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PDF MPXS4115A Data sheet ( Hoja de datos )
| Número de pieza | MPXS4115A | |
| Descripción | INTEGRATED PRESSURE SENSOR | |
| Fabricantes | Motorola Semiconductors | |
| Logotipo |  |
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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MPXS4115A/D
Preliminary Information
Altimeter or Barometer Applications
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated
and Calibrated
The Motorola MPXS4115A series Manifold Absolute Pressure (MAP) sensor for
engine control is designed to sense absolute air pressure.
Motorola’s MAP sensor integrates on–chip, bipolar op amp circuitry and thin film
resistor networks to provide a high output signal and temperature compensation. The
small form factor and high reliability of on–chip integration make the Motorola MAP
sensor a logical and economical choice for the automotive system designer.
Features
• 1.5% Maximum Error over 0° to 85°C
• Ideally suited for Microprocessor or Microcontroller–Based Systems
• Patented Silicon Shear Stress Strain Gauge
• Temperature Compensated from – 40° to +125°C
• Durable Epoxy Unibody Element
• Also Available in Unibody Package (See MPX4115A/D Data Sheet)
Application Examples
• Aviation Altimeters
• Industrial Controls
• Engine Control
• Weather Stations and Weather Reporting Devices
MPXS4115A
SERIES
OPERATING OVERVIEW
INTEGRATED
PRESSURE SENSOR
15 to 115kPa (2.2 to 16.7 psi)
0.2 to 4.8 Volts Output
AXIAL PORT OPTION
CASE 471B–01
PIN NUMBER
1 N/C 5 N/C
2 VS 6 N/C
3 Gnd 7 N/C
4 Vout 8 N/C
NOTE: Pins 1, 5, 6, 7, and 8 are
internal device connections. Do not
connect to external circuitry or
ground.
VS
2
X–ducer
SENSING
ELEMENT
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1
GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY
4 Vout
3 PINS 1 AND 5 THROUGH 8 ARE NO CONNECTS
GND
Figure 1. Fully Integrated Pressure Sensor Schematic
This document contains information on a new product. Specifications and information herein are subject to change without notice.
Senseon and X–ducer are trademarks of Motorola, Inc.
REV 1
©MMoottoororolal,aInSc.e1n9s97or Device Data
1
1 page  
MPXS4115A SERIES
INFORMATION FOR USING THE SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to ensure proper solder connection inter-
face between the board and the package. With the correct
pad geometry, the packages will self align when subjected to
a solder reflow process.
0.835
0.100 TYP
0.060 TYP 8X
NOT TO SCALE
0.300
0.080 TYP 8X
Motorola Sensor Device Data
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet MPXS4115A.PDF ] | |
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| Número de pieza | Descripción | Fabricantes |
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