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PDF ESD9D5.0S Data sheet ( Hoja de datos )

Número de pieza ESD9D5.0S
Descripción TVS Diode ( Rectifier )
Fabricantes ON Semiconductor 
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ESD9D5.0S
Transient Voltage
Suppressors
ESD Protection Diodes with Ultra−Low
Capacitance
The ESD9D5.0 is designed to protect voltage sensitive components
that require ultra−low capacitance from ESD and transient voltage
events. Excellent clamping capability, low capacitance, low leakage,
and fast response time, make these parts ideal for ESD protection on
designs where board space is at a premium. Because of its low
capacitance, it is suited for use in high frequency designs such as USB
2.0 high speed and antenna line applications.
www.onsemi.com
1
PIN 1. CATHODE
2. ANODE
2
Specification Features:
Ultra Low Capacitance 0.6 pF
Low Clamping Voltage
Small Body Outline Dimensions:
0.039x 0.024(1.00 mm x 0.60 mm)
Low Body Height: 0.016(0.4 mm)
Stand−off Voltage: 5 V
Low Leakage
Response Time is Typically < 1.0 ns
IEC61000−4−2 Level 4 ESD Protection
This is a Pb−Free Device
2
1
SOD−923
CASE 514AB
MARKING DIAGRAM
1
BB M
2
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Rating
Symbol
IEC 61000−4−2 (ESD)
Contact
Air
Total Power Dissipation on FR−5 Board
(Note 1) @ TA = 25°C
Storage Temperature Range
Junction Temperature Range
Lead Solder Temperature − Maximum
(10 Second Duration)
°PD°
Tstg
TJ
TL
Value
±8
±8
150
Unit
kV
mW
−55 to +150
−55 to +125
260
°C
°C
°C
BB = Specific Device Code
M = Date Code
ORDERING INFORMATION
Device
Package
Shipping
ESD9D5.0ST5G SOD−923 8000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics tables starting on
page 2 of this data sheet.
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
See Application Note AND8308/D for further description of survivability specs.
© Semiconductor Components Industries, LLC, 2015
September, 2015 − Rev. 1
1
Publication Order Number:
ESD9D5.0S/D

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