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KLMAG2WEMB-B031 の電気的特性と機能

KLMAG2WEMB-B031のメーカーはSamsungです、この部品の機能は「eMMC」です。


製品の詳細 ( Datasheet PDF )

部品番号 KLMAG2WEMB-B031
部品説明 eMMC
メーカ Samsung
ロゴ Samsung ロゴ 




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KLMAG2WEMB-B031 Datasheet, KLMAG2WEMB-B031 PDF,ピン配置, 機能
SAMSUNG CONFIDENTIAL
Rev. 1.0 Aug. 2013
KLMxGxxEMx-B031
Samsung e·MMC Product family
e.MMC 5.0 Specification compatibility
datasheet
SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND
SPECIFICATIONS WITHOUT NOTICE.
Products and specifications discussed herein are for reference purposes only. All information discussed
herein is provided on an "AS IS" basis, without warranties of any kind.
This document and all information discussed herein remain the sole and exclusive property of Samsung
Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property
right is granted by one party to the other party under this document, by implication, estoppel or other-
wise.
Samsung products are not intended for use in life support, critical care, medical, safety equipment, or
similar applications where product failure could result in loss of life or personal or physical harm, or any
military or defense application, or any governmental procurement to which special terms or provisions
may apply.
For updates or additional information about Samsung products, contact your nearest Samsung office.
All brand names, trademarks and registered trademarks belong to their respective owners.
2013 Samsung Electronics Co., Ltd. All rights reserved.
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1 Page





KLMAG2WEMB-B031 pdf, ピン配列
KLMxGxxEMx-B031
datasheet
SAMSUNG CONFIDENTIAL
Rev. 1.0
e·MMC
Table Of Contents
1.0 PRODUCT LIST.......................................................................................................................................................... 4
2.0 KEY FEATURES......................................................................................................................................................... 4
3.0 PACKAGE CONFIGURATIONS ................................................................................................................................. 5
3.1 153 Ball Pin Configuration ....................................................................................................................................... 5
3.1.1 11.5mm x 13mm x 0.8mm Package Dimension................................................................................................ 6
3.2 Product Architecture ................................................................................................................................................ 7
4.0 e.MMC 5.0 feature ...................................................................................................................................................... 8
4.1 HS400 mode............................................................................................................................................................ 8
5.0 Technical Notes .......................................................................................................................................................... 10
5.1 S/W Agorithm .......................................................................................................................................................... 10
5.1.1 Partition Management ....................................................................................................................................... 10
5.1.1.1 Boot Area Partition and RPMB Area Partition ............................................................................................ 10
5.1.1.2 Enhanced Partition (Area) .......................................................................................................................... 10
5.1.2 Boot operation................................................................................................................................................... 11
5.1.3 User Density...................................................................................................................................................... 12
5.1.4 Auto Power Saving Mode.................................................................................................................................. 12
5.1.5 Performance...................................................................................................................................................... 13
6.0 REGISTER VALUE ..................................................................................................................................................... 14
6.1 OCR Register .......................................................................................................................................................... 14
6.2 CID Register ............................................................................................................................................................ 14
6.2.1 Product name table (In CID Register) ............................................................................................................... 14
6.3 CSD Register........................................................................................................................................................... 15
6.4 Extended CSD Register .......................................................................................................................................... 16
7.0 AC PARAMETER........................................................................................................................................................ 21
7.1 Timing Parameter .................................................................................................................................................... 21
7.2 Previous Bus Timing Parameters for DDR52 and HS200 mode are defined by JEDEC standard.......................... 21
7.3 Bus Timing Specification in HS400 mode ............................................................................................................... 22
7.3.1 HS400 Device Input Timing .............................................................................................................................. 22
7.3.2 HS400 Device Output Timing............................................................................................................................ 23
7.4 Bus signal levels...................................................................................................................................................... 24
7.4.1 Open-drain mode bus signal level..................................................................................................................... 24
7.4.2 Push-pull mode bus signal level eMMC ............................................................................................................ 24
8.0 DC PARAMETER ....................................................................................................................................................... 25
8.1 Active Power Consumption during operation .......................................................................................................... 25
8.2 Standby Power Consumption in auto power saving mode and standby state........................................................ 25
8.3 Sleep Power Consumption in Sleep State.............................................................................................................. 25
8.4 Supply Voltage ........................................................................................................................................................ 25
8.5 Bus Signal Line Load............................................................................................................................................... 26
IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION
IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR
HEADQUARTERS OF SAMSUNG ELECTRONICS.
-3-


3Pages


KLMAG2WEMB-B031 電子部品, 半導体
KLMxGxxEMx-B031
datasheet
SAMSUNG CONFIDENTIAL
Rev. 1.0
e·MMC
3.1.1 11.5mm x 13mm x 0.8mm Package Dimension
11.50±0.10
#A1
TOP VIEW
0.08 MAX
A
(Datum B)
B
C
D
E
GHF
J
K
L
M
N
P
153-0.30±0.05
0.2 M A B
0.22±0.05
0.70±0.10
11.50±0.10
0.50 x 13 = 6.50
#A1 INDEX MARK
A
1413121110 9 8 7 6 5 4 3 2 1
B
(Datum A)
3.25
0.50
BOTTOM VIEW
Figure 2. 11.5mm x 13mm x 0.8mm Package Dimension
IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION
IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR
HEADQUARTERS OF SAMSUNG ELECTRONICS.
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6 Page



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共有リンク

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部品番号部品説明メーカ
KLMAG2WEMB-B031

eMMC

Samsung
Samsung


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