PDF USB3500 Data sheet ( Hoja de datos )

Número de pieza	USB3500
Descripción	Hi-Speed USB Host & Device or OTG PHY
Fabricantes	Microchip
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USB3500 Hi-Speed USB Host, Device or OTG PHY With UTMI+ Interface Highlights • USB-IF “Hi-Speed” certified to the Universal Serial Bus Specification Rev 2.0 • Interface compliant with the UTMI+ Specification, Revision 1.0 • Includes full support for the optional On-The-Go (OTG) protocol detailed in the On-The-Go Sup- plement Revision 1.0a specification • Functional as a host, device or OTG PHY • Supports HS, FS, and LS data rates • Supports FS pre-amble for FS hubs with a LS device attached (UTMI+ Level 3) • Supports HS SOF and LS keep alive pulse. • Supports Host Negotiation Protocol (HNP) and Session Request protocol (SRP) • Internal comparators support OTG monitoring of VBUS levels • Low Latency Hi-Speed Receiver (43 Hi-Speed clocks Max) • Internal 1.8 volt regulators allow operation from a single 3.3 volt supply • Internal short circuit protection of ID, DP and DM lines to VBUS or ground • Integrated 24MHz Crystal Oscillator supports either crystal operation or 24MHz external clock input • Internal PLL for 480MHz Hi-Speed USB operation • Supports USB 2.0 and legacy USB 1.1 devices • 55mA Unconfigured Current (typical) - ideal for bus powered applications • 83uA suspend current (typical) - ideal for battery powered applications • Full Commercial operating temperature range from 0C to +70C • 56-Pin, QFN RoHS compliant package (8 x 8 x 0.90 mm height) Functional Overview The USB3500 is a highly integrated USB transceiver system. It contains a complete USB 2.0 PHY with the UTMI+ industry standard interface to support fast time to market for a USB controller. The USB3500 is com- posed of the functional blocks shown in the figure below. USB3500 Block Diagram VDD3.3 XCVRSEL[1:0] TERMSEL TXREADY SUSPENDN TXVALID RESET CHRGVBUS RXACTIVE OPMODE[1:0] ID_DIG IDPULLUP CLKOUT LINESTATE[1:0] HOSTDISC DISCHRGVBUS SESSEND DATA[7:0] RXVALID SESSVLD DPPD DMPD RXERROR VBUSVLD Internal Regulators & POR TX Logic RX Logic UTMI+ Digital 24 MHz XTAL XTAL & PLL HS XCVR FS/LS XCVR USB3500 OTG Module VBUS ID VDD3.3 DP DM Resistors Bias Gen. RBIAS 5V Power Supply Mini-AB USB Connector  2005 - 2016 Microchip Technology Inc. DS00002103A-page 1 1 page USB3500 The USB3500 uses Microchip’s advanced proprietary technology to minimize power dissipation, resulting in maximized battery life in portable applications. FIGURE 1-2: UTMI+ LEVEL 3 SUPPORT UTMI+ Level 3 USB2.0 Peripheral, host controllers, On-the- Go devices (HS, FS, LS, preamble packet) UTMI+ Level 2 USB2.0 Peripheral, host controllers, On- the-Go devices (HS, FS, and LS but no preamble packet) UTMI+ Level 1 USB2.0 Peripheral, host controllers, and On-the-Go devices (HS and FS Only) UTMI+ Level 0 USB2.0 Peripherals Only USB3500 USB3280 USB3250 1.1 Applications The USB3500 is targeted for any application where a hi-speed USB connection is desired. The USB3500 is well suited for: • Cell Phones • MP3 Players • Scanners • Printers • External Hard Drives • Still and Video Cameras • Portable Media Players • Entertainment Devices 1.2 Reference Documents • Universal Serial Bus Specification, Revision 2.0, April 27, 2000 • USB 2.0 Transceiver Macrocell Interface (UTMI) Specification, Version 1.02, May 27, 2000 • On-The-Go Supplement to the USB 2.0 Specification, Revision 1.0a, June 24, 2003 • UTMI+ Specification, Revision 1.0, February 2, 2004  2005 - 2016 Microchip Technology Inc. DS00002103A-page 5 5 Page USB3500 3.0 LIMITING VALUES TABLE 3-1: MAXIMUM RATINGS Parameter Symbol Maximum VBUS, ID, DP, and DM voltage to Ground VMAX_5V Maximum VDD1.8 and VDDA1.8 voltage to Ground VMAX_1.8V Maximum 3.3V supply voltage to Ground VMAX_3.3V Maximum I/O voltage to Ground Operating Temperature Storage Temperature VMAX_IN TMAX_OP TMAX_STG Condition MIN TYP -0.5 -0.5 MAX Units +5.5 V 2.5 V -0.5 4.0 V -0.5 4.0 V 0 70 C -55 150 C Note: Stresses above those listed could cause damage to the device. This is a stress rating only and functional operation of the device at any other condition above those indicated in the operation sections of this spec- ification is not implied. When powering this device from laboratory or system power supplies, it is important that the Absolute Maximum Ratings not be exceeded or device failure can result. Some power supplies exhibit voltage spikes on their outputs when the AC power is switched on or off. In addition, voltage tran- sients on the AC power line may appear on the DC output. If this possibility exists, it is suggested that a clamp circuit be used. TABLE 3-2: RECOMMENDED OPERATING CONDITIONS Parameter 3.3V Supply Voltage Input Voltage on Digital Pins Input Voltage on Analog I/O Pins (DP, DM) Ambient Temperature Symbol VDD3.3 VI VI(I/O) TA Condition MIN TYP MAX Units 3.0 3.3 3.6 V 0.0 VDD3.3 V 0.0 VDD3.3 V 0 +70 oC TABLE 3-3: RECOMMENDED EXTERNAL CLOCK CONDITIONS Parameter Symbol Condition MIN System Clock Frequency System Clock Duty Cycle XI driven by the external clock; and no connection at XO XI driven by the external clock; and no connection at XO 45 TYP 24 (±100ppm) 50 MAX 55 Units MHz %  2005 - 2016 Microchip Technology Inc. DS00002103A-page 11 11 Page

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