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HLMP-Y301のメーカーはAVAGOです、この部品の機能は「LED Lamps」です。 |
部品番号 | HLMP-Y301 |
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部品説明 | LED Lamps | ||
メーカ | AVAGO | ||
ロゴ | |||
このページの下部にプレビューとHLMP-Y301ダウンロード(pdfファイル)リンクがあります。 Total 7 pages
HLMP-Yxxx
T-1 (3 mm) GaP/GaAsP LED Lamps
Data Sheet
Description
This family of T-1 lamps is widely used in general purpose
indicator and back lighting applications.The optical design
is balanced to yield superior light output and wide view-
ing angles. Several intensity choices are available in each
color for increased design flexibility.
Features
• Low power consumption
• High efficiency
• Versatile mounting on PCB or panel
• I.C. Compatible/low current requirement
• Popular T-1 package
• RoHS compliant
Applications
• Status indicator
• Backlighting front panels
• Light pipe sources
• Lighted switches
Package Dimension
5.2
0.205
4.1 ±0.2
0.161 ±0.008
1.0
0.04
(MAX)
24.0 (MIN)
0.945
3.8 3.5 3.1 ±0.2
0.15 0.138 0.122 ±0.008
0.45 x 0.4
0.018 x 0.016
TYP
Notes:
1. All dimensions are in millimeter (inches).
2. Tolerance is ±0.25 mm (.010) unless otherwise stated.
3. Lead spacing is measured where the leads emerge from the package.
CATHODE
1.0
0.04
(MIN)
2.54
0.1
1 Page Electrical /Optical Characteristic at TA = 25° C
Description
Symbol Part Number Min. Typ. Max. Units Test Conditions
Peak Wavelength
λPEAK
HLMP-Y301
HLMP-Y402
HLMP-Y502
635
610
565
nm Measurement at peak
Dominant Wavelength λd
HLMP-Y301
HLMP-Y402
HLMP-Y502
615
599.5
561.5
626
605
573
632
613.5
576.5
nm
Note 1
Spectrum Half Width
Δλ
HLMP-Y301
HLMP-Y402
HLMP-Y502
40
35
30
nm
Forward Voltage VF HLMP-Y301
HLMP-Y402
HLMP-Y502
2.1 2.6 V IF = 20 mA
2.1 2.6
(Figure 1)
2.2 2.6
Reverse Voltage
VR HLMP-Y301 5
HLMP-Y402 5
HLMP-Y502 5
μA IR = 100 μA
Thermal Resistance
RθJ-PIN
HLMP-Y301
HLMP-Y402
HLMP-Y502
310
310
310
°C/W Junction to Cathode Lead
Notes:
1. The dominant wavelength, λd, is derived from the Chromaticity Diagram and represents the color of the lamp.
3
3Pages Precautions:
Assembly method:
• This product is not meant for auto-insertion.
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads of
LED to length after soldering process at room tempera-
ture. The solder joint formed will absorb the mechani-
cal stress of the lead cutting from traveling to the LED
chip die attach and wirebond.
• During lead forming, the leads should be bent at a point
at least 3mm from the base of the lens. Do not use the
base of the lead frame as a fulcrum during forming.
Lead forming must be done before soldering at normal
temperature.
• It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
Soldering Conditions:
• Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
• The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without standoff.
• Recommended soldering conditions:
Pre-heat Temperature
Preheat Time
Peak Temperature
Dwell Time
Wave
Soldering
105° C Max.
60 sec Max
250° C Max.
3 sec Max.
Manual Solder
Dipping
–
–
260° C Max.
5 sec Max
• Wave soldering parameter must be set and maintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to pe-
riodically check on the soldering profile to ensure the
soldering profile used is always conforming to recom-
mended soldering condition.
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
• Therefore, the soldered PCB must be allowed to cool to
room temperature, 25° C, before handling.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
• Recommended PC board plated through-hole sizes for
LED component leads:
Led Component
Lead Size
Diagonal
Plated Through
Hole Diameter
0.457 x 0.457 mm
(0.018 x 0.018 inch)
0.508 x 0.508 mm
(0.020 x 0.020 inch)
0.646 mm
(0.025 inch)
0.718 mm
(0.028 inch)
0.976 to 1.078 mm
(0.038 to 0.042 inch)
1.049 to 1.150 mm
(0.041 to 0.045 inch)
Note: Refer to application note AN1027 for more information on
soldering LED component.
6
6 Page | |||
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部品番号 | 部品説明 | メーカ |
HLMP-Y301 | LED Lamps | AVAGO |