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What is 1N5955BG?

This electronic component, produced by the manufacturer "Microsemi Corporation", performs the same function as "Axial-Leaded 1.5 Watt Glass Zener Diodes".


1N5955BG Datasheet PDF - Microsemi Corporation

Part Number 1N5955BG
Description Axial-Leaded 1.5 Watt Glass Zener Diodes
Manufacturers Microsemi Corporation 
Logo Microsemi Corporation Logo 


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1N5913BG – 1N5956BG
Available
Axial-Leaded 1.5 Watt Glass Zener Diodes
DESCRIPTION
The 1N5913BG-5956BG series of 1.5 watt Zeners provides voltage regulation in a selection
from 3.3 to 200 volts with a variety of tolerances available. They are also available in various
military equivalent screening levels for high reliability. These glass encapsulated Zeners with
a G suffix provide hermetic-sealed qualities and higher rated temperature beyond that
optionally provided in equivalent plastic-body constructions (P suffix) for the same JEDEC part
numbers. Both package options are available from Microsemi.
Screening in
reference to
MIL-PRF-19500
available
Important: For the latest information, visit our website http://www.microsemi.com.
FEATURES
JEDEC registered 1N5913B TO 1N5956B number series.
Zener voltage available 3.3 V to 200 V.
Voltage tolerances of 10%, 5%, 2% and 1% are available.
Screening in reference to MIL-PRF-19500 is available.
(See part nomenclature for all available options.)
RoHS compliant versions available (commercial grade only).
Optional plastic body axial-leaded Zeners available as 1N5913BP – 1N5956BP.
(See separate data sheet)
APPLICATIONS / BENEFITS
Regulates voltage over a broad range of operating current and temperature.
Flexible axial-lead mounting terminals.
Metallurgically enhanced internal contact design for greater reliability and lower thermal resistance
in glass hermetically sealed package
Non-sensitive to ESD per MIL-STD-750 method 1020.
Hermetically sealed glass body construction.
Inherently radiation hard as described in Microsemi MicroNote 050.
MAXIMUM RATINGS @ TA= 25 oC unless otherwise specified
DO-41 (DO-204AL)
Package
Also available in:
DO-213AB package
(MELF surface mount)
1N5913BUR-1 –
1N5956BUR-1
SMB package
(tabbed surface mount)
SMBG(J)5913B –
SMBG(J)5956B
SMAJ package
(tabbed surface mount)
SMAJ5913B –
SMAJ5956B
Powermite package
(tabbed surface mount)
1PMT5913B –
1PMT5956B
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Resistance Junction-to-Lead
@ 3/8 inch (10 mm) lead length from body
Thermal Resistance Junction-to-Ambient (1)
Steady State Power Dissipation
@ TL ≤ 85 ºC (2)
@ TA = 25 ºC (1)
Rated Average Power Dissipation (also see figure 1)
Forward Voltage
@ 200 mA
Solder Temperature @ 10 s
Symbol
TJ & TSTG
R ӨJL
R ӨJA
PD
P M(AV)
VF
T SP
Value
-65 to +175
60
120
1.5
1.25
1.5
1.2
260
Unit
oC
oC/W
oC/W
W
W
V
oC
Notes: 1. When mounted on FR4 PC board (1 oz Cu) with 4 mm2 copper pads and track width 1 mm, length 25 mm..
2. At 3/8 inch (10 mm) lead length from body.
MSC – Lawrence
6 Lake Street, Lawrence,
MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
T4-LDS-0300, Rev. 1 (6/6/13)
©2013 Microsemi Corporation
Page 1 of 5

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1N5955BG equivalent
1N5913BG – 1N5956BG
PACKAGE DIMENSIONS
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for information only.
3. Package contour optional with BD and length BL. Heat slugs, if any,
shall be included within this cylinder length but shall not be subject to
minimum limit of BD.
4. The specified lead diameters apply in the zone between 0.050 inch
(1.27 mm) from the diode body and the end of the lead.
5. In accordance with ASME Y14.5M, diameters are equivalent to Φx
symbology.
DIMENSIONS
Ltr
INCH
MILLIMETERS Notes
Min Max Min Max
BD 0.060 0.085 1.52 2.16
3
BL 0.106 0.160 2.69 4.06
3
LD 0.028 0.032 0.71 0.81
LL 0.800 1.300 20.32 33.02
LU - 0.050 - 1.27 4
T4-LDS-0300, Rev. 1 (6/6/13)
©2013 Microsemi Corporation
Page 5 of 5


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