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C6011 の電気的特性と機能

C6011のメーカーはAllegroです、この部品の機能は「NPN Transistor - 2SC6011」です。


製品の詳細 ( Datasheet PDF )

部品番号 C6011
部品説明 NPN Transistor - 2SC6011
メーカ Allegro
ロゴ Allegro ロゴ 




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C6011 Datasheet, C6011 PDF,ピン配置, 機能
2SC6011
Audio Amplification Transistor
Features and Benefits
Small package (TO-3P)
High power handling capacity, 160 W
Improved sound output by reduced on-chip impedance
For professional audio (PA) applications, VCEO = 200 V
versions available
Complementary to 2SA2151
Recommended output driver: 2SC4832
Package: 3 Lead TO-3P
Description
By adapting the Sanken unique wafer-thinner technique, these
NPN power transistors achieve power-up by decreasing thermal
resistance, and provide higher voltage avalanche breakdown
rating.The high power-handling capacity of the TO-3Ppackage
allows a smaller footprint on the circuit board design. This
series of transistors is very well suited to not only multichannel
applications for AV (audio-visual) amplifiers and receivers,
but also parallel connection applications for PA (professional
audio system) amplifiers.
Applications include the following:
Single transistors for audio amplifiers
Home audio amplifiers
Professional audio amplifiers
Automobile audio amplifiers
Audio market
Single transistors for general purpose
www.DataSheet4U.com
38102

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C6011 pdf, ピン配列
2SC6011
Audio Amplification Transistor
15
IC vs. VCE
10
5
0
0
15
IC vs. VBE
VCE = 4 V Continuous
10
5
Performance Characteristics
300 mA
200 mA
3
100 mA
50 mA
IB= 20 mA
123
VCE (V)
4
VCE(sat) vs. IB
2
1
0
0
1000
IC= 10 A
IC= 5 A
0.5 1.0
IB (A)
1.5
2.0
100
hFE vs. IC
VCE = 4 V Continuous
10
Typ.
00
1000
100
hFE vs. IC
VCE = 4 V Continuous
10
0.5 1.0 1.5
VBE (V)
2.0
1
0.01
10.00
0.1 1
IC (A)
10
100
125°C
25°C
–30°C
RθJA vs. t
1.00
0.10
1
0.01
0.1 1
IC (A)
10
100
0.01
1
10 100
t (ms)
1000
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
3


3Pages


C6011 電子部品, 半導体
2SC6011
Audio Amplification Transistor
WARNING — These devices are designed to be operated at lethal voltages and energy levels. Circuit designs
that embody these components must conform with applicable safety requirements. Precautions must be
taken to prevent accidental contact with power-line potentials. Do not connect grounded test equipment.
The use of an isolation transformer is recommended during circuit development and breadboarding.
Because reliability can be affected adversely by improper storage
environments and handling methods, please observe the following
cautions.
Cautions for Storage
• Ensure that storage conditions comply with the standard
temperature (5°C to 35°C) and the standard relative humidity
(around 40 to 75%); avoid storage locations that experience
extreme changes in temperature or humidity.
• Avoid locations where dust or harmful gases are present and
avoid direct sunlight.
• Reinspect for rust on leads and solderability of products that have
been stored for a long time.
Cautions for Testing and Handling
When tests are carried out during inspection testing and other
standard test periods, protect the products from power surges
from the testing device, shorts between adjacent products, and
shorts to the heatsink.
Remarks About Using Silicone Grease with a Heatsink
When silicone grease is used in mounting this product on a
heatsink, it shall be applied evenly and thinly. If more silicone
grease than required is applied, it may produce stress.
Coat the back surface of the product and both surfaces of the
insulating plate to improve heat transfer between the product and
the heatsink.
Volatile-type silicone greases may permeate the product and
produce cracks after long periods of time, resulting in reduced
heat radiation effect, and possibly shortening the lifetime of the
product.
Our recommended silicone greases for heat radiation purposes,
which will not cause any adverse effect on the product life, are
indicated below:
Type
Suppliers
G746
Shin-Etsu Chemical Co., Ltd.
YG6260
GE Toshiba Silicone Co., Ltd.
SC102
Dow Corning Toray Silicone Co., Ltd.
Heatsink Mounting Method
Torque When Tightening Mounting Screws. Thermal resistance
increases when tightening torque is low, and radiation effects are
decreased. When the torque is too high, the screw can strip, the
heatsink can be deformed, and distortion can arise in the product frame.
To avoid these problems, observe the recommended tightening torques
for this product package type, TO-3P (MT-100): 0.686 to 0.882 N•m (7
to 9 kgf•cm).
Diameter of Heatsink Hole: < 4 mm. The deection of the press mold
when making the hole may cause the case material to crack at the joint
with the heatsink. Please pay special attention for this effect.
Soldering
• When soldering the products, please be sure to minimize the
working time, within the following limits:
260±5°C 10 s
350±5°C 3 s
Soldering iron should be at a distance of at least 1.5 mm from the
body of the products
Electrostatic Discharge
• When handling the products, operator must be grounded.
Grounded wrist straps worn should have at least 1 MΩ of
resistance to ground to prevent shock hazard.
• Workbenches where the products are handled should be
grounded and be provided with conductive table and floor mats.
• When using measuring equipment such as a curve tracer, the
equipment should be grounded.
• When soldering the products, the head of soldering irons or the
solder bath must be grounded in other to prevent leak voltages
generated by them from being applied to the products.
• The products should always be stored and transported in our
shipping containers or conductive containers, or be wrapped in
aluminum foil.
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
6

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