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HSMS-2805 の電気的特性と機能

HSMS-2805のメーカーはAVAGOです、この部品の機能は「Surface Mount RF Schottky Barrier Diodes」です。


製品の詳細 ( Datasheet PDF )

部品番号 HSMS-2805
部品説明 Surface Mount RF Schottky Barrier Diodes
メーカ AVAGO
ロゴ AVAGO ロゴ 




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HSMS-2805 Datasheet, HSMS-2805 PDF,ピン配置, 機能
HSMS-280x
Surface Mount RF Schottky Barrier Diodes
Data Sheet
Description/Applications
These Schottky diodes are specifically designed for both
analog and digital applications. This series offers a wide
range of specifications and package configurations to
give the designer wide flexibility. The HSMS-280x series
of diodes is optimized for high voltage applications.
Note that Avago’s manufacturing techniques assure that
dice found in pairs and quads are taken from adjacent sites
on the wafer, assuring the highest degree of match.
Features
x Surface Mount Packages
x High Breakdown Voltage
x Low FIT (Failure in Time) Rate*
x Six-sigma Quality Level
x Single, Dual and Quad Versions
x Tape and Reel Options Available
x Lead-free
* For more information see the Surface Mount Schottky Reliability
Data Sheet.
Package Lead Code Identification, SOT-323 (Top View)
SINGLE
SERIES
Package Lead Code Identification, SOT-363 (Top View)
HIGH ISOLATION
UNCONNECTED PAIR
654
UNCONNECTED
TRIO
654
B
COMMON
ANODE
E
C
COMMON
CATHODE
F
Package Lead Code Identification, SOT-23/SOT-143 (Top View)
SINGLE
3
SERIES
3
COMMON
ANODE
3
COMMON
CATHODE
3
123
K
COMMON
CATHODE QUAD
654
123
M
BRIDGE
QUAD
654
123
P
123
L
COMMON
ANODE QUAD
654
123
N
RING
QUAD
654
123
R
12
#0
UNCONNECTED
PAIR
34
12
#2
BRIDGE
QUAD
34
12
#3
12
#4
1 #5 2
1 #8 2

1 Page





HSMS-2805 pdf, ピン配列
Quad Capacitance
Capacitance of Schottky diode quads is measured using
an HP4271 LCR meter. This instrument effectively isolates
individual diode branches from the others, allowing
accurate capacitance measurement of each branch or
each diode. The conditions are: 20 mV R.M.S. voltage at 1
MHz. Avago defines this measurement as “CM”, and it is
equivalent to the capacitance of the diode by itself. The
equivalent diagonal and adjacent capacitances can then
be calculated by the formulas given below.
In a quad, the diagonal capacitance is the capacitance
between points A and B as shown in the figure below.
The diagonal capacitance is calculated using the follow-
ing formula
CDIAGONAL = __C_1_x__C_2 + ___C_3_x_C_4
C1 + C2 C3 + C4
A
C1 C3
C
C2 C4
B
The equivalent adjacent capacitance is the capacitance
between points A and C in the figure below. This capaci-
tance is calculated using the following formula
CADJACENT = C1 + _______1_____
–1– + –1– + –1–
C2 C3 C4
This information does not apply to cross-over quad
diodes.
Linear Equivalent Circuit, Diode Chip
Rj
RS
Cj
RS = series resistance (see Table of SPICE parameters)
C j = junction capacitance (see Table of SPICE parameters)
Rj =
8.33 X 10-5 nT
Ib + Is
where
Ib = externally applied bias current in amps
Is = saturation current (see table of SPICE parameters)
T = temperature, K
n = ideality factor (see table of SPICE parameters)
Note:
To effectively model the packaged HSMS-280x product,
please refer to Application Note AN1124.
SPICE Parameters
Parameter Units
BV V
CJ0 pF
EG eV
IBV A
IS A
N
RS Ω
PB V
PT
M
HSMS-280x
75
1.6
0.69
E-5
3.00E-08
1.08
30
0.65
2
0.5
3


3Pages


HSMS-2805 電子部品, 半導体
SMT Assembly
Reliable assembly of surface mount components is a
complex process that involves many material, process, and
equipment factors, including: method of heating (e.g., IR
or vapor phase reflow, wave soldering, etc.) circuit board
material, conductor thickness and pattern, type of solder
alloy, and the thermal conductivity and thermal mass of
components. Components with a low mass, such as the
SOT package, will reach solder reflow temperatures faster
than those with a greater mass.
Avago’s SOT diodes have been qualified to the time-
temperature profile shown in Figure 8. This profile is
representative of an IR reflow type of surface mount as-
sembly process.
After ramping up from room temperature, the circuit
board with components attached to it (held in place
with solder paste) passes through one or more preheat
zones. The preheat zones increase the temperature of the
board and components to prevent thermal shock and
begin evaporating solvents from the solder paste. The
reflow zone briefly elevates the temperature sufficiently
to produce a reflow of the solder.
The rates of change of temperature for the ramp-up and
cool-down zones are chosen to be low enough to not
cause deformation of the board or damage to compo-
nents due to thermal shock. The maximum temperature
in the reflow zone (TMAX) should not exceed 260°C.
These parameters are typical for a surface mount assem-
bly process for Avago diodes. As a general guideline, the
circuit board and components should be exposed only
to the minimum temperatures and times necessary to
achieve a uniform reflow of solder.
Tp
TL
Ts max
Ramp-up
tp
tL
Critical Zone
T L to Tp
Ts min
ts
Preheat
Ramp-down
25
t 25° C to Peak
Time
Figure 8. Surface Mount Assembly Profile.
Lead-Free Reflow Profile Recommendation (IPC/JEDEC J-STD-020C)
Reflow Parameter
Average ramp-up rate (Liquidus Temperature (TS(max) to Peak)
Preheat
Temperature Min (TS(min))
Temperature Max (TS(max))
Time (min to max) (tS)
Ts(max) to TL Ramp-up Rate
Time maintained above:
Peak Temperature (TP)
Time within 5 °C of actual Peak temperature (tP)
Ramp-down Rate
Temperature (TL)
Time (tL)
Time 25 °C to Peak Temperature
Note 1: All temperatures refer to topside of the package, measured on the package body surface
6
Lead-Free Assembly
3°C/ second max
150°C
200°C
60-180 seconds
3°C/second max
217°C
60-150 seconds
260 +0/-5°C
20-40 seconds
6°C/second max
8 minutes max

6 Page



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共有リンク

Link :


部品番号部品説明メーカ
HSMS-2800

Surface Mount RF Schottky Barrier Diodes

Agilent Technologies
Agilent Technologies
HSMS-2800

Surface Mount RF Schottky Barrier Diodes

AVAGO
AVAGO
HSMS-2802

Surface Mount RF Schottky Barrier Diodes

Agilent Technologies
Agilent Technologies
HSMS-2802

Surface Mount RF Schottky Barrier Diodes

AVAGO
AVAGO


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