DataSheet.jp

UPD70F3738 の電気的特性と機能

UPD70F3738のメーカーはRenesasです、この部品の機能は「32-bit Single-Chip Microcontrollers」です。


製品の詳細 ( Datasheet PDF )

部品番号 UPD70F3738
部品説明 32-bit Single-Chip Microcontrollers
メーカ Renesas
ロゴ Renesas ロゴ 




このページの下部にプレビューとUPD70F3738ダウンロード(pdfファイル)リンクがあります。

Total 30 pages

No Preview Available !

UPD70F3738 Datasheet, UPD70F3738 PDF,ピン配置, 機能
User’s Manual
V850ES/JG3-L
32-bit Single-Chip Microcontrollers
Hardware
μPD70F3737
μPD70F3738
μPD70F3792
μPD70F3793
Document No. U18953EJ5V0UD00 (5th edition)
Date Published December 2009 NS
2007

1 Page





UPD70F3738 pdf, ピン配列
NOTES FOR CMOS DEVICES
1 VOLTAGE APPLICATION WAVEFORM AT INPUT PIN
Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the
CMOS device stays in the area between VIL (MAX) and VIH (MIN) due to noise, etc., the device may
malfunction. Take care to prevent chattering noise from entering the device when the input level is fixed,
and also in the transition period when the input level passes through the area between VIL (MAX) and
VIH (MIN).
2 HANDLING OF UNUSED INPUT PINS
Unconnected CMOS device inputs can be cause of malfunction. If an input pin is unconnected, it is
possible that an internal input level may be generated due to noise, etc., causing malfunction. CMOS
devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed
high or low by using pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND
via a resistor if there is a possibility that it will be an output pin. All handling related to unused pins must
be judged separately for each device and according to related specifications governing the device.
3 PRECAUTION AGAINST ESD
A strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as
much as possible, and quickly dissipate it when it has occurred. Environmental control must be
adequate. When it is dry, a humidifier should be used. It is recommended to avoid using insulators that
easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static
container, static shielding bag or conductive material. All test and measurement tools including work
benches and floors should be grounded. The operator should be grounded using a wrist strap.
Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for
PW boards with mounted semiconductor devices.
4 STATUS BEFORE INITIALIZATION
Power-on does not necessarily define the initial status of a MOS device. Immediately after the power
source is turned ON, devices with reset functions have not yet been initialized. Hence, power-on does
not guarantee output pin levels, I/O settings or contents of registers. A device is not initialized until the
reset signal is received. A reset operation must be executed immediately after power-on for devices
with reset functions.
5 POWER ON/OFF SEQUENCE
In the case of a device that uses different power supplies for the internal operation and external
interface, as a rule, switch on the external power supply after switching on the internal power supply.
When switching the power supply off, as a rule, switch off the external power supply and then the
internal power supply. Use of the reverse power on/off sequences may result in the application of an
overvoltage to the internal elements of the device, causing malfunction and degradation of internal
elements due to the passage of an abnormal current.
The correct power on/off sequence must be judged separately for each device and according to related
specifications governing the device.
6 INPUT OF SIGNAL DURING POWER OFF STATE
Do not input signals or an I/O pull-up power supply while the device is not powered. The current
injection that results from input of such a signal or I/O pull-up power supply may cause malfunction and
the abnormal current that passes in the device at this time may cause degradation of internal elements.
Input of signals during the power off state must be judged separately for each device and according to
related specifications governing the device.
User’s Manual U18953EJ5V0UD
3


3Pages


UPD70F3738 電子部品, 半導体
PREFACE
Readers
Purpose
Organization
This manual is intended for users who wish to understand the functions of the
V850ES/JG3-L and design application systems using these products.
This manual is intended to give users an understanding of the hardware functions of
the V850ES/JG3-L shown in the Organization below.
This manual is divided into two parts: Hardware (this manual) and Architecture
(V850ES Architecture User’s Manual).
Hardware
Pin functions
CPU function
On-chip peripheral functions
Flash memory programming
Electrical specifications
Architecture
Data types
Register set
Instruction format and instruction set
Interrupts and exceptions
Pipeline operation
How to Read This Manual
It is assumed that the readers of this manual have general knowledge in the fields of
electrical engineering, logic circuits, and microcontrollers.
To understand the overall functions of the V850ES/JG3-L
Read this manual according to the CONTENTS.
To find the details of a register where the name is known
Use APPENDIX C REGISTER INDEX.
Register format
The name of the bit whose number is in angle brackets (<>) in the figure of the
register format of each register is defined as a reserved word in the device file.
To understand the details of an instruction function
Refer to the V850ES Architecture User’s Manual available separately.
To know the electrical specifications of the V850ES/JG3-L
See CHAPTER 32 ELECTRICAL SPECIFICATIONS
( μ PD70F3737, 70F3738).
See CHAPTER 33 ELECTRICAL SPECIFICATIONS (Target)
( μ PD70F3792, 70F3793).
The “yyy bit of the xxx register” is described as the “xxx.yyy bit” in this manual. Note
with caution that if “xxx.yyy” is described as is in a program, however, the
compiler/assembler cannot recognize it correctly.
The mark <R> shows major revised points from 3rd edition and 4th edition. The
revised points can be easily searched by copying an “<R>” in the PDF file and
specifying it in the "Find what:" field.
6 User’s Manual U18953EJ5V0UD

6 Page



ページ 合計 : 30 ページ
 
PDF
ダウンロード
[ UPD70F3738 データシート.PDF ]


データシートを活用すると、その部品の主な機能と仕様を詳しく理解できます。 ピン構成、電気的特性、動作パラメータ、性能を確認してください。


共有リンク

Link :


部品番号部品説明メーカ
UPD70F3731

32-Bit Single-Chip Microcontroller

NEC Electronics
NEC Electronics
UPD70F3732

32-Bit Single-Chip Microcontroller

NEC Electronics
NEC Electronics
UPD70F3733

32-Bit Single-Chip Microcontroller

NEC Electronics
NEC Electronics
UPD70F3734

32-Bit Single-Chip Microcontroller

NEC Electronics
NEC Electronics


www.DataSheet.jp    |   2020   |  メール    |   最新    |   Sitemap