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What is IS1871?

This electronic component, produced by the manufacturer "Microchip", performs the same function as "Bluetooth Low Energy (BLE) SoC".


IS1871 Datasheet PDF - Microchip

Part Number IS1871
Description Bluetooth Low Energy (BLE) SoC
Manufacturers Microchip 
Logo Microchip Logo 


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IS1870/71
Bluetooth® Low Energy (BLE) SoC
Features
• Bluetooth smart 4.2 Bluetooth Low-Energy (BLE)
compliant
• 256K bytes embedded Flash memory
• UART/SPI/I2C interface supported
• Integrated crystal oscillator, operates with 32 MHz
external crystal
• Temperature sensor supported
• Flexible 31 GPIO pins for IS1870 and 16 GPIO
pins for IS1871 configuration
• 4-channel PWM support (IS1870), 1-channel
PWM support (IS1871)
• 12 bits ADC support for battery and voltage detec-
tion. 16-channel (IS1870)/6-channel (IS1871)
• AES-CMAC hardware engine
• Beacon support
• Low-power consumption
• Peak current: Tx 13 mA, Rx 13 mA at VBAT=3.0V,
buck power
• Compact size: 4x4 mm 32QFN (IS1871) and
6x6mm 48QFN (IS1870) packages
Radio Frequency (RF)/Analog Features
• ISM band 2.402 GHz to 2.480 GHz operation
• Channels: 0-39
• Rx sensitivity: -90 dBm in BLE mode
• Tx power: +2 dBm (max)
• Received Signal Strength Indicator (RSSI) moni-
tor
Operating Conditions
• Operating voltage: 1.9V to 3.6V
• Operating temperature: -20°C to 70°C
Packages
Type
IS1870
Note:
Pin Count
48
I/O Pins (up to)
31
Contact/Lead Pitch
0.4
Dimensions
6x6x0.9
Package
QFN48
All dimensions are in millimeters (mm) unless specified otherwise.
Applications
• Internet of Things (IoT)
• Wearable/Fitness/Healthcare
• Weight Scale
• Proximity/Find Me services
• Payment/Security
• Digital Beacons
• Consumer Appliances/Home Automation
• Industrial
IS1871
32
16
0.4
4x4x0.9
QFN32
2015 Microchip Technology Inc.
Preliminary
DS60001371B-Page 1

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IS1871 equivalent
IS1870/71
1.0 DEVICE OVERVIEW
Microchip Technology IS1870/71 embedded 2.4 GHz
Bluetooth version 4.2 (BLE) SoC incorporates, 2.4 GHz
transceiver, Power Management Unit (PMU), Bluetooth
LE stack and RF power amplifier. The user can embed
the Bluetooth functionality to IoT applications.
The IS1870/71 is cost effective and designed to provide
developers a simple Bluetooth solution with the following fea-
tures:
• Ease of integration by UART transparent service
• Reduced development time for Bluetooth LE
stacks
• Integrated solution, thus reducing the cost
• Inter-operability with Apple® iOS and Android™
OS
• Maximum value in the range of applications
The IS1870/71 provides support for the Beacon
technology and improves user experiences in IoT
applications, such as auto connection/control and
cloud connectivity.
The IS1870/71 can maintain a low-power wireless con-
nection. The low-power consumption and flexible
power management maximizes the IS1870/71 lifetime
in battery operated devices. A wide operating tempera-
ture range allows use in indoor and outdoor environ-
ments (industrial temperature range).
The small-form factor package size of the IS1870/71 is
designed for wearable applications. The solution pro-
viders can minimize the module size to meet the mar-
ket requirement. The IS187x SoC is designed for the
application-enabled accessories and IoT applications.
Operating in the 2.4 GHz ISM band radio, the
IS1870/71 is certified for the Bluetooth core specifica-
tion version 4.2 including support for the enhanced
throughput, and the Federal Information Processing
Standard (FIPS) compliant encryption support for
secure data connections.
The IS1870/71 integrates transceiver and baseband
functions to decrease the external components. There-
fore, users can complete their design easily and effi-
ciently. A free Bluetooth stack firmware is provided for
building embedded BLE solutions that use the
IS1870/71 SoC.
For portable and wearable applications, the IS1870/71
SoC’s optimized power design helps to minimize cur-
rent consumption for extended battery life and it mini-
mizes the package size to as small as possible.
Figure 1-1 and Figure 1-2 illustrate a typical example of
the IS1870 and IS1871-based system. Table 1-1
provides key features of the IS1870/71 module.
FIGURE 1-1:
IS1870-BASED SYSTEM BLOCK DIAGRAM
2015 Microchip Technology Inc.
Preliminary
DS60001371B-Page 5


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Part Details

On this page, you can learn information such as the schematic, equivalent, pinout, replacement, circuit, and manual for IS1871 electronic component.


Information Total 30 Pages
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