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PDF ESD8704 Data sheet ( Hoja de datos )

Número de pieza ESD8704
Descripción ESD Protection Diode
Fabricantes ON Semiconductor 
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ESD8704
ESD Protection Diode
Low Capacitance Array for High Speed
Data Lines
The ESD8704 is designed to protect high speed data lines from
ESD. Ultra−low capacitance and low ESD clamping voltage make this
device an ideal solution for protecting voltage sensitive high speed
data lines. The flow−through style package allows for easy PCB layout
and matched trace lengths necessary to maintain consistent impedance
between high speed differential lines such as USB 3.0/3.1.
Features
Low Capacitance (0.5 pF Max, I/O to GND)
Protection for the Following IEC Standards:
IEC 61000−4−2 (Level 4)
Low ESD Clamping Voltage
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
USB 3.0/3.1
eSATA
DisplayPort
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Operating Junction Temperature Range TJ −55 to +125 °C
Storage Temperature Range
Tstg − 55 to +150 °C
Lead Solder Temperature −
Maximum (10 Seconds)
TL 260 °C
IEC 61000−4−2 Contact (ESD)
IEC 61000−4−2 Air (ESD)
ESD
ESD
±30 kV
±30 kV
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
www.onsemi.com
UDFN10
CASE 517BB
MARKING
DIAGRAM
7DMG
G
7D = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
PIN CONFIGURATION
AND SCHEMATIC
N/C N/C GND N/C N/C
10 9 8 7 6
12 3 4 5
I/O I/O GND I/O I/O
I/O I/O I/O I/O
Pin 1 Pin 2 Pin 4 Pin 5
Pins 3, 8
Note: Common GND − Only Minimum of 1 GND connection required
See Application Note AND8308/D for further description of
survivability specs.
© Semiconductor Components Industries, LLC, 2015
October, 2015 − Rev. 0
1
ORDERING INFORMATION
Device
Package
Shipping
ESD8704MUTAG UDFN10 3000 / Tape &
(Pb−Free)
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Publication Order Number:
ESD8704/D

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ESD8704 pdf
ESD8704
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VR, REVERSE VOLTAGE (V)
Figure 9. Junction Capacitance vs. Reverse
Voltage
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FREQUENCY (GHz)
Figure 10. Junction Capacitance vs.
Frequency
5 Gbps Eye Diagram Without ESD8704
5 Gbps Eye Diagram With ESD8704
Figure 11. USB3.0 Eye Diagram with and without ESD8704. 5 Gb/s
10 Gbps Eye Diagram Without ESD8704
10 Gbps Eye Diagram With ESD8704
Figure 12. USB3.1 Eye Diagram with and without ESD8704. 10 Gb/s
See application note AND9075/D for further description of eye diagram testing methodology.
www.onsemi.com
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