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GB3225 の電気的特性と機能

GB3225のメーカーはON Semiconductorです、この部品の機能は「Preconfigured DSP System」です。


製品の詳細 ( Datasheet PDF )

部品番号 GB3225
部品説明 Preconfigured DSP System
メーカ ON Semiconductor
ロゴ ON Semiconductor ロゴ 




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GB3225 Datasheet, GB3225 PDF,ピン配置, 機能
PARAGON GB3225
Preconfigured DSP System
for Hearing Aids
Description
The Paragon GB3225 hybrid is a programmable DSP system based
on a multichannel compression circuit. It can be used as a platform
for a wide range of hearing aid applications. Its extensive
programmability and compact size make it ideal for sophisticated CIC
applications. The reflowable thinSTAX® packaging enables easy
integration into BTE applications. This very versatile DSP hybrid is
capable of multiple configurations and has a wide range of functions.
The Paragon GB3225 hybrid contains the GC5057 controller chip
featuring Power On Reset (POR).
The Paragon GB3225 hybrid code programmed into the GC5057
controller chip is “9”.
Features
Highly Configurable, Versatile DSP Platform
High Fidelity, Multichannel AGC Signal Processing
93 dB Input Dynamic Range with HRXt Headroom Extension
Fully Programmable via Serial Data Interface
High Performance Data Converters – Dual, Oversampled A/Ds;
Oversampled D/A with Efficient Switchedmode Output Power Amp
Highfidelity Audio Quality
Drives Zerobias 2terminal Receivers
Multiple Communication Rates up to 85.3 kb/s
thinSTAX Packaging CIC Size
Multimemory
Internal/External Volume Control
Volume Control Taper determined by External VC
Tristate Memory Select Operation
Audible Memory Change Indicator
Also Available as E1 RoHS Compliant Hybrid
thinSTAX Packaging
Hybrid Typical Dimensions:
0.227 x 0.125 x 0.060 in
(5.76 x 3.18 x 1.52 mm)
http://onsemi.com
14 PAD
PARAGON
CASE TBD
PAD CONNECTION
RREG
RMIC
RGND
VC
SDA
PGND
OUT
7
6
5
4
3
2
1
8 FREG
9 FMIC
10 FGND
11 T
12 MS
13 VB
14 OUT+
(Bottom View)
MARKING DIAGRAM
GB3225E1
XXXXXX
GB3225
E1
XXXXXX
= Specific Device Code
= RoHS Compliant Hybrid
= Work Order Number
ORDERING INFORMATION
Device
Shipping
GB3225E1
25 Units / Bubble Pack
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2014
February, 2014 Rev. 2
1
Publication Order Number:
GB3225/D

1 Page





GB3225 pdf, ピン配列
PARAGON GB3225
Table 2. ELECTRICAL CHARACTERISTICS (Conditions: VB = 1.3 V; Temperature = 25°C)
Parameter
Symbol
Conditions
Min Typ Max Units
Hybrid Current
Minimum Operating Supply Voltage
Supply Voltage Turn On Threshold
Supply Voltage Hysteresis
IAMP
VBOFF
VBON
See current consumption section
Ramp down
Ramp up
0.94
1.06
90
700
1.0
1.10
100
1.05
1.16
110
mA
V
V
mV
Supply Voltage during
Communication
VBC
During Communication
1.19 1.35
1.5
V
Hybrid Current during Communication
EEPROM Burn Cycles
IP
Programming (<5 ms)
(Note 2)
100 k
3.7
mA
cycles
Low Frequency System Bandwidth
100 140 225
Hz
High Frequency System Bandwidth
15.2 16 16.8 kHz
Total Maximum System Gain
AV
sVqIuNe=lch9d5isdaBbVledat(3NoktHez1; )
81 83 85 dB
Converter Gain
Total Harmonic Distortion
THD at Maximum Input
Clock Frequency
REGULATOR
ACONV
THD
THDM
fclk
A/D + D/A gain
VIN = 40 dBV
VIN = 15 dBV, HRX ON
27
1.945
29
0.05
1.5
2.048
31
1
3
2.151
dB
%
%
MHz
Regulator Voltage
Regulator Supply Rejection
INPUT
VREG
PSRRREG
0.90 0.95 1.00
50
V
dB
Input Referred Noise
IRN Bandwidth 100 Hz 8 kHz
108
106
dBV
Input Impedance
Antialias Filter Rejection
(input referred)
Maximum Input Level
ZIN 11.2 16 22 kW
f = fclk 8 kHz,
80 dB
VIN = 40 dBV
− − − −15 dBV
Input Dynamic Range
HRX ON, 93 dB
Bandwidth 100 Hz 8 kHz
Audio Sample Rate
− − 30.4 32 33.6 kHz
A/D Dynamic Range
Bandwidth 100 Hz 8 kHz
86 dB
OUTPUT
Maximum RMS Output Voltage
0 dBFS f = 1 kHz
3 1
1 dBV
D/A Dynamic Range
Bandwidth 100 Hz 8 kHz
80
dB
Output Impedance
VOLUME CONTROL
ZOUT
(Note 2)
− − 20 W
Volume Control Resistance
Volume Control Range
MS INPUT
RVC
DA
160 200 240
kW
47.5 48 48.5 dB
Low State
Lo 0 VREG/3 V
Open State
Z
VREG/3
2VREG/3 V
High State
Hi
2VREG/3
VB
V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. Total System Gain consists of: Wideband System Gain + High and Low Independent Channel Gains + Converter Gain.
Total System Gain is calibrated during Cal/Config process.
2. Sample tested.
http://onsemi.com
3


3Pages


GB3225 電子部品, 半導体
PARAGON GB3225
Table 3. PAD POSITION AND DIMENSIONS
Pad Position
Pad No.
X
10
2 31.5
3 63.0
4 94.0
5 125.0
6 156.0
7 187.0
8 187.0
9 156.0
10 125.0
11 94.0
12 63.0
13 31.5
14 0
Pad No.
X
10
2 0.800
3 1.600
4 2.388
5 3.175
6 3.962
7 4.750
8 4.750
9 3.962
10 3.175
11 2.388
12 1.600
13 0.800
14 0
Y
0
3
3
3
3
3
3
64.5
64.5
64.5
64.5
64.5
64.5
67.5
Y
0
0.076
0.076
0.076
0.076
0.076
0.076
0.076
1.638
1.638
1.638
1.638
1.638
1.715
Pad Dimensions
Xdim (mil)
Ydim (mil)
23.0 40.5
24.0 46.5
23.0 46.5
23.0 46.5
23.0 46.5
23.0 46.5
23.0 46.5
23.0 46.5
23.0 46.5
23.0 46.5
23.0 46.5
23.0 46.5
24.0 46.5
23.0 40.5
Xdim (mm)
Ydim (mm)
0.584
1.029
0.584
1.181
0.584
1.181
0.584
1.181
0.584
1.181
0.584
1.181
0.584
1.181
0.584
1.181
0.584
1.181
0.584
1.181
0.610
1.181
0.584
1.181
0.584
1.181
0.584
1.029
http://onsemi.com
6

6 Page



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共有リンク

Link :


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GB3221

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