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PDF G5699 Data sheet ( Hoja de datos )
| Número de pieza | G5699 | |
| Descripción | 1A Synchronous Step-Down Regulator | |
| Fabricantes | Global Mixed-mode Technology | |
| Logotipo |  |
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Global Mixed-mode Technology Inc.
G5699
Dual 1.4MHz, 1A Synchronous Step-Down Regulator
Features
High Efficiency: Up to 95%
Internal Soft Start Function
Output Current
Channel 1: 1A
Channel 2: 1A
2.7V to 5.5V Input Voltage Range
1.4MHz Switching Frequency
No Schottky Diode Required
100% Duty Cycle in Dropout Operation
0.6V Reference Allows Low Output Voltages
<1µA Shutdown Current
Current Mode Operation for Excellent Line and
Load Transient Response
Over Temperature Protected
RoHS Compliant
Applications
Cellular Telephones
Personal Information Appliances
Microprocessors and DSP Core Supplies
Wireless and DSL Modems
Digital Still and Video Cameras
MP3 Players
Portable Instruments
General Description
The G5699 is a dual channel high efficiency monolithic
synchronous buck regulator using a constant fre-
quency, current mode architecture. Supply current
during operation is only 50μA and drops to <1μA in
shutdown for each channel. The 2.7V to 5.5V input
voltage range makes the G5699 ideally suited for sin-
gle Li-Ion battery-powered applications. Both regula-
tors have independent input and enable pins. 100%
duty cycle provides low dropout operation, extending
battery run time in portable systems. Switching fre-
quency is internally set at 1.4MHz, allowing the use of
small surface mount inductors and capacitors. The
internal synchronous switch increase efficiency and
eliminates the need for an external Schottky diode.
Built-in soft start function eliminates in-rush current
that could damage the system. The G5699 is available
in TDFN3X3-12 package.
Ordering Information
ORDER
NUMBER
MARKING
G5699RQ1U 5699
Note: RQ: TDFN3X3-12
1: Bonding Code
U: Tape & Reel
TEMP.
RANGE
-40°C~ +85°C
PACKAGE
(Green)
TDFN3X3-12
Pin Configuration
VIN2 1
LX2 2
GND 3
FB1 4
NC1 5
EN1 6
G5699
G5625
Thermal
Pad
12 EN2
11 NC2
10 FB2
9 GND
8 LX1
7 VIN1
TDFN3X3-12
Note: Recommend connecting the Thermal Pad to
the Ground for excellent power dissipation.
Typical Application Circuit
VIN1
CIN1
4.7µF
CER
G5699
VIN1
LX1
EN1
FB1
2.2µH
VOUT1
CFB1*
(option)
R1
R2
COUT1
4.7µF
CER
VIN2
CIN2
4.7µF
CER
VIN2
LX2
EN2
FB2
VOUT1 = 0.6V • (1+
R1 )
R2
VOUT2 = 0.6V • (1+
R3 )
R4
2.2µH
VOUT2
CFB2*
(option)
R3
R4
COUT2
4.7µF
CER
* Refer to Table. 1 for Component Selection
Ver: 0.5
Jul 23, 2009
TEL: 886-3-5788833
http://www.gmt.com.tw
1
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| Páginas | Total 1 Páginas | |
| PDF Descargar | [ Datasheet G5699.PDF ] | |
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