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PDF TL1WK-WH1L Data sheet ( Hoja de datos )

Número de pieza TL1WK-WH1L
Descripción LED Lamps
Fabricantes Toshiba 
Logotipo Toshiba Logotipo



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No Preview Available ! TL1WK-WH1L Hoja de datos, Descripción, Manual

LED Lamps InGaN and Phosphor
TL1WK-WH1,L
1. Applications
• General Lighting
2. Features
(1) Size: 0.65 (L) mm × 0.65 (W) mm × 0.36 (H) mm
(2) High luminous flux LED: 20.7 lm (typ.) @IF = 60 mA
(3) Color: White (color temperature: 4000 K (typ.))
(4) Operating temperature range: Topr = -40 to 120
(5) Reflow-soldering is available.
3. Packaging and Pin Assignment
4-1K1
TL1WK-WH1,L
1: Anode
2: Cathode
Start of commercial production
2014-06
1 2014-06-19
Rev.1.0

1 page




TL1WK-WH1L pdf
TL1WK-WH1,L
Fig. 7.1 Chromaticity Rank (Note)
Note: Test conditions: IF = 60 mA, Ta = 25 , Tolerance: ±0.01
5 2014-06-19
Rev.1.0

5 Page





TL1WK-WH1L arduino
TL1WK-WH1,L
10. Mounting
10.1. Mounting Precautions
• Do not apply mechanical stress to the resin body at high temperature.
The time taken for a device to return to the room temperature after reflow soldering depends on the
mounting board and environmental conditions.
• The resin body is easily scratched. Avoid friction against hard materials.
• When installing an assembled board into equipment, ensure that the devices on the board do not contact
with other components.
10.2. Soldering
Following show examples of reflow soldering.
• Temperature Profile (see following figures.)
Fig. 10.2.1 Temperature Profile for
Lead(Pb)-free Soldering (example)
Table 10.2.1 Temperature Profile for
Lead(Pb)-free Soldering (example)
• The product is evaluated using above reflow soldering conditions. No additional test is performed exceed
the condition as a evaluation. Please perform reflow soldering under the above conditions.
• Please perform the first reflow soldering with reference to the above temperature profile and within 4
weeks of opening the package.
• If a second reflow process is necessary, reflow soldering should be performed within 168 h of the first
reflow under the above conditions. Storage conditions before the second reflow soldering: 30 , 60 % RH
(max)
• Do not perform wave soldering.
• Do not make soldering corrections manually.
10.3. Land Pattern Dimensions (for reference only)
Fig. 10.3.1 (Unit: mm)
11
2014-06-19
Rev.1.0

11 Page







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