DataSheet.jp

ISO2H823V2.5 の電気的特性と機能

ISO2H823V2.5のメーカーはInfineonです、この部品の機能は「Galvanic Isolated 8 Channel High-Side Switch」です。


製品の詳細 ( Datasheet PDF )

部品番号 ISO2H823V2.5
部品説明 Galvanic Isolated 8 Channel High-Side Switch
メーカ Infineon
ロゴ Infineon ロゴ 




このページの下部にプレビューとISO2H823V2.5ダウンロード(pdfファイル)リンクがあります。

Total 30 pages

No Preview Available !

ISO2H823V2.5 Datasheet, ISO2H823V2.5 PDF,ピン配置, 機能
ISOFACE™
ISO2H823V2.5
Galvanic Isolated 8 Channel High-Side Switch
Datasheet
Revision 2.0, 2015-02-12
Power Management & Multimarket

1 Page





ISO2H823V2.5 pdf, ピン配列
ISOFACE™
ISO2H823V2.5
Revision History
Page or Item Subjects (major changes since previous revision)
Revision 2.0, 2015-02-12
Trademarks of Infineon Technologies AG
AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, EconoPACK™, CoolMOS™, CoolSET™,
CORECONTROL™, CROSSAVE™, DAVE™, DI-POL™, EasyPIM™, EconoBRIDGE™, EconoDUAL™,
EconoPIM™, EconoPACK™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™,
ISOFACE™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OptiMOS™, ORIGA™,
POWERCODE™; PRIMARION™, PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™,
ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™, SmartLEWIS™, SOLID FLASH™, TEMPFET™,
thinQ!™, TRENCHSTOP™, TriCore™.
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™,
PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR
development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™,
FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG.
FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of
Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data
Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of
MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics
Corporation. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA
MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of
OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF
Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™
of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co.
TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™
of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas
Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes
Zetex Limited.
Last Trademarks Update 2011-11-11
Datasheet
3 Revision 2.0, 2015-02-12


3Pages


ISO2H823V2.5 電子部品, 半導体
ISOFACE™
ISO2H823V2.5
List of Figures
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Figure 7
Figure 8
Figure 9
Figure 10
Figure 11
Figure 12
Figure 13
Figure 14
Figure 15
Figure 16
Figure 17
Figure 18
Figure 19
Figure 20
Figure 21
Figure 22
Figure 23
Figure 24
Figure 25
Figure 26
Figure 27
Figure 28
Figure 29
Figure 30
Figure 31
Figure 32
Figure 33
Figure 34
Figure 35
Figure 36
Figure 37
Figure 38
Figure 39
Typical Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Power PG-VQFN-70-2 (430 mil). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Application with Parallel Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Application with Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Bus Configuration for Parallel Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Timing by Parallel Read Access (e.g. GLERR Register) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Timing by Parallel Write Access (e.g. DRIVE Register) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Parallel Direct Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Serial Bus Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Example SPI Topologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
SPI Mode 0, MS0 = 0, MS1 = 0, Daisy Chain Supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
SPI Mode 1, MS0 = 1, MS1 = 0, Daisy Chain Supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
SPI Mode 2, MS0 = 0, MS1 = 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
SPI Mode 3, MS0 = 1, MS1 = 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Connecting Two Devices for Daisy Chain Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Typical Timing Diagram of Daisy Chain Operation (Serial Mode 0) . . . . . . . . . . . . . . . . . . . . . . . . 25
SYNC Operation Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Timing of Resynchronization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Examples of Application of Resynchronization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Diagnostics Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Start Up Procedure of the Power Chip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
LED Matrix connected to the Power Chip. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
LED Pulse Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
LED Matrix connected to the uC-Chip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Burst-Application. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
RFCM-Application. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Typ. On-State Resistance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Typ. On-State Resistance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Typical Initial Peak Short Circuit Current Limit vs Tj . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Maximum Allowable Load Inductance for a Single Switch Off of Each Channel, Calculated . . . . . 61
Maximum Allowable Load Inductance for a Single Switch Off of Each Channel, Calculated . . . . . 62
Maximum Allowable Inductive Switch Off Energy, Single Pulse for Each Channel . . . . . . . . . . . . 62
Typ. Transient Thermal Impedance 1s0p . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Typ. Transient Thermal Impedance 2s2p no vias. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Typ. Transient Thermal Impedance 2s2p . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Sticky Bit Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
PG-VQFN-70-2 (Plastic (Green) Very Thin Profile Quad Flat Non Leaded Package) . . . . . . . . . . 80
Marking Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Datasheet
6 Revision 2.0, 2015-02-12

6 Page



ページ 合計 : 30 ページ
 
PDF
ダウンロード
[ ISO2H823V2.5 データシート.PDF ]


データシートを活用すると、その部品の主な機能と仕様を詳しく理解できます。 ピン構成、電気的特性、動作パラメータ、性能を確認してください。


共有リンク

Link :


部品番号部品説明メーカ
ISO2H823V2.5

Galvanic Isolated 8 Channel High-Side Switch

Infineon
Infineon


www.DataSheet.jp    |   2020   |  メール    |   最新    |   Sitemap