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PDF STM32F411VC Data sheet ( Hoja de datos )

Número de pieza STM32F411VC
Descripción 32b MCU + FPU
Fabricantes STMicroelectronics 
Logotipo STMicroelectronics Logotipo



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No Preview Available ! STM32F411VC Hoja de datos, Descripción, Manual

STM32F411xC STM32F411xE
ARM® Cortex®-M4 32b MCU+FPU, 125 DMIPS, 512KB Flash,
128KB RAM, USB OTG FS, 11 TIMs, 1 ADC, 13 comm. interfaces
Datasheet - production data
Features
Dynamic Efficiency Line with BAM (Batch
Acquisition Mode)
Core: ARM® 32-bit Cortex®-M4 CPU with
FPU, Adaptive real-time accelerator (ART
Accelerator™) allowing 0-wait state execution
from Flash memory, frequency up to 100 MHz,
memory protection unit,
125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1),
and DSP instructions
Memories
– up to 512 Kbytes of Flash memory
– 128 Kbytes of SRAM
Clock, reset and supply management
– 1.7 V to 3.6 V application supply and I/Os
– POR, PDR, PVD and BOR
– 4-to-26 MHz crystal oscillator
– Internal 16 MHz factory-trimmed RC
– 32 kHz oscillator for RTC with calibration
– Internal 32 kHz RC with calibration
Power consumption
– Run: 100 µA/MHz (peripheral off)
– Stop (Flash in Stop mode, fast wakeup
time): 42 µA Typ @ 25C; 65 µA max
@25 °C
– Stop (Flash in Deep power down mode,
fast wakeup time): down to 10 µA @ 25 °C;
30 µA max @25 °C
– Standby: 2.4 µA @25 °C / 1.7 V without
RTC; 12 µA @85 °C @1.7 V
– VBAT supply for RTC: 1 µA @25 °C
1×12-bit, 2.4 MSPS A/D converter: up to 16
channels
General-purpose DMA: 16-stream DMA
controllers with FIFOs and burst support
Up to 11 timers: up to six 16-bit, two 32-bit
timers up to 100 MHz, each with up to four
IC/OC/PWM or pulse counter and quadrature
(incremental) encoder input, two watchdog
)%*$
WLCSP49
WLCSP49
UFQFPN48
(3.034 x 3.220 mm)
(7 × 7 mm)
LQFP100 (14 × 14 mm)
LQFP64 (10 × 10 mm)
UFBGA100
(7 × 7 mm)
timers (independent and window) and a
SysTick timer
Debug mode
– Serial wire debug (SWD) & JTAG
interfaces
– Cortex®-M4 Embedded Trace Macrocell™
Up to 81 I/O ports with interrupt capability
– Up to 78 fast I/Os up to 100 MHz
– Up to 77 5 V-tolerant I/Os
Up to 13 communication interfaces
– Up to 3 x I2C interfaces (SMBus/PMBus)
– Up to 3 USARTs (2 x 12.5 Mbit/s,
1 x 6.25 Mbit/s), ISO 7816 interface, LIN,
IrDA, modem control)
– Up to 5 SPI/I2Ss (up to 50 Mbit/s, SPI or
Im2Suxaeuddfiuollp-droutpolecoxl)I,2SSPtoI2aachnidevSePaI3udwioith
class accuracy via internal audio PLL or
external clock
– SDIO interface (SD/MMC/eMMC)
– Advanced connectivity: USB 2.0 full-speed
device/host/OTG controller with on-chip
PHY
CRC calculation unit
96-bit unique ID
RTC: subsecond accuracy, hardware calendar
All packages
UFQFPN48,
(WLCSP49,
UFBGA100)
LaQreFEPC6O4/P10A0C,K®2
Table 1. Device summary
Reference
Part number
STM32F411xC
STM32F411xE
STM32F411CC, STM32F411RC,
STM32F411VC
STM32F411CE, STM32F411RE,
STM32F411VE
February 2015
This is information on a product in full production.
DocID026289 Rev 4
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www.st.com

1 page




STM32F411VC pdf
STM32F411xC STM32F411xE
Contents
Appendix B Application block diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
B.1 USB OTG Full Speed (FS) interface solutions . . . . . . . . . . . . . . . . . . . . 140
B.2 Sensor Hub application example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
B.3 Batch Acquisition Mode (BAM) example . . . . . . . . . . . . . . . . . . . . . . . . . 143
9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144
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STM32F411VC arduino
STM32F411xC STM32F411xE
2 Description
Description
The STM32F411XC/XE devices are based on the high-performance ARM® Cortex® -M4 32-
bit RISC core operating at a frequency of up to 100 MHz. Its Cortex®-M4 core features a
Floating point unit (FPU) single precision which supports all ARM single-precision data-
processing instructions and data types. It also implements a full set of DSP instructions and
a memory protection unit (MPU) which enhances application security.
The STM32F411xC/xE belongs to the STM32 Dynamic Efficiencyproduct line (with
products combining power efficiency, performance and integration) while adding a new
innovative feature called Batch Acquisition Mode (BAM) allowing to save even more power
consumption during data batching.
The STM32F411xC/xE incorporate high-speed embedded memories (up to 512 Kbytes of
Flash memory, 128 Kbytes of SRAM), and an extensive range of enhanced I/Os and
peripherals connected to two APB buses, two AHB bus and a 32-bit multi-AHB bus matrix.
All devices offer one 12-bit ADC, a low-power RTC, six general-purpose 16-bit timers
including one PWM timer for motor control, two general-purpose 32-bit timers. They also
feature standard and advanced communication interfaces.
Up to three I2Cs
Five SPIs
Five I2Ss out of which two are full duplex. To achieve audio class accuracy, the I2S
peripherals can be clocked via a dedicated internal audio PLL or via an external clock
to allow synchronization.
Three USARTs
SDIO interface
USB 2.0 OTG full speed interface
Refer to Table 2: STM32F411xC/xE features and peripheral counts for the peripherals
available for each part number.
The STM32F411xC/xE operate in the –40 to +105 °C temperature range from a 1.7 (PDR
OFF) to 3.6 V power supply. A comprehensive set of power-saving mode allows the design
of low-power applications.
These features make the STM32F411xC/xE microcontrollers suitable for a wide range of
applications:
Motor drive and application control
Medical equipment
Industrial applications: PLC, inverters, circuit breakers
Printers, and scanners
Alarm systems, video intercom, and HVAC
Home audio appliances
Mobile phone sensor hub
Figure 3 shows the general block diagram of the devices.
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