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HC1000 PDF Datasheet ( 特性, スペック, ピン接続図 )

部品番号 HC1000
部品説明 Gel-Like Modulus Gap Filling Material
メーカ Bergquist
ロゴ Bergquist ロゴ 



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HC1000 Datasheet, HC1000 PDF,ピン配置, 機能
Gap Pad® HC1000
“Gel-Like” Modulus Gap Filling Material
Features and Benefits
• Thermal conductivity: 1.0 W/m-K
• Highly conformable, low hardness
• “Gel-like” modulus
• Fiberglass reinforced for puncture,
shear and tear resistance
Gap Pad HC 1000 is an extremely conformable,
low-modulus polymer that acts as a thermal
interface and electrical insulator between
electronic components and heat sinks.The
“gel-like” modulus allows this material to fill
air gaps to enhance the thermal performance
of electronic systems. Gap Pad HC1000 is
offered with removable protective liners on
both sides of the material.
Note: Resultant thickness is defined as the final gap
thickness of the application.
20
18
16
14
12
10
0.25
Thickness vs. Thermal Resistance
Gap Pad HC1000
0.30 0.35 0.40 0.45 0.50
Thermal Resistance (C-in2/W)
0.55
PROPERTY
Color
TYPICAL PROPERTIES OF GAP PAD HC1000
IMPERIAL VALUE METRIC VALUE TEST METHOD
Gray Gray Visual
Reinforcement Carrier
Fiberglass
Fiberglass
Thickness (inch) / (mm)
0.015 to 0.020 0.381 to 0.508
ASTM D374
Inherent Surface Tack (1- or 2-sided)
2
2—
Density (g/cc)
1.6 1.6 ASTM D792
Heat Capacity (J/g-K)
1.0 1.0 ASTM E1269
Hardness, Bulk Rubber (Shore 00) (1)
25
25 ASTM D2240
Young’s Modulus (psi) / (kPa) (2)
40
275 ASTM D575
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
>5000
>5000
ASTM D149
Dielectric Constant (1000 Hz)
5.5 5.5 ASTM D150
Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257
Flame Rating
V-O V-O U.L. 94
THERMAL
Thermal Conductivity (W/m-K) 1.0 1.0 ASTM D5470
1) Thirty second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2 and 0.020 inches thick. For more
information on Gap Pad modulus, refer to Bergquist Application Note #116.
Typical Applications Include:
• Computer and peripherals
• Telecommunications
• Heat interfaces to frames, chassis, or other heat spreading devices
• RDRAM™ memory modules / chip scale packages
• CDROM / DVD cooling
• Areas where irregular surfaces need to make a thermal interface to a heat sink
• DDR SDRAM memory modules
• FBDIMM modules
Configurations Available:
• Sheet form, die-cut parts, and roll form (converted or unconverted)
Building a Part Number
HC1000 – 0.015 – 02 – 0816 –
NA
Standard Options
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
0816 = Standard sheet size 8" x 16", or
00 = custom configuration
02 = Natural tack, both sides
Standard thicknesses available: 0.015", 0.020"
HC1000 = High Compliance 1000 Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Gap Pad®: U.S. Patent 5,679,457 and others
www.bergquistcompany.com
The Bergquist Company -
The Bergquist Company -
North American Headquarters European Headquarters
18930 West 78th Street
Bramenberg 9a, 3755 BT Eemnes
Chanhassen, MN 55317
Netherlands
Phone: 800-347-4572
Phone: 31-35-5380684
h t t p Fa:x: 9/52/-83o5-04n30 e i c . cFaxo: 31-m35-53/80295
The Bergquist Company - Asia
Room 15, 8/F Wah Wai Industrial Centre
No. 38-40, Au Pui Wan Street
Fotan, Shatin, N.T. Hong Kong
Ph: 852.2690.9296
Fax: 852.2690.2344
All statements, technical information and recommendations herein are based on tests we believe to be reliable, and
THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED
WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers’ and manufacturers’ only obligation shall be to
replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product
for its intended use, and the user assumes all risks and liability whatsoever in connection therewith. NEITHER SELLER NOR
MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT,
INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR
THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not
contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer.
PDS_GP_HC1000_12.08

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