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HLMP-Y802 の電気的特性と機能

HLMP-Y802のメーカーはAVAGOです、この部品の機能は「LED Lamps」です。


製品の詳細 ( Datasheet PDF )

部品番号 HLMP-Y802
部品説明 LED Lamps
メーカ AVAGO
ロゴ AVAGO ロゴ 




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HLMP-Y802 Datasheet, HLMP-Y802 PDF,ピン配置, 機能
HLMP-Yxxx
T-1 (3 mm) AlInGaP LED Lamps
Data Sheet
Description
This family of T-1 lamps is widely used in general purpose
indicator and back lighting applications. The optical
design is balanced to yield superior light output and wide
viewing angles. Several intensity choices are available in
each color for increased design flexibility.
Applications
x Status indicator
x Backlighting front panels
x Light pipe sources
x Lighted switches
Package Dimension
5.2
0.205
4.1 ± 0.2
0.161 ± 0.008
3.8 3.5 3.1 ± 0.2
0.15 0.138 0.122 ± 0.008
1.0 (MAX)
0.04
Features
x High luminous intensity output
x Low power consumption
x Choice of bright colors
– Deep Red
– Red
– Red-Orange
– Orange
– Amber
– Green
x High efficiency
x Versatile mounting on PCB or panel
x I.C. Compatible/low current requirement
x Popular T-1 diameter package
x Reliable and rugged
x RoHS compliant
24.0 (MIN)
0.945
CATHODE
0.45 x 0.4 TYP
(0.018 x 0.016)
Notes:
1. All dimensions are in millimeter (inches).
2. Tolerance is ±0.25mm (.010) unless otherwise stated.
3. Lead spacing is measured where the leads emerge from the package.
1.0 (MIN)
0.04
2.54
0.1

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HLMP-Y802 pdf, ピン配列
Absolute Maximum Ratings at TA = 25°C
Parameter
DC Forward Current
Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width)
Reverse Voltage (IR = 100PA)
Junction Temperature
Power Dissipation
Storage Temperature Range
Operating Temperature Range
Solder Temperature
HLMP-Yxxx
20
60
5
110
48
-40 to +100
-40 to +100
260°C 5 sec
Units
mA
mA
V
°C
mW
°C
°C
Electrical /Optical Characteristic at TA = 25°C
Description
Symbol Part Number
Min. Typ. Max. Units
Peak Wavelength
OPEAK
HLMP-Y651
HLMP-Y601
HLMP-Y951
HLMP-Y90x
HLMP-Y701
HLMP-Y802-F00xx
652
633
622
611
595
575
nm
Dominant Wavelength Od
HLMP-Y651
HLMP-Y601
HLMP-Y951
HLMP-Y90x
HLMP-Y701
HLMP-Y802-F00xx
635.0
620.0
610.0
599.5
582.0
564.5
638.0
627.0
615.0
605.0
592.0
572.0
646.0
635.0
620.0
610.5
597.0
576.5
nm
Spectrum Half Width 'O
HLMP-Y651
HLMP-Y601
HLMP-Y951
HLMP-Y90x
HLMP-Y701
HLMP-Y802-F00xx
15
15
17
17
15
11
nm
Forward Voltage VF HLMP-Y651
HLMP-Y601
HLMP-Y951
HLMP-Y90x
HLMP-Y701
HLMP-Y802-F00xx
2.0 2.2 V
2.0 2.2
2.0 2.2
2.0 2.4
2.0 2.2
2.1 2.4
Notes:
1. The dominant wavelength, Od, is derived from the Chromaticity Diagram and represents the color of the lamp.
Test Conditions
Measurement at peak
Note 1
IF = 20mA
(Figure 1)
3


3Pages


HLMP-Y802 電子部品, 半導体
Precautions: (cont.)
Soldering Conditions:
x Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
x The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without standoff.
x Recommended soldering conditions:
Pre-heat Temperature
Pre-heat Time
Peak Temperature
Dwell Time
Wave Soldering
105°C Max.
60 sec Max.
250°C Max.
3 sec Max.
Manual Solder
Dipping
260°C Max.
5 sec Max.
x Wave soldering parameter must be set and maintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering profile to ensure
the soldering profile used is always conforming to
recommended soldering condition.
x If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
x Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
x Therefore, the soldered PCB must be allowed to cool to
room temperature, 25°C, before handling.
x Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
x Recommended PC board plated through hole sizes for
LED component leads:
LED Component
Lead Size
0.457 x 0.457 mm
(0.018 x 0.018 inch)
0.508 x 0.508 mm
(0.020 x 0.020 inch)
Diagonal
0.646 mm
(0.025 inch)
0.718 mm
(0.028 inch)
Plated Through
Hole Diameter
0.976 to 1.078 mm
(0.038 to 0.042 inch)
1.049 to 1.150 mm
(0.041 to 0.045 inch)
Note: Refer to application note AN1027 for more information on
soldering LED components.
250
TURBULENT WAVE
LAMINAR WAVE
HOT AIR KNIFE
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin fl-ux
200 Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
150
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
100
50
PREHEAT
Note: Allow for board to be
sufficiently cooled to room
temperature before exerting
mechanical force.
0 10 20 30 40 50 60 70 80 90 100
TIME (MINUTES)
Figure 7. Recommended wave soldering profile.
DISCLAIMER: Avago’s products and software are not specifically designed, manufactured or authorized for
sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a
nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights
to make claims against avago or its suppliers, fo all loss, damage, expense or liability in connection with such use.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved.
AV02-1664N - October 14, 2009

6 Page



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部品番号部品説明メーカ
HLMP-Y802

LED Lamps

AVAGO
AVAGO


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