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HCPL-4506 PDF Datasheet ( 特性, スペック, ピン接続図 )

部品番号 HCPL-4506
部品説明 Intelligent Power Module and Gate Drive Interface Optocouplers
メーカ Avago
ロゴ Avago ロゴ 



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HCPL-4506 Datasheet, HCPL-4506 PDF,ピン配置, 機能
HCPL-4506/J456/0466, HCNW4506
Intelligent Power Module and Gate Drive Interface Optocouplers
Data Sheet
Lead (Pb) Free
RoHS 6 fully
compliant
RoHS 6 fully compliant options available;
-xxxE denotes a lead-free product
Description
The HCPL-4506 and HCPL-0466 contain a GaAsP LED while
the HCPL-J456 and the HCNW4506 con­tain an AlGaAs LED.
The LED is optically coupled to an inte­grated high gain
photo detector. Minimized propagation delay difference
between devices makes these optocouplers excellent so-
lutions for improving inverter efficiency through reduced
switching dead time.
An on chip 20 kΩ output pull-up resistor can be enabled by
shorting output pins 6 and 7, thus eliminating the need for
an external pull-up resistor in common IPM applications.
Specifications and performance plots are given for typical
IPM applications.
Functional Diagram
NC 1
ANODE 2
20 k
8 VCC
7 VL
CATHODE 3
6 VO
NC 4
SHIELD
5 GND
Features
Performance specified for bommon IPM applications
over industrial temperature range: -40°C to 100°C
Fast maximum propagation delays
tPHL = 480 ns
tPLH = 550 ns
Minimized Pulse Width Distortion
PWD = 450 ns
15 kV/µs minimum common mode transient immu-
nity
at VCM = 1500 V
CTR > 44% at IF = 10 mA
Safety approval:
UL Recognized
-3750 V rms / 1 min. for HCPL-4506/0466/J456
-5000 V rms / 1 min. for HCPL-4506 Option 020
and HCNW4506
  CSA Approved
IEC/EN/DIN EN 60747-5-2 Approved
-VIORM = 560 Vpeak for HCPL-0466 Option 060
-VIORM = 630 Vpeak for HCPL-4506 Option 060
-VIORM = 891 Vpeak for HCPL-J456
-VIORM = 1414 Vpeak for HCNW4506
Truth Table
LED
VO
HOCNP L-4506 Functional DiaLgram
OFF
H
The connection of a 0.1 µF bypass capacitor
between pins 5 and 8 is recommended.
Applications
IPM isolation
Isolated IGBT/MOSFET gate drive
AC and brushless DC motor drives
Industrial inverters
CAUTION: It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.

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