DataSheet.jp

R5F51135ADFP の電気的特性と機能

R5F51135ADFPのメーカーはRenesasです、この部品の機能は「32-Bit MCU」です。


製品の詳細 ( Datasheet PDF )

部品番号 R5F51135ADFP
部品説明 32-Bit MCU
メーカ Renesas
ロゴ Renesas ロゴ 




このページの下部にプレビューとR5F51135ADFPダウンロード(pdfファイル)リンクがあります。

Total 30 pages

No Preview Available !

R5F51135ADFP Datasheet, R5F51135ADFP PDF,ピン配置, 機能
Cover
RX113 Group
32
User’s Manual: Hardware
RENESAS 32-Bit MCU
RX Family / RX100 Series
All information contained in these materials, including products and product specifications,
represents information on the product at the time of publication and is subject to change by
Renesas Electronics Corp. without notice. Please review the latest information published by
Renesas Electronics Corp. through various means, including the Renesas Electronics Corp.
website (http://www.renesas.com).
www.renesas.com
Rev.1.02 Dec 2014

1 Page





R5F51135ADFP pdf, ピン配列
NOTES FOR CMOS DEVICES
(1) VOLTAGE APPLICATION WAVEFORM AT INPUT PIN: Waveform distortion due to input noise or a
reflected wave may cause malfunction. If the input of the CMOS device stays in the area between VIL
(MAX) and VIH (MIN) due to noise, etc., the device may malfunction. Take care to prevent chattering noise
from entering the device when the input level is fixed, and also in the transition period when the input level
passes through the area between VIL (MAX) and VIH (MIN).
(2) HANDLING OF UNUSED INPUT PINS: Unconnected CMOS device inputs can be cause of malfunction.
If an input pin is unconnected, it is possible that an internal input level may be generated due to noise, etc.,
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of
CMOS devices must be fixed high or low by using pull-up or pull-down circuitry. Each unused pin should be
connected to VDD or GND via a resistor if there is a possibility that it will be an output pin. All handling
related to unused pins must be judged separately for each device and according to related specifications
governing the device.
(3) PRECAUTION AGAINST ESD: A strong electric field, when exposed to a MOS device, can cause
destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop
generation of static electricity as much as possible, and quickly dissipate it when it has occurred.
Environmental control must be adequate. When it is dry, a humidifier should be used. It is recommended
to avoid using insulators that easily build up static electricity. Semiconductor devices must be stored and
transported in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work benches and floors should be grounded. The operator should be grounded using a
wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be
taken for PW boards with mounted semiconductor devices.
(4) STATUS BEFORE INITIALIZATION: Power-on does not necessarily define the initial status of a MOS
device. Immediately after the power source is turned ON, devices with reset functions have not yet been
initialized. Hence, power-on does not guarantee output pin levels, I/O settings or contents of registers. A
device is not initialized until the reset signal is received. A reset operation must be executed immediately
after power-on for devices with reset functions.
(5) POWER ON/OFF SEQUENCE: In the case of a device that uses different power supplies for the internal
operation and external interface, as a rule, switch on the external power supply after switching on the internal
power supply. When switching the power supply off, as a rule, switch off the external power supply and then
the internal power supply. Use of the reverse power on/off sequences may result in the application of an
overvoltage to the internal elements of the device, causing malfunction and degradation of internal elements
due to the passage of an abnormal current. The correct power on/off sequence must be judged separately
for each device and according to related specifications governing the device.
(6) INPUT OF SIGNAL DURING POWER OFF STATE : Do not input signals or an I/O pull-up power supply
while the device is not powered. The current injection that results from input of such a signal or I/O pull-up
power supply may cause malfunction and the abnormal current that passes in the device at this time may
cause degradation of internal elements. Input of signals during the power off state must be judged
separately for each device and according to related specifications governing the device.


3Pages


R5F51135ADFP 電子部品, 半導体
How to Use This Manual
1. Objective and Target Users
This manual was written to explain the hardware functions and electrical characteristics of this LSI to the target
users, i.e. those who will be using this LSI in the design of application systems. Target users are expected to
understand the fundamentals of electrical circuits, logic circuits, and microcomputers.
This manual is organized in the following items: an overview of the product, descriptions of the CPU, system
control functions, and peripheral functions, electrical characteristics of the device, and usage notes.
When designing an application system that includes this LSI, take all points to note into account.
Points to note are given in their contexts and at the final part of each section, and in the section giving usage notes.
The list of revisions is a summary of major points of revision or addition for earlier versions. It does not cover all
revised items. For details on the revised points, see the actual locations in the manual.
The following documents have been prepared for the RX113 Group. Before using any of the documents, please visit
our website to verify that you have the most up-to-date available version of the document.
Document Type
Datasheet
User’s Manual:
Hardware
User’s Manual:
Software
Application Note
Renesas Technical
Update
Contents
Overview of hardware and electrical characteristics
Hardware specifications (pin assignments, memory maps,
peripheral specifications, electrical characteristics, and
timing charts) and descriptions of operation
Detailed descriptions of the CPU and instruction set
Examples of applications and sample programs
Preliminary report on the specifications of a product,
document, etc.
Document Title
RX113 Group
Datasheet
RX113 Group
User’s Manual:
Hardware
RX Family
User’s Manual:
Software
Document No.
R01DS0216EJ
This document
R01US0032EJ

6 Page



ページ 合計 : 30 ページ
 
PDF
ダウンロード
[ R5F51135ADFP データシート.PDF ]


データシートを活用すると、その部品の主な機能と仕様を詳しく理解できます。 ピン構成、電気的特性、動作パラメータ、性能を確認してください。


共有リンク

Link :


部品番号部品説明メーカ
R5F51135ADFM

32-Bit MCU

Renesas
Renesas
R5F51135ADFP

32-Bit MCU

Renesas
Renesas


www.DataSheet.jp    |   2020   |  メール    |   最新    |   Sitemap