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TS120 の電気的特性と機能

TS120のメーカーはIXYSです、この部品の機能は「Multifunction Telecom Switch」です。


製品の詳細 ( Datasheet PDF )

部品番号 TS120
部品説明 Multifunction Telecom Switch
メーカ IXYS
ロゴ IXYS ロゴ 




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TS120 Datasheet, TS120 PDF,ピン配置, 機能
INTEGRATED CIRCUITS DIVISION
TS120
Multifunction Telecom Switch
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Rating
350
120
35
Units
VP
mArms / mADC
Features
3750Vrms Input/Output Isolation
Low Drive Power Requirements (TTL/CMOS
Compatible)
FCC Compatible
VDE Compatible
No EMI/RFI Generation
No Moving Parts
High Reliability
Arc-Free With No Snubbing Circuits
Small 8-Pin Package
Machine Insertable, Wave Solderable
Surface Mount and Tape & Reel Versions Available
Applications
Telecommunications
Telecom Switching
Tip/Ring Circuits
Modem Switching (Laptop, Notebook, Pocket Size)
Hook Switch
Dial Pulsing
Ground Start
Ringing Injection
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
Medical Equipment-Patient/Equipment Isolation
Security
Aerospace
Industrial Controls
Description
The TS120 integrated circuit device combines a 350V
normally open (1-Form-A) relay with a Darlington
transistor optocoupler in a single package. The relay
uses optically coupled MOSFET technology to
provide 3750Vrms of input to output isolation.
Its optically coupled relay outputs, which use the
patented OptoMOS architecture, are controlled by a
highly efficient GaAIAs infrared LED.
The TS120 enables telecom circuit designers to
combine two discrete functions in a single component
that uses less space than traditional discrete
component solutions.
Approvals
UL Recognized Component: File E76270
CSA Certified Component: Certificate 1175739
EN/IEC 60950 Certified Component:
TUV Certificate: B 10 05 49410 006
Ordering Information
Part #
TS120
TS120P
TS120PTR
TS120S
TS120STR
Description
8-Pin DIP (50/Tube)
8-Pin Flatpack (50/Tube)
8-Pin Flatpack (1000/Reel)
8-Pin Surface Mount (50/Tube)
8-Pin Surface Mount (1000/Reel)
Pin Configuration
1
+ LED - Relay
2
– LED - Relay
3
Collector - Phototransistor
4
Emitter - Phototransistor
8
Load - Relay (MOSFET Output)
7
Load - Relay (MOSFET Output)
6
LED - Phototransistor –/+
5
LED - Phototransistor +/–
Switching Characteristics
of Normally Open Devices
Form-A
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TS120 pdf, ピン配列
INTEGRATED CIRCUITS DIVISION
TS120
RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
35
30
25
20
15
10
5
0
1.17
1.19
1.21
1.23
1.25
LED Forward Voltage Drop (V)
Typical Turn-On Time
(N=50, IF=5mA, IL=120mADC)
25
20
15
10
5
0
0.3
0.9 1.5 2.1 2.7 3.3
Turn-On Time (ms)
3.9
Typical Turn-Off Time
(N=50, IF=5mA, IL=120mADC)
25
20
15
10
5
0
0.05 0.15 0.25 0.35 0.45 0.55 0.65
Turn-Off Time (ms)
Typical IF for Switch Operation
(N=50, IL=120mADC)
25
20
15
10
5
0
0.39 0.65 0.91 1.17 1.43 1.69 1.95
LED Current (mA)
Typical IF for Switch Dropout
(N=50, IL=120mADC)
25
20
15
10
5
0
0.39 0.65 0.91 1.17 1.43 1.69 1.95
LED Current (mA)
Typical On-Resistance Distribution
(N=50, IF=5mA, IL=120mADC)
35
30
25
20
15
10
5
0
18.75 19.85 20.95 22.05 23.15 24.25 25.35
On-Resistance (:)
Typical Blocking Voltage Distribution
(N=50)
35
30
25
20
15
10
5
0
377.5 388.5 399.5 410.5 421.5 432.5 443.5
Blocking Voltage (VP)
Typical LED Forward Voltage Drop
vs. Temperature
(IL=120mADC)
1.8
1.6
1.4
1.2
1.0
0.8
-40 -20
IF=50mA
IF=30mA
IF=20mA
IF=10mA
I =5mA
F
0 20 40 60 80 100 120
Temperature (ºC)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0
Typical Turn-On Time
vs. LED Forward Current
(I =120mA )
L DC
5 10 15 20 25 30 35 40 45 50
LED Forward Current (mA)
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
Typical Turn-Off Time
vs. LED Forward Current
(IL=120mADC)
5 10 15 20 25 30 35 40 45 50
LED Forward Current (mA)
* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
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TS120 電子部品, 半導体
INTEGRATED CIRCUITS DIVISION
TS120
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
TS120 / TS120P / TS120S
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
TS120 / TS120S
TS120P
Maximum Temperature x Time
250ºC for 30 seconds
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an
optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a
wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb e3
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