PDF AX8052F131 Data sheet ( Hoja de datos )

Número de pieza	AX8052F131
Descripción	SoC Ultra-Low Power RFMicrocontroller
Fabricantes	ON Semiconductor
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No Preview Available ! AX8052F131 SoC Ultra-Low Power RF-Microcontroller for the 400 - 470 MHz and 800 - 940 MHz Bands OVERVIEW The AX8052F131 is a single chip ultra−low−power RF−microcontroller SoC primarily for use in SRD bands. The on−chip transmitter consists of a fully integrated RF front−end with modulator, and demodulator. Base band data processing is implemented in an advanced and flexible communication controller that enables user friendly communication. www.onsemi.com 1 40 QFN40 7x5, 0.5P CASE 485EG Features SoC Ultra−low Power RF−microcontroller for Wireless Communication Applications • QFN40 Package • Supply Range 2.2 V − 3.6 V (1.8 V MCU) • −40°C to 85°C • Ultra−low Power Consumption: ♦ CPU Active Mode 150 mA/MHz ♦ Sleep Mode with 256 Byte RAM Retention and Wake−up Timer running 900 nA ♦ Sleep Mode 4 kByte RAM Retention and Wake−up Timer running 1.9 mA ♦ Sleep Mode 8 kByte RAM Retention and Wake−up Timer running 2.6 mA ♦ Radio TX−mode 22 mA at 10 dBm Output Power AX8052 Features • Ultra−low Power MCU Core Compatible with Industry Standard 8052 Instruction Set • Down to 250 nA Wake−up Current • Single Cycle/Instruction for many Instructions • 64 kByte In−system Programmable FLASH • Code Protection Lock • 8.25 kByte SRAM • 3−wire (1 dedicated, 2 shared) In−circuit Debug Interface • Three 16−bit Timers with SD Output Capability • Two 16−bit Wakeup Timers • Two Input Captures • Two Output Compares with PWM Capability • 10−bit 500 ksample/s Analog−to−Digital Converter • Temperature Sensor • Two Analog Comparators • Two UARTs ORDERING INFORMATION Device Type Qty AX8052F131−2−TB05 Tape & Reel 500 AX8052F131−2−TX30 Tape & Reel 3,000 • One General Purpose Master/Slave SPI • Two Channel DMA Controller • Multi−megabit/s AES Encryption/Decryption Engine with True Random Number Generator (TRNG), supports AES−128, AES−192 and AES−256 NOTE: The AES Engine and the TRNG require Software Enabling and Support. • Ultra−low Power 10 kHz/640 Hz Wakeup Oscillator, with Automatic Calibration against a Precise Clock • Internal 20 MHz RC Oscillator, with Automatic Calibration against a Precise Clock for Flexible System Clocking • Low Frequency Tuning Fork Crystal Oscillator for Accurate Low Power Time Keeping • Brown−out and Power−on−Reset Detection High−performance RF Transmitter compatible to AX5031 • 400 − 470 MHz and 800 − 940 MHz SRD Bands • −5 dBm to +15 dBm Programmable Output • 13 mA @ 0 dBm, 868 MHz • 22 mA @ 10 dBm, 868 Mhz • 44 mA @ 15 dBm, 868 Mhz • Wide Variety of Shaped Modulations Supported (ASK, PSK, OQPSK, MSK, FSK, GFSK, 4−FSK) • Flexible Shaping for the Modulations © Semiconductor Components Industries, LLC, 2016 May, 2016 − Rev. 3 1 Publication Order Number: AX8052F131/D 1 page AX8052F131 Table 1. PIN FUNCTION DESCRIPTIONS Symbol Pin(s) Type GND 40 P GND Center pad P A = analog input I = digital input signal O = digital output signal PU = pull−up I/O = digital input/output signal N = not to be connected P = power or ground PD = pull−down Table 2. ALTERNATE PIN FUNCTIONS GPIO PA0 T0OUT PA1 T0CLK PA2 OC0 PA3 T1OUT PA4 T1CLK PA5 IC0 PA6 T2OUT PA7 T2CLK PB0 U1TX PB1 U1RX PB2 IC0 PB3 OC0 PB4 U0TX PB5 U0RX PB6 DBG_DATA PB7 DBG_CLK PC0 SSEL PC1 SSCK PC2 SMOSI PC3 SMISO PC7 RPWRUP Description Ground Ground on center pad of QFN, must be connected All digital inputs are Schmitt trigger inputs, digital input and output levels are LVCMOS/LVTTL compatible. Port A Pins (PA0 − PA7) must not be driven above VDD_IO, all other digital inputs are 5 V tolerant. Pull−ups are programmable for all GPIO pins. Alternate Pin Functions GPIO Pins are shared with dedicated Input/Output signals of on−chip peripherals. The following table lists the available functions on each GPIO pin. Alternate Functions IC1 ADC0 OC1 ADC1 U1RX ADC2 ADC3 COMPO0 ADC4 U1TX ADC5 ADCTRIG ADC6 COMPO1 ADC7 IC1 EXTIRQ0 OC1 T2OUT T2CLK EXTIRQ1 T1CLK T1OUT COMPI00 LPXTALP LPXTALN COMPI10 COMPI01 COMPI11 DSWAKE T0OUT T0CLK U0TX U0RX EXTIRQ0 COMPO1 COMPO0 www.onsemi.com 5 5 Page AX8052F131 Table 9. TRANSMITTER Symbol Description Condition Min SBR Signal bit rate ASK 1 PSK 10 FSK, (Note 2) 1 802.15.4 (DSSS) ASK and PSK 1 802.15.4 (DSSS) FSK 1 PTX868 Transmitter power @ 868 MHz TXRNG = 1111 PTX433 Transmitter power @ 433 MHz TXRNG = 1111 PTX868−harm2 Emission @ 2nd harmonic (Note 1) PTX868−harm3 Emission @ 3rd harmonic 1. Additional low−pass filtering was applied to the antenna interface, see applications section. 2. 1 − 200 kbps with a 16 MHz crystal, 200 − 350 kbps with 24 MHz crystal Typ 15 16 −50 −55 Table 10. LOW FREQUENCY CRYSTAL OSCILLATOR Symbol Description Condition fLPXTAL gmlpxosc Crystal frequency Transconductance oscillator LPXOSCGM = 00110 LPXOSCGM = 01000 LPXOSCGM = 01100 LPXOSCGM = 10000 RINlpxosc Input DC impedance Min Typ 32 3.5 4.6 6.9 9.1 10 Max 2000 2000 350 40 16 Max 150 Units kbps dBm dBm dBc Units kHz ms MW Table 11. INTERNAL LOW POWER OSCILLATOR Symbol Description Condition fLPOSC Oscillation Frequency LPOSCFAST = 0 Factory calibration applied. Over the full temperature and voltage range LPOSCFAST = 1 Factory calibration applied. Over the full temperature and voltage range Min Typ Max 630 640 650 10.08 10.24 10.39 Units Hz kHz Table 12. INTERNAL RC OSCILLATOR Symbol Description fFRCOSC Oscillation Frequency Condition Min Typ Max Units Factory calibration applied. Over the 19.8 20 20.2 MHz full temperature and voltage range www.onsemi.com 11 11 Page

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