|
|
PDF RT9706 Data sheet ( Hoja de datos )
| Número de pieza | RT9706 | |
| Descripción | 500mA High-Side Power Switch | |
| Fabricantes | RichTek | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de RT9706 (archivo pdf) en la parte inferior de esta página. Total 14 Páginas | ||
|
No Preview Available !
RT9706
80mΩ, 500mA High-Side Power Switch with Flag
General Description
The RT9706 is a cost-effective, low voltage, single
N-Channel MOSFET high-side power switch, optimized
for self-powered and bus-powered Universal Serial Bus
(USB) applications. The RT9706 equipped with a charge
pump circuitry to drive the internal MOSFET switch; the
switch's low RDS(ON) 80mΩ, meets USB voltage drop
requirements; and a flag output is available to indicate
fault conditions to the local USB controller.
Additional features include soft-start to limit inrush current
during plug-in, thermal shutdown to prevent catastrophic
switch failure from high-current loads, under-voltage
lockout (UVLO) to ensure that the device remains off
unless there is a valid input voltage present, lower
quiescent current as 25μA making this device ideal for
portable battery operated equipment.
The RT9706 is available in SOT-23-5 package requiring
minimum board space and smallest components.
Ordering Information
RT9706
Note :
Package Type
B : SOT-23-5
Lead Plating System
P : Pb Free
G : Green (Halogen Free and Pb Free)
Richtek products are :
` RoHS compliant and compatible with the current require-
ments of IPC/JEDEC J-STD-020.
` Suitable for use in SnPb or Pb-free soldering processes.
Marking Information
For marking information, contact our sales representative
directly or through a Richtek distributor located in your
area.
Features
z Compliant to USB Specifications
z Built-In (Typically 80mΩ) N-Channel MOSFET
z Output Can Be Forced Higher than Input (Off-State)
z Low Supply Current :
` 25μA Typical at Switch On State
` 0.1μA Typical at Switch Off State
z Guaranteed 500mA Continuous Load Current
z Wide Input Voltage Ranges : 2V to 5.5V
z Open-Drain Fault Flag Output
z Hot Plug-In Application (Soft-Start)
z 1.7V Typical Under-Voltage Lockout (UVLO)
z Current Limiting Protection
z Thermal Shutdown Protection
z Reverse Current Flow Blocking (no body diode)
z Smallest SOT-23-5 Package Minimizes Board Space
z UL Approved−E219878
z RoHS Compliant and 100% Lead (Pb)-Free
Applications
z USB Bus/Self Powered Hubs
z USB Peripherals
z ACPI Power Distribution
z PC Card Hot Swap
z Notebook, Motherboard PCs
z Battery-Powered Equipment
z Hot-Plug Power Supplies
z Battery-Charger Circuits
Pin Configurations
(TOP VIEW)
VOUT
5
VIN
4
23
EN GND FLG
SOT-23-5
DS9706-04 April 2011
www.richtek.com
1
1 page  
RT9706
Parameter
Thermal Shutdown Protection
Thermal Shutdown Hysteresis
Symbol
TSD
ΔTSD
Test Conditions
Min Typ Max Unit
-- 130 --
-- 20 --
°C
°C
Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. θJA is measured in the natural convection at TA = 25°C on a low effective single layer thermal conductivity test board of
JEDEC 51-3 thermal measurement standard.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. The FLAG delay time is input voltage dependent, see“ Typical Operating Characteristics” graph for further details.
DS9706-04 April 2011
www.richtek.com
5
5 Page 
Once this current limit threshold is exceeded the device
enters constant current mode until the thermal shutdown
occurs or the fault is removed.
Thermal Shutdown
Thermal shutdown is employed to protect the device from
damage if the die temperature exceeds approximately
130°C. If enabled, the switch automatically restarts when
the die temperature falls 20°C. The output and FLG signal
will continue to cycle on and off until the device is disabled
or the fault is removed.
Power Dissipation and Thermal Consideration
The device “S” junction temperature depends on several
factors such as the load, PCB layout, ambient temperature
and package type. The output pin of RT9706 can deliver a
current of up to 500mA, respectively over the full operating
junction temperature range. However, the maximum output
current must be derated at higher ambient temperature to
ensure the junction temperature does not exceed 100°C.
With all possible conditions, the junction temperature must
be within the range specified under operating conditions.
Power dissipation can be calculated based on the output
current and the RDS(ON) of switch as below.
PD = RDS(ON) x (IOUT)2
Although the devices are rated for 500mA of output current,
but the application may limit the amount of output current
based on the total power dissipation and the ambient
temperature. The final operating junction temperature for
any set of conditions can be estimated by the following
thermal equation :
PD(MAX) = ( TJ(MAX) − TA ) / θJA
PD(MAX) = ( TJ(MAX) − TA ) / θJA
Where TJ(MAX) is the maximum operation junction
temperature, TA is the ambient temperature and the θJA is
the junction to ambient thermal resistance.
For recommended operating conditions specification of
RT9706, where TJ(MAX) is the maximum junction
temperature of the die (125°C) and TA is the maximum
ambient temperature. The junction to ambient thermal
resistance θJA is layout dependent. For SOT-23-5
packages, the thermal resistance θJA is 250°C/W on the
standard JEDEC 51-3 single-layer thermal test board.
DS9706-04 April 2011
RT9706
The maximum power dissipation at TA = 25°C can be
calculated by following formula :
PD(MAX) = (125°C − 25°C) / 250°C/W = 0.4 W for
SOT-23-5 packages
The maximum power dissipation depends on operating
ambient temperature for fixed TJ(MAX) and thermal
resistance θJA. For RT9706 packages, the Figure 2 of
derating curves allows the designer to see the effect of
rising ambient temperature on the maximum power
allowed.
0.6
0.5
SOT-23-5
0.4
Single Layer PCB
0.3
0.2
0.1
0
0 25 50 75 100 125
Ambient Temperature (°C)
Figure 2. Derating Curves for RT9706 Package
Universal Serial Bus (USB) & Power Distribution
The goal of USB is to be enabled device from different
vendors to interoperate in an open architecture. USB
features include ease of use for the end user, a wide range
of workloads and applications, robustness, synergy with
the PC industry, and low-cost implement- ation. Benefits
include self-identifying peripherals, dynamically attachable
and reconfigurable peripherals, multiple connections
(support for concurrent operation of many devices), support
for as many as 127 physical devices, and compatibility
with PC Plug-and-Play architecture.
The Universal Serial Bus connects USB devices with a
USB host: each USB system has one USB host. USB
devices are classified either as hubs, which provide
additional attachment points to the USB, or as functions,
which provide capabilities to the system (for example, a
digital joystick). Hub devices are then classified as either
Bus-Power Hubs or Self-Powered Hubs.
www.richtek.com
11
11 Page | ||
| Páginas | Total 14 Páginas | |
| PDF Descargar | [ Datasheet RT9706.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| RT9701 | POWER DISTRIBUTION SWITCHES |  ETC |
| RT9701 | Power Distribution Switches |  Richtek |
| RT9701CB | 100m POWER DISTRIBUTION SWITCHES | ETC |
| RT9701CBL | 100m POWER DISTRIBUTION SWITCHES | ETC |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |