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BC848 の電気的特性と機能

BC848のメーカーはNXP Semiconductorsです、この部品の機能は「100 mA NPN general-purpose transistors」です。


製品の詳細 ( Datasheet PDF )

部品番号 BC848
部品説明 100 mA NPN general-purpose transistors
メーカ NXP Semiconductors
ロゴ NXP Semiconductors ロゴ 




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BC848 Datasheet, BC848 PDF,ピン配置, 機能
BC848 series
30 V, 100 mA NPN general-purpose transistors
Rev. 07 — 17 November 2009
Product data sheet
1. Product profile
1.1 General description
NPN general-purpose transistors in Surface Mounted Device (SMD) plastic packages.
Table 1. Product overview
Type number
Package
NXP
BC848B
SOT23
BC848W
SOT323
JEITA
-
SC-70
JEDEC
TO-236AB
-
PNP
complement
BC858B
BC858W
1.2 Features
„ General-purpose transistors
„ SMD plastic packages
1.3 Applications
„ General-purpose switching and amplification
1.4 Quick reference data
Table 2.
Symbol
VCEO
IC
hFE
Quick reference data
Parameter
collector-emitter voltage
collector current
DC current gain
BC848B
BC848W
Conditions
open base
VCE = 5 V;
IC = 2 mA
Min Typ Max Unit
- - 30 V
- - 100 mA
200 290 450
110 -
800

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BC848 pdf, ピン配列
NXP Semiconductors
BC848 series
30 V, 100 mA NPN general-purpose transistors
5. Limiting values
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
VCBO
VCEO
VEBO
IC
ICM
IBM
Ptot
collector-base voltage
collector-emitter voltage
emitter-base voltage
collector current
peak collector current
peak base current
total power dissipation
SOT23
open emitter
open base
open collector
single pulse;
tp 1 ms
single pulse;
tp 1 ms
Tamb 25 °C
-
-
-
-
-
-
[1]
-
SOT323
-
Tj
Tamb
Tstg
junction temperature
ambient temperature
storage temperature
-
65
65
Max Unit
30 V
30 V
5V
100 mA
200 mA
200 mA
250
200
150
+150
+150
mW
mW
°C
°C
°C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
6. Thermal characteristics
Table 7.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
SOT23
SOT323
Conditions
in free air
Min
[1]
-
-
Typ Max
- 500
- 625
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Unit
K/W
K/W
BC848_SER_7
Product data sheet
Rev. 07 — 17 November 2009
© NXP B.V. 2009. All rights reserved.
3 of 12


3Pages


BC848 電子部品, 半導体
NXP Semiconductors
8. Package outline
BC848 series
30 V, 100 mA NPN general-purpose transistors
2.5 1.4
2.1 1.2
3.0
2.8
3
1.1
0.9
0.45
0.15
2.2 1.35
2.0 1.15
2.2
1.8
3
1.1
0.8
0.45
0.15
1
Dimensions in mm
1.9
2
0.48
0.38
0.15
0.09
04-11-04
1
Dimensions in mm
1.3
2
0.4
0.3
0.25
0.10
04-11-04
Fig 5. Package outline SOT23 (TO-236AB)
Fig 6. Package outline SOT323 (SC-70)
9. Packing information
Table 9. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package
Description
BC848B
BC848W
SOT23
SOT323
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
Packing quantity
3 000
10 000
-215
-235
-115 -135
[1] For further information and the availability of packing methods, see Section 14.
BC848_SER_7
Product data sheet
Rev. 07 — 17 November 2009
© NXP B.V. 2009. All rights reserved.
6 of 12

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