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PDF LTC3529 Data sheet ( Hoja de datos )
| Número de pieza | LTC3529 | |
| Descripción | 1.5MHz Step-Up DC/DC Converter | |
| Fabricantes | Linear | |
| Logotipo |  |
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FEATURES
n Compact Solution for 5V USB On-The-Go
VBUS Power
n 5V at 500mA from Single Li-Ion Cell
n Automatic Fault Detection
n High Efficiency: Up to 95%
n VIN Range: 1.8V to 5.25V
n Fixed 5V Output
n Short-Circuit Protection
n 1.5MHz Low Noise, Fixed Frequency PWM
n Inrush Current Limiting and Internal Soft-Start
n Output Disconnect
n <1μA Quiescent Current in Shutdown
n VIN > VOUT Operation
n 8-Lead, 2mm × 3mm DFN Package
APPLICATIONS
n Personal Media Players
n Digital Video Cameras
n Digital Multimedia Broadcast Tuners
n Digital Cameras
n Smart Phones
LTC3529
1.5A, 1.5MHz Step-Up
DC/DC Converter in
2mm × 3mm DFN
DESCRIPTION
The LTC®3529 is a 5V output, synchronous, fixed frequency
step-up DC/DC converter optimized for USB On-The-Go
(OTG) hosting applications. This compact USB OTG 5V
VBUS converter features a 1.5MHz switching frequency,
internal compensation and a tiny 2mm × 3mm DFN pack-
age. The LTC3529 can operate from input voltages as low
as 1.8V.
USB OTG-specific features include a fault flag with 22ms
deglitching to indicate when the bus is overloaded, output
disconnect and short-circuit protection. Following a fault,
the LTC3529 can be programmed to either latchoff or
restart after a time-out duration.
Additional features include a <1μA shutdown mode,
soft-start, inrush current limiting and thermal overload
protection. Anti-ring circuitry reduces EMI during low
power operation. The LTC3529 is offered in an 8-lead
2mm × 3mm × 0.75mm DFN package.
L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear
Technology Corporation. All other trademarks are the property of their respective owners.
Protected by U.S. Patents including 6404251, 6166527.
TYPICAL APPLICATION
Li-Ion Battery to 5V Synchronous Boost Converter
4.7μH
2.5V +
TO
4.2V
Li-Ion
3.3μF
370Ω
LTC3529
VIN SW
FAULT SNSGND
AUTO-RESTART OFF ON
OFF ON
RST
SHDN
VOUT
PGND
COUT
10μF
3529 TA01a
VOUT
5V
500mA
Efficiency vs Load Current
100 0.9
90 0.8
80
EFFICIENCY
70
60
50
40
30
20
10 POWER LOSS
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1 10 100
LOAD CURRENT (mA)
VIN = 3.6V
INDUCTOR = 4.7μH,
COOPER BUSSMANN SD25-4R7
0
1000
3529 TA01b
3529fb
1
1 page  
LTC3529
PIN FUNCTIONS
VOUT (Pin 1): Converter Output, Voltage Sense Input
and Drain of the Internal Synchronous Rectifier MOSFET.
Driver bias is derived from VOUT. PCB trace length from
VOUT to the output filter capacitor(s) should be as short
and wide as possible.
SW (Pin 2): Switch Node. This node connects to one
side of the inductor. Keep PCB traces as short and wide
as possible to reduce EMI and voltage overshoot. If the
inductor current falls to zero, or SHDN is low, an internal
100Ω anti-ringing switch is connected between SW and
VIN to minimize EMI.
SHDN (Pin 3): Active-Low Shutdown Input. Forcing this
pin above 1V enables the converter. Forcing this pin below
0.35V disables the converter. Do not float this pin.
PGND (Pin 4): High Current Ground Connection. The PCB
trace connecting this pin to ground should be as short and
as wide as possible.
FAULT (Pin 5): Open-Drain Fault Indicator Output. Pulls
low when an overcurrent condition exists for more than
22ms.
SNSGND (Pin 6): This pin must be connected to
ground.
RST (Pin 7): Logic Input to Select Automatic Restart or
Latchoff Following a Fault Shutdown.
• RST = High: Auto-reset mode. In this mode, the LTC3529
will automatically attempt to restart 22ms (typically)
after a fault shutdown.
• RST = Low: Latchoff mode. In this mode, the LTC3529
will latch off for a fault shutdown. The IC will not restart
until the SHDN pin is toggled or the supply voltage is
cycled.
VIN (Pin 8): Input Supply Pin.
Exposed Pad (Pin 9): Small Signal Ground. This is the
ground reference for the internal circuitry of the LTC3529
and must be connected directly to ground.
3529fb
5
5 Page 
PACKAGE DESCRIPTION
DCB Package
8-Lead Plastic DFN (2mm × 3mm)
(Reference LTC DWG # 05-08-1718 Rev A)
LTC3529
3.50 ±0.05
2.10 ±0.05
0.70 ±0.05
1.35 ±0.05
1.65 ± 0.05
PACKAGE
OUTLINE
1.35 REF
0.25 ± 0.05
0.45 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
2.00 ±0.10
(2 SIDES)
R = 0.115
R = 0.05
TYP
TYP
5
0.40 ± 0.10
8
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
3.00 ±0.10
(2 SIDES)
0.75 ±0.05
0.00 – 0.05
1.35 ±0.10
1.65 ± 0.10
PIN 1 NOTCH
R = 0.20 OR 0.25
× 45° CHAMFER
(DCB8) DFN 0106 REV A
41
0.23 ± 0.05
0.45 BSC
1.35 REF
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3529fb
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11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet LTC3529.PDF ] | |
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