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PDF SPH0645LM4H-B Data sheet ( Hoja de datos )
| Número de pieza | SPH0645LM4H-B | |
| Descripción | I2S Output Digital Microphone | |
| Fabricantes | Knowles | |
| Logotipo |  |
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SPH0645LM4H-B
SPH0645LM4H-B
Rev B Datasheet
I2S Output Digital Microphone
The SPH0645LM4H-B is a miniature, low power, bottom port microphone with an I2S digital output.
The solution consists of a proven high performance SiSonic™ acoustic sensor, a serial Analog to
Digital convertor, and an interface to condition the signal into an industry standard 24 bits I2S
format. The I2S interface simplifies the integration in the system and allow direct interconnect to
digital processors, application processors and microcontroller. Saving the need of an external audio
codec, the SPH0645LM4H-B is perfectly suitable for portable applications where size and power
consumption are a constraint.
Product Features:
• High SNR of 65dB(A)
• Low Current of typ. 600µA
• I2S Output: Direct attach to µP
• Multi modes: standard >1MHz,
• 600uA / sleep <900kHz, 10uA
• Flat Frequency Response
• RF Shielded
• Supports Dual Microphones
• Ultra-Stable Performance
• Standard SMD Reflow
• Omnidirectional
• Zero-Height Mic™
• Packaged in SPH 3.50 x 2.65 x 0.98 mm
Typical Applications
• Small portable devices: wearables
• Set-top boxes: TV, gaming, remote controllers
• Smart home devices, Internet of Things,
Connected equipment
SPH0645LM4H-B
Microphone
Filter
I2S
Interface
No Codec
Needed
I2S
Application
Processor
knowles.com
Datasheet SPH0645LM4H-B Rev B
01
1 page  
Performance Curves
TEST CONDITIONS: 25 ±2°C, 55±20% R.H ., VDD =1.8V, fCLOCK = 3.072 MHz with .1uF decoupling capacitor, unless otherwise indicated
Figure 3: Typical Free Field Response Normalized to 1 kHz
Figure 4: Typical THD vs SPL
knowles.com
Datasheet SPH0645LM4H-B Rev B
05
5 Page 
Recommended Reflow Profile
TP
TL
TSMAX
TSMIN
tS Preheat
Ramp-up
tP
tL
Ramp-down
25°C
Time 25°C to Peak
Profile Feature
Average Ramp-up rate (TSMAX to TP)
Preheat
• Temperature Min (TSMIN)
• Temperature Max (TSMAX)
• Time (TSMIN to TSMAX) (tS)
Time maintained above:
• Temperature (TL)
• Time (tL)
Peak Temperature (TP)
Time within 5°C of actual Peak Temperature (tP)
Ramp-down rate (TP to TSMAX)
Time 25°C to Peak Temperature
Notes:
Based on IPC/JDEC J-STD-020 Revision C.
All temperatures refer to topside of the package, measured on the package body surface
Time
PH-Free
3°C/second max.
150°C
200°C
60–180 seconds
217°C
60–150 seconds
260°C
20–40 seconds
6°C/second max
8 minutes max
Additional Notes
(A) MSL (moisture sensitivity level) Class 1.
(B) Maximum of 3 reflow cycles is recommended.
(C) In order to minimize device damage:
• Do not board wash or clean after the reflow process.
• Do not brush board with or without solvents after the reflow process.
• Do not directly expose to ultrasonic processing, welding, or cleaning.
• Do not insert any object in port hole of device at any time.
• Do not apply over 30 psi of air pressure into the port hole.
• Do not pull a vacuum over port hole of the microphone.
• Do not apply a vacuum when repacking into sealed bags at a rate faster than 0.5 atm/sec.
knowles.com
Datasheet SPH0645LM4H-B Rev B
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet SPH0645LM4H-B.PDF ] | |
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