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HCD-GZR99D の電気的特性と機能

HCD-GZR99DのメーカーはSonyです、この部品の機能は「DVD DECK RECEIVER SERVICE MANUAL」です。


製品の詳細 ( Datasheet PDF )

部品番号 HCD-GZR99D
部品説明 DVD DECK RECEIVER SERVICE MANUAL
メーカ Sony
ロゴ Sony ロゴ 




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HCD-GZR99D Datasheet, HCD-GZR99D PDF,ピン配置, 機能
HCD-GZR88D/GZR99D
SERVICE MANUAL
E Model
Ver. 1.0 2009.06
• HCD-GZR88D/GZR99D are the tuner,
deck, DVD and amplier section
in MHC-GZR88D/GZR99D.
Photo: HCD-GZR99D: E2 model
DVD
Section
Tape Deck
Section
Model Name Using Similar Mechanism
DVD Mechanism Type
Optical Pick-up Name
Model Name Using Similar Machanism
Tape Transport Mechanism Type
HCD-GZR77D
CDM74HF-DVBU101
KHM-313CAB
HCD-GZR77D
CWP42FR605
SPECIFICATIONS
Amplier Section
The following measured at AC 127 V, 60 Hz (Mexican model)
The following measured at AC 120, 220, 240 V, 50/60 Hz (Other models)
MHC-GZR99D
Power output (rated): 135 W + 135 W
(at 6 Ω, 1 kHz, 1% THD, at LINK MODE)
RMS output power (reference)
Front speaker:
175 W + 175 W
(per channel at 8 Ω, 1 kHz, 10% THD)
Satellite speaker:
70 W + 70 W
(per channel at 24 Ω, 1 kHz, 10% THD)
Subwoofer:
210 W (at 6 Ω, 100 Hz, 10% THD)
MHC-GZR88D
Power output (rated): 125 W + 125 W
(at 6 Ω, 1 kHz, 1% THD, at LINK MODE)
RMS output power (reference)
Front speaker:
175 W + 175 W
(per channel at 8 Ω, 1 kHz, 10% THD)
Satellite speaker:
70 W + 70 W
(per channel at 24 Ω, 1 kHz, 10% THD)
– Continued on next page –
9-889-536-01
2009F04-1
© 2009.06
Sony Corporation
Audio&Video Business Group
Published by Sony Techno Create Corporation
HCD-GZR99D: E2, E51, AR, MX Model
DVD DECK RECEIVER
HCD-GZR88D/GZR99D: E3, E4, E15, PH, SP Model
DVD RECEIVER

1 Page





HCD-GZR99D pdf, ピン配列
HCD-GZR88D/GZR99D
NOTES ON CHIP COMPONENT REPLACEMENT
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
• Keep the temperature of soldering iron around 270 °C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
This appliance is classied as
a CLASS 1 LASER product.
This marking is located on the
rear exterior.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specied herein may result in hazardous radia-
tion exposure.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostat-
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The exible board is easily damaged and should be handled with
care.
3


3Pages


HCD-GZR99D 電子部品, 半導体
HCD-GZR88D/GZR99D
SECTION 1
SERVICING NOTES
Notes on Disconnecting Between the OP Section (DVBU101) and the DMB19 Board
Note: When disconnecting between the OP section (DVBU101) and the DMB19 board, be sure to make a solder brige for electrostatic
prevention as illustrated in the gure (before disconnection).
On the contrary, when installing the OP section, never remove the solder bride until the OP section and the DMB19 board are
connected.
Be sure to remove the solder bridge after the OP section and the DMB19 board have been connected.
Perform solder bridging to prevent damage by electrostatic
discharge when handling the BU as a single unit.
Manual Opening and Closing the CD Tray
As illustrated, insert a athead screwdriver and give a turn to the left to put the CD tray out.
2
CD tray
1
flathead screwdriver
As illustrated, insert a flathead screwdriver
and give a turn to the left to put the tray out.
6

6 Page



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部品番号部品説明メーカ
HCD-GZR99D

DVD DECK RECEIVER SERVICE MANUAL

Sony
Sony


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