and other environmental
factors. The junction temperature (TJ, in °C) is calculated from the ambient
temperature (TA, in °C) and power dissipation (PD, in Watts) according to
the formula:
TJ = TA + (PD qJA)
where qJA = 76°C/W is the package thermal impedance.
Note 3: Specification is guaranteed by design and not 100% tested in
production.
Note 4: Current measurements are made when the output is not switching.
Note 5: This IC includes overtemperature protection that is intended
to protect the device during momentary overload conditions. Junction
temperature will exceed 125°C when overtemperature protection is active.
Continuous operation above the specified maximum operating junction
temperature may result in device degradation or failure.
Note 6: Failure to solder the exposed backside of the package to the PC
board ground plane will result in a thermal resistance much higher than
76°C/W.
Note 7: The IC is tested in a feedback loop to make the measurement.
3528b2fa
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LTC3528B-2 電子部品, 半導体
LTC3528B-2
TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25°C unless otherwise noted)
Load Step Response
(3.6V to 5V)
Load Step Response
(1.2V to 3.3V)
VOUT
100mV/DIV
LOAD
CURRENT
200mA/DIV
VIN = 3.6V
VOUT = 5V
COUT = 10µF
L = 2.2µH
20µs/DIV
LOAD CURRENT = 100mA TO 550mA
35282 G22
VOUT
100mV/DIV
LOAD
CURRENT
100mA/DIV
VIN = 1.2V
VOUT = 3.3V
COUT = 10µF
L = 2.2µH
20µs/DIV
LOAD CURRENT = 20mA TO 170mA
35282 G24
PIN FUNCTIONS
SHDN (Pin 1): Logic Controlled Shutdown Input. There is
an internal 4MΩ pull-down resistor on this pin.
SHDN = High: Normal operation
SHDN = Low: Shutdown, quiescent current < 1µA
FB (Pin 2): Feedback Input. Connect resistor divider tap
to this pin. The output voltage can be adjusted from 1.6V
to 5.25V by:
VOUT
=
1.20V
1+
R2
R1
PGOOD (Pin 3): Power Good Comparator Output. This
open-drain output is low when VFB < 10% from its regu-
lation voltage.
VOUT (Pin 4): Output Voltage Sense and Drain Connection
of the Internal Synchronous Rectifier. PCB trace length
from VOUT to the output filter capacitor (4.7µF minimum)
should be as short and wide as possible.
SW (Pin 5): Switch Pin. Connect inductor between SW
and VIN. Keep PCB trace lengths as short and wide as
possible to reduce EMI. If the inductor current falls to
zero, or SHDN is low, an internal anti-ringing switch is
connected from SW to VIN to minimize EMI.
PGND (Pin 6): Power Ground. Provide a short direct PCB
path between PGND and the (–) side of the input and
output capacitors.
SGND (Pin 7): Signal Ground. Provide a short direct PCB
path between SGND and the (–) side of the input and
output capacitors.
VIN (Pin 8): Battery Input Voltage. Connect a minimum of
1µF ceramic decoupling capacitor from this pin to ground.
GND (Exposed Pad Pin 9): The exposed pad must be
soldered to the PCB ground plane. It serves as another
ground connection and as a means of conducting heat
away from the die.
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