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78F9212 の電気的特性と機能

78F9212のメーカーはNECです、この部品の機能は「UPD78F9212」です。


製品の詳細 ( Datasheet PDF )

部品番号 78F9212
部品説明 UPD78F9212
メーカ NEC
ロゴ NEC ロゴ 




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78F9212 Datasheet, 78F9212 PDF,ピン配置, 機能
User’s Manual
78K0S/KY1+
8-bit Single-Chip Microcontrollers
μPD78F9210 μPD78F9211 μPD78F9212
μPD78F9210(A) μPD78F9211(A) μPD78F9212(A)
μPD78F9210(A2) μPD78F9211(A2) μPD78F9212(A2)
μPD78F9510 μPD78F9511 μPD78F9512
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Document No. U16994EJ6V0UD00 (6th edition)
Date Published November 2009 NS
©
Printed in Japan
2004

1 Page





78F9212 pdf, ピン配列
NOTES FOR CMOS DEVICES
(1) VOLTAGE APPLICATION WAVEFORM AT INPUT PIN: Waveform distortion due to input noise or a reflected
wave may cause malfunction. If the input of the CMOS device stays in the area between VIL (MAX) and VIH
(MIN) due to noise, etc., the device may malfunction. Take care to prevent chattering noise from entering the
device when the input level is fixed, and also in the transition period when the input level passes through the
area between VIL (MAX) and VIH (MIN).
(2) HANDLING OF UNUSED INPUT PINS: Unconnected CMOS device inputs can be cause of malfunction. If
an input pin is unconnected, it is possible that an internal input level may be generated due to noise, etc.,
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS
devices must be fixed high or low by using pull-up or pull-down circuitry. Each unused pin should be
connected to VDD or GND via a resistor if there is a possibility that it will be an output pin. All handling related
to unused pins must be judged separately for each device and according to related specifications governing
the device.
(3) PRECAUTION AGAINST ESD: A strong electric field, when exposed to a MOS device, can cause destruction
of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of
static electricity as much as possible, and quickly dissipate it when it has occurred. Environmental control
must be adequate. When it is dry, a humidifier should be used. It is recommended to avoid using insulators
that easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static
container, static shielding bag or conductive material. All test and measurement tools including work benches
and floors should be grounded. The operator should be grounded using a wrist strap. Semiconductor devices
must not be touched with bare hands. Similar precautions need to be taken for PW boards with mounted
semiconductor devices.
(4) STATUS BEFORE INITIALIZATION: Power-on does not necessarily define the initial status of a MOS device.
Immediately after the power source is turned ON, devices with reset functions have not yet been initialized.
Hence, power-on does not guarantee output pin levels, I/O settings or contents of registers. A device is not
initialized until the reset signal is received. A reset operation must be executed immediately after power-on
for devices with reset functions.
(5) POWER ON/OFF SEQUENCE: In the case of a device that uses different power supplies for the internal
operation and external interface, as a rule, switch on the external power supply after switching on the internal
power supply. When switching the power supply off, as a rule, switch off the external power supply and then
the internal power supply. Use of the reverse power on/off sequences may result in the application of an
overvoltage to the internal elements of the device, causing malfunction and degradation of internal elements
due to the passage of an abnormal current. The correct power on/off sequence must be judged separately for
each device and according to related specifications governing the device.
(6) INPUT OF SIGNAL DURING POWER OFF STATE : Do not input signals or an I/O pull-up power supply while
the device is not powered. The current injection that results from input of such a signal or I/O pull-up power
supply may cause malfunction and the abnormal current that passes in the device at this time may cause
degradation of internal elements. Input of signals during the power off state must be judged separately for
each device and according to related specifications governing the device.
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User’s Manual U16994EJ6V0UD
3


3Pages


78F9212 電子部品, 半導体
Conventions
Data significance:
Higher digits on the left and lower digits on the right
Active low representation: ××× (overscore over pin or signal name)
Note:
Footnote for item marked with Note in the text
Caution:
Information requiring particular attention
Remark:
Supplementary information
Numerical representation: Binary ... ×××× or ××××B
Decimal ... ××××
Hexadecimal ... ××××H
Related Documents
The related documents indicated in this publication may include preliminary versions.
However, preliminary versions are not marked as such.
Documents Related to Devices
78K0S/KY1+ User’s Manual
78K/0S Series Instructions User’s Manual
Document Name
Document No.
This manual
U11047E
<R> Documents Related to Development Software Tools (User’s Manuals)
Document Name
RA78K0S Ver.2.00 Assembler Package
Operation
Language
Structured Assembly Language
CC78K0S Ver.2.00 C Compiler
Operation
Language
SM+ System Simulator
Operation
User Open Interface
ID78K0S-QB Ver.3.00 Integrated Debugger
Operation
PM+ Ver.6.30
Document No.
U17391E
U17390E
U17389E
U17416E
U17415E
U18601E
U18212E
U18493E
U18416E
Documents Related to Development Hardware Tools (User’s Manuals)
Document Name
QB-78K0SKX1 In-Circuit Emulator
QB-MINI2 On-Chip Debug Emulator with Programming Function
Document No.
U18219E
U18371E
Documents Related to Flash Memory Writing (User’s Manuals)
PG-FP5 Flash Memory Programmer
w<wRw>.DaQtaBS-Phreoegtr4aUm.mcoemr Programming GUI
Document Name
Operation
Document No.
U18865E
U18527E
Caution The related documents listed above are subject to change without notice. Be sure to use the latest
version of each document for designing.
6 User’s Manual U16994EJ6V0UD

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部品番号部品説明メーカ
78F9212

UPD78F9212

NEC
NEC


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