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KLMAG2WEMB-B031のメーカーはSamsungです、この部品の機能は「eMMC」です。 |
部品番号 | KLMAG2WEMB-B031 |
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部品説明 | eMMC | ||
メーカ | Samsung | ||
ロゴ | |||
このページの下部にプレビューとKLMAG2WEMB-B031ダウンロード(pdfファイル)リンクがあります。 Total 25 pages
SAMSUNG CONFIDENTIAL
Rev. 1.0 Aug. 2013
KLMxGxxEMx-B031
Samsung e·MMC Product family
e.MMC 5.0 Specification compatibility
datasheet
SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND
SPECIFICATIONS WITHOUT NOTICE.
Products and specifications discussed herein are for reference purposes only. All information discussed
herein is provided on an "AS IS" basis, without warranties of any kind.
This document and all information discussed herein remain the sole and exclusive property of Samsung
Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property
right is granted by one party to the other party under this document, by implication, estoppel or other-
wise.
Samsung products are not intended for use in life support, critical care, medical, safety equipment, or
similar applications where product failure could result in loss of life or personal or physical harm, or any
military or defense application, or any governmental procurement to which special terms or provisions
may apply.
For updates or additional information about Samsung products, contact your nearest Samsung office.
All brand names, trademarks and registered trademarks belong to their respective owners.
ⓒ 2013 Samsung Electronics Co., Ltd. All rights reserved.
-1-
1 Page KLMxGxxEMx-B031
datasheet
SAMSUNG CONFIDENTIAL
Rev. 1.0
e·MMC
Table Of Contents
1.0 PRODUCT LIST.......................................................................................................................................................... 4
2.0 KEY FEATURES......................................................................................................................................................... 4
3.0 PACKAGE CONFIGURATIONS ................................................................................................................................. 5
3.1 153 Ball Pin Configuration ....................................................................................................................................... 5
3.1.1 11.5mm x 13mm x 0.8mm Package Dimension................................................................................................ 6
3.2 Product Architecture ................................................................................................................................................ 7
4.0 e.MMC 5.0 feature ...................................................................................................................................................... 8
4.1 HS400 mode............................................................................................................................................................ 8
5.0 Technical Notes .......................................................................................................................................................... 10
5.1 S/W Agorithm .......................................................................................................................................................... 10
5.1.1 Partition Management ....................................................................................................................................... 10
5.1.1.1 Boot Area Partition and RPMB Area Partition ............................................................................................ 10
5.1.1.2 Enhanced Partition (Area) .......................................................................................................................... 10
5.1.2 Boot operation................................................................................................................................................... 11
5.1.3 User Density...................................................................................................................................................... 12
5.1.4 Auto Power Saving Mode.................................................................................................................................. 12
5.1.5 Performance...................................................................................................................................................... 13
6.0 REGISTER VALUE ..................................................................................................................................................... 14
6.1 OCR Register .......................................................................................................................................................... 14
6.2 CID Register ............................................................................................................................................................ 14
6.2.1 Product name table (In CID Register) ............................................................................................................... 14
6.3 CSD Register........................................................................................................................................................... 15
6.4 Extended CSD Register .......................................................................................................................................... 16
7.0 AC PARAMETER........................................................................................................................................................ 21
7.1 Timing Parameter .................................................................................................................................................... 21
7.2 Previous Bus Timing Parameters for DDR52 and HS200 mode are defined by JEDEC standard.......................... 21
7.3 Bus Timing Specification in HS400 mode ............................................................................................................... 22
7.3.1 HS400 Device Input Timing .............................................................................................................................. 22
7.3.2 HS400 Device Output Timing............................................................................................................................ 23
7.4 Bus signal levels...................................................................................................................................................... 24
7.4.1 Open-drain mode bus signal level..................................................................................................................... 24
7.4.2 Push-pull mode bus signal level eMMC ............................................................................................................ 24
8.0 DC PARAMETER ....................................................................................................................................................... 25
8.1 Active Power Consumption during operation .......................................................................................................... 25
8.2 Standby Power Consumption in auto power saving mode and standby state........................................................ 25
8.3 Sleep Power Consumption in Sleep State.............................................................................................................. 25
8.4 Supply Voltage ........................................................................................................................................................ 25
8.5 Bus Signal Line Load............................................................................................................................................... 26
IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION
IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR
HEADQUARTERS OF SAMSUNG ELECTRONICS.
-3-
3Pages KLMxGxxEMx-B031
datasheet
SAMSUNG CONFIDENTIAL
Rev. 1.0
e·MMC
3.1.1 11.5mm x 13mm x 0.8mm Package Dimension
11.50±0.10
#A1
TOP VIEW
0.08 MAX
A
(Datum B)
B
C
D
E
GHF
J
K
L
M
N
P
153-0.30±0.05
0.2 M A B
0.22±0.05
0.70±0.10
11.50±0.10
0.50 x 13 = 6.50
#A1 INDEX MARK
A
1413121110 9 8 7 6 5 4 3 2 1
B
(Datum A)
3.25
0.50
BOTTOM VIEW
Figure 2. 11.5mm x 13mm x 0.8mm Package Dimension
IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION
IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR
HEADQUARTERS OF SAMSUNG ELECTRONICS.
-6-
6 Page | |||
ページ | 合計 : 25 ページ | ||
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PDF ダウンロード | [ KLMAG2WEMB-B031 データシート.PDF ] |
データシートを活用すると、その部品の主な機能と仕様を詳しく理解できます。 ピン構成、電気的特性、動作パラメータ、性能を確認してください。 |
部品番号 | 部品説明 | メーカ |
KLMAG2WEMB-B031 | eMMC | Samsung |