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What is AR0833?

This electronic component, produced by the manufacturer "ON Semiconductor", performs the same function as "1/3.2-Inch 8 Mp CMOS Digital Image Sensor".


AR0833 Datasheet PDF - ON Semiconductor

Part Number AR0833
Description 1/3.2-Inch 8 Mp CMOS Digital Image Sensor
Manufacturers ON Semiconductor 
Logo ON Semiconductor Logo 


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AR0833: 1/3.2-Inch 8 Mp CMOS Digital Image Sensor
Features
1/3.2-Inch 8 Mp CMOS Digital Image Sensor
AR0833 Datasheet, Rev. H
For the latest datasheet, please visit www.onsemi.com
Features
• High-speed sensor supporting 8 Mp (4:3) 30 fps still
images and full HD 1080p30 video
• 1.4 pixel with ON Semiconductor A-PixHS™
technology providing best-in-class low-light
performance.
• Optional on-chip high-quality Bayer scaler to resize
image to desired size
• Data interfaces: two-, three-, and four-lane serial
mobile industry processor interface (MIPI)
• Bit-depth compression available for MIPI Interface:
10-8 and 10-6 to enable lower bandwidth receivers
for full frame rate applications
• On-chip temperature sensor
• On-die phase-locked loop (PLL) oscillator
• 5.6 Kb one-time programmable memory (OTPM) for
storing module information
• On-chip 8-bit VCM driver
• 3D synchronization controls to enable stereo video
capture
• Interlaced multi-exposure readout enabling High
Dynamic Range (HDR) still and video applications
• Programmable controls: gain, horizontal and vertical
blanking, auto black level offset correction,
frame size/rate, exposure, left–right and top–bottom
image reversal, window size, and panning
• Support for external mechanical shutter
• Support for external LED or Xenon flash
Applications
• Smart phones
• PC cameras
• Tablets
Table 1:
Key Performance Parameters
Parameter
Array Format
Primary modes
Typical Value
3264 x 2448
Full Resolution: 4:3 - 8 Mp at 30 fps
16:9 - 6 Mp at 30 fps
16:9 - 1080p HD at 30 fps
Table 1:
Key Performance Parameters
Parameter
Typical Value
Pixel size
1.4 m Back Side Illuminated (BSI)
Optical format
Die size
1/3.2-inch
6.86 mm x 6.44 mm (Area: 44.17 mm2)
Input Clock
Frequency
6 - 27 MHz
Interface
MIPI CSI-2 (2-, 3-, 4-lane modes supported.)
800 Mbps max MIPI clock speed per
lane.
Subsampling
modes
X - Bin2, Sum2 Skip: 2x, 4x
Y - Sum2, Skip: 2x, 4x, 8x
Output data
depth
10 bits raw or 8/6-bit DPCM
Analog gain
1x, 2x, 3x, 4x, 6x, 8x
High Quality
Bayer Scalar
Adjustable scaling up to 1/6x scaling
Temperature
sensor
10-bit, single instance on chip, controlled
by two-wire serial I/F
VCM AF driver 8-bit resolution with slew rate control
3-D support
Frame rate and exposure synchronization
Analog 2.5 - 3.1 V (2.8 V nominal)
Digital 1.14 - 1.3 V (1.2 V nominal)
Pixel
Supply OTPM
Voltage Read
2.5 - 3.1 V (2.8 V nominal)
1.7 - 1.9 V (1.8 V nominal)
I/O
1.7 - 1.9 V (1.8 V nominal) or
2.5 - 3.1 V (2.8 V nominal)
MIPI 1.14 - 1.3 V (1.2 V nominal)
Power
consumption
340 mW at 30 fps, 8 Mp
Responsivity
0.6 V/lux-sec
SNRMAX
36 dB
Dynamic Range 64 dB
Operating
Temperature
Range (at
junction) -TJ
-30°C to +70°C
AR0833_DS Rev. H Pub. 4/15 EN
1 ©Semiconductor Components Industries, LLC 2015,

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AR0833 equivalent
AR0833: 1/3.2-Inch 8 Mp CMOS Digital Image Sensor
List of Tables
List of Tables
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Key Performance Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Modes of Operation and Power Consumption at 100% FOV . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Available Part Numbers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Pad Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Independent Power and Ground Domains . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Inrush consideration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Power-up Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Power-down Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Address Space Regions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
Data Formats . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
Row Address Sequencing During Subsampling. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
Column Address Sequencing During Binning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
Row Address Sequencing During Binning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
Available Skip, Bin, and Sum Modes in the AR0833 Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
Minimum Frame Time and Blanking Numbers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
Recommended Analog Gain Setting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
VCM Driver Typical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54
Two-Wire Serial Register Interface Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57
Two-Wire Serial Interface Timing Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58
Electrical Characteristics (EXTCLK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58
Electrical Characteristics (Serial MIPI Pixel Data Interface) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60
DC Electrical Characteristics (Control Interface) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60
Maximum Value Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61
Typical Operating Current Consumption (MIPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61
Absolute Max Voltages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62
AR0833_DS Rev. H Pub. 4/15 EN
5 ©Semiconductor Components Industries, LLC, 2015.


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