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HSMS-2818 の電気的特性と機能

HSMS-2818のメーカーはAVAGOです、この部品の機能は「Surface Mount RF Schottky Barrier Diodes」です。


製品の詳細 ( Datasheet PDF )

部品番号 HSMS-2818
部品説明 Surface Mount RF Schottky Barrier Diodes
メーカ AVAGO
ロゴ AVAGO ロゴ 




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HSMS-2818 Datasheet, HSMS-2818 PDF,ピン配置, 機能
HSMS-281x
Surface Mount RF Schottky Barrier Diodes
Data Sheet
Description/Applications
These Schottky diodes are specifically designed for both
analog and digital applications. This series offers a wide
range of specifica­tions and package con­figura­tions to
give the ­designer wide flexi­bility. The HSMS‑281x series of
diodes features very low flicker (1/f ) noise.
Note that Avago’s manufacturing techniques assure that
dice found in pairs and quads are taken from adjacent
sites on the wafer, assuring the highest degree of match.
Features
Surface Mount Packages
Low Flicker Noise
Low FIT (Failure in Time) Rate*
Six-sigma Quality Level
Single, Dual and Quad Versions
Tape and Reel Options Available
Lead-free
For more information see the Surface Mount Schottky
Reliability Data Sheet.
Pin Connections and Package Marking
16
25
34
Notes:
1. Package marking provides orientation and identification.
2. See “Electrical Specifications” for appropriate package marking.
Package Lead Code Identification, SOT-323
(Top View)
SINGLE
SERIES
Package Lead Code Identification, SOT-23/SOT-143
(Top View)
SINGLE
3
SERIES
3
COMMON
ANODE
3
COMMON
CATHODE
3
1 #0 2
UNCONNECTED
PAIR
34
1 #2 2
RING
QUAD
34
12
#3
BRIDGE
QUAD
34
1 #4 2
1 #5 2
1 #7 2
1 #8 2
Package Lead Code Identification, SOT-363
(Top View)
HIGH ISOLATION
UNCONNECTED PAIR
654
UNCONNECTED
TRIO
654
B
COMMON
ANODE
C
COMMON
CATHODE
EF
123
K
COMMON
CATHODE QUAD
654
123
L
COMMON
ANODE QUAD
654
1 2M 3
BRIDGE
QUAD
654
1 2N 3
RING
QUAD
654
123
123

1 Page





HSMS-2818 pdf, ピン配列
Quad Capacitance
Capacitance of Schottky diode quads is measured using
an HP4271 LCR meter. This instrument effectively isolates
individual diode branches from the others, allowing ac‑
curate capacitance measurement of each branch or each
diode. The conditions are: 20 mV R.M.S. voltage at 1 MHz.
Avago defines this measurement as “CM”, and it is equiva‑
lent to the capaci­tance of the diode by itself. The equiva‑
lent diagonal and adja­cent capaci-tances can then be cal‑
culated by the formulas given below.
In a quad, the diagonal capaci­tance is the capacitance be‑
tween points A and B as shown in the figure below. The
diagonal capacitance is calculated using the following
formula
C DIAGONAL = _C_1_x__C_2_ + _C__3_x_C__4
C1 + C2 C3 + C4
TbtahenetcweeCeqieDAsunIDAciJGvaApOalCcoNEleuNiAnnTlLattst==eaAdd_CCCa_jua111n_scx++_iden_CnC_gC__t22_t_ihnc1+_–ae_tp+_hf_CaoC_e_–cl_1133_lifo_ti_x+ag_w+_Cn_Cu_icn_r1_44eegbifsoerltomhweu.lacTahpisacciatpanaccie‑
C
ADJACENT
R
j
=
=
C1+
8.33
I
___C_2___C1__3__C_ 4
bX+10–CI1s2-+5 n–1CT3+
–1–
C4
This information
odes.
Rj=
does not
8.33 X 10
I b+Is
a-5pnpTly
to
cross-over
quad
di‑
Linear Equivalent Circuit Model Diode Chip
Rj
RS
Cj
RS = series resistance (see Table of SPICE parameters)
C j = junction capacitance (see Table of SPICE parameters)
Rj =
8.33 X 10-5 nT
Ib + Is
where
Ib = externally applied bias current in amps
Is = saturation current (see table of SPICE parameters)
T = temperature, °K
n = ideality factor (see table of SPICE parameters)
Note:
To effectively model the packaged HSMS-281x product,
please refer to Application Note AN1124.
ESD WARNING:
Handling Precautions Should Be Taken To Avoid Static Discharge.
SPICE Parameters
Parameter Units
BV
V
CJ0
pF
EG
eV
IBV
A
IS
A
N
RS
Ω
PB
V
PT
M
HSMS-281x
25
1.1
0.69
E-5
4.8E-9
1.08
10
0.65
2
0.5



3Pages


HSMS-2818 電子部品, 半導体
SMT Assembly
Reliable assembly of surface mount components is a com‑
plex process that involves many material, process, and
equipment factors, including: method of heating (e.g., IR
or vapor phase reflow, wave soldering, etc.) circuit board
material, conductor thickness and pattern, type of solder
alloy, and the thermal conductivity and thermal mass of
components. Components with a low mass, such as the
SOT package, will reach solder reflow temperatures faster
than those with a greater mass.
Avago’s SOT diodes have been qualified to the time-tem‑
perature profile shown in Figure 8. This profile is repre‑
sentative of an IR reflow type of surface mount assembly
process.
After ramping up from room temperature, the circuit
board with components attached to it (held in place with
solder paste) passes through one or more preheat zones.
The preheat zones increase the temperature of the board
and components to prevent thermal shock and begin
evaporating solvents from the solder paste. The reflow
zone briefly elevates the temperature sufficiently to pro‑
duce a reflow of the solder.
The rates of change of temperature for the ramp-up and
cool-down zones are chosen to be low enough to not
cause deformation of the board or damage to compo‑
nents due to thermal shock. The maximum temperature
in the reflow zone (TMAX) should not exceed 260°C.
These parameters are typical for a surface mount assem‑
bly process for Avago diodes. As a general guideline, the
circuit board and components should be exposed only
to the minimum temperatures and times necessary to
achieve a uniform reflow of solder.
Tp
T L Ts max
Ramp-up
tp
tL
Critical Zone
T L to Tp
Ts min
ts
Preheat
Ramp-down
25
t 25° C to Peak
Figure 8. Surface Mount Assembly Profile.
Time
Lead-Free Reflow Profile Recommendation (IPC/JEDEC J-STD-020C)
Reflow Parameter
Average ramp-up rate (Liquidus Temperature (TS(max) to Peak)
Preheat
Temperature Min (TS(min))
Temperature Max (TS(max))
Time (min to max) (tS)
Ts(max) to TL Ramp-up Rate
Time maintained above:
Peak Temperature (TP)
Time within 5 °C of actual Peak temperature (tP)
Ramp-down Rate
Temperature (TL)
Time (tL)
Time 25 °C to Peak Temperature
Note 1: All temperatures refer to topside of the package, measured on the package body surface

Lead-Free Assembly
3°C/ second max
150°C
200°C
60-180 seconds
3°C/second max
217°C
60-150 seconds
260 +0/-5°C
20-40 seconds
6°C/second max
8 minutes max

6 Page



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共有リンク

Link :


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