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ESD11B の電気的特性と機能

ESD11BのメーカーはON Semiconductorです、この部品の機能は「TVS Diode ( Rectifier )」です。


製品の詳細 ( Datasheet PDF )

部品番号 ESD11B
部品説明 TVS Diode ( Rectifier )
メーカ ON Semiconductor
ロゴ ON Semiconductor ロゴ 




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ESD11B Datasheet, ESD11B PDF,ピン配置, 機能
ESD11B
Transient Voltage
Suppressors
Micro−Packaged Diodes for ESD Protection
The ESD11B Series is designed to protect voltage sensitive
components from ESD. Excellent clamping capability, low leakage,
and fast response time provide best in class protection on designs that
are exposed to ESD. Because of its small size, it is suited for use in
cellular phones, MP3 players, digital cameras and many other portable
applications where board space comes at a premium.
Specification Features
Low Capacitance 12 pF
Low Clamping Voltage
Small Body Outline Dimensions: 0.60 mm x 0.30 mm
Low Body Height: 0.3 mm
Stand−off Voltage: 5.0 V
Low Leakage
Response Time is < 1 ns
IEC61000−4−2 Level 4 ESD Protection
IEC61000−4−4 Level 4 EFT Protection
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Mechanical Characteristics
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 3 Requirements
MAXIMUM RATINGS
Rating
IEC 61000−4−2 (ESD)
Symbol
Contact
Air
Value
±15
±15
Unit
kV
Total Power Dissipation on FR−5 Board
(Note 1) @ TA = 25°C
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature Range
Lead Solder Temperature − Maximum
(10 Second Duration)
°PD°
RqJA
TJ, Tstg
TL
250 mW
400 °C/W
−40 to +125 °C
260 °C
Peak Pulse Current, 8 x 20 ms double Ipp 2.0 A
exponential waveform (Figure 5)
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
www.onsemi.com
DSN2
CASE 152AA
MARKING
DIAGRAM
PIN 1
XXXX
YYY
XXXX = Specific Device Code
YYY = Year Code
ORDERING INFORMATION
Device
Package
Shipping
ESD11B5.0ST5G DSN2 5000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
See Application Note AND8308/D for further description of survivability specs.
© Semiconductor Components Industries, LLC, 2015
September, 2015 − Rev. 7
1
Publication Order Number:
ESD11B/D

1 Page





ESD11B pdf, ピン配列
ESD11B
IEC 61000−4−2 Spec.
Level
First Peak
Test Volt- Current Current at
age (kV)
(A) 30 ns (A)
1 2 7.5 4
2 4 15 8
3 6 22.5 12
48
30 16
Current at
60 ns (A)
2
4
6
8
IEC61000−4−2 Waveform
Ipeak
100%
90%
I @ 30 ns
I @ 60 ns
10%
Figure 3. IEC61000−4−2 Spec
tP = 0.7 ns to 1 ns
ESD Gun
TVS
Oscilloscope
50 W
Cable
50 W
Figure 4. Diagram of ESD Test Setup
The following is taken from Application Note
AND8308/D − Interpretation of Datasheet Parameters
for ESD Devices.
ESD Voltage Clamping
For sensitive circuit elements it is important to limit the
voltage that an IC will be exposed to during an ESD event
to as low a voltage as possible. The ESD clamping voltage
is the voltage drop across the ESD protection diode during
an ESD event per the IEC61000−4−2 waveform. Since the
IEC61000−4−2 was written as a pass/fail spec for larger
systems such as cell phones or laptop computers it is not
clearly defined in the spec how to specify a clamping voltage
at the device level. ON Semiconductor has developed a way
to examine the entire voltage waveform across the ESD
protection diode over the time domain of an ESD pulse in the
form of an oscilloscope screenshot, which can be found on
the datasheets for all ESD protection diodes. For more
information on how ON Semiconductor creates these
screenshots and how to interpret them please refer to
AND8307/D.
100
tr
90
80
70
60
50
40
30
20
10
0
0
PEAK VALUE IRSM @ 8 ms
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 ms
HALF VALUE IRSM/2 @ 20 ms
tP
20 40
60
t, TIME (ms)
Figure 5. 8 X 20 ms Pulse Waveform
80
www.onsemi.com
3


3Pages


ESD11B 電子部品, 半導体
ESD11B
PACKAGE DIMENSIONS
DSN2, 0.6x0.3, 0.4P, (0201)
CASE 152AA
ISSUE A
DA
B
2X 0.06 C
E
2X 0.06 C
TOP VIEW
0.05 C
A
2X 0.05 C
A1
SIDE VIEW
C
SEATING
PLANE
1e
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
MILLIMETERS
DIM MIN MAX
A 0.24 0.30
A1 0.00 0.01
b 0.20 0.22
D 0.30 BSC
E 0.60 BSC
e 0.40 BSC
L 0.10 0.12
CATHODE BAND MONTH CODING
DEC NOV OCT
SEP
XXXX DEVICE CODE
JUN
YYYMAR
YEAR CODE
FEB
JAN
2X L
2
2X b
0.05 C A B
BOTTOM VIEW
MOUNTING FOOTPRINT*
0.28
XXXX
Y09
(EXAMPLE)
INDICATES AUG 2009
0.75
0.28 0.30
DIMENSIONS: MILLIMETERS
See Application Note AND8398/D for more mounting details
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
www.onsemi.com
6
ESD11B/D

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